JPS5013633B1 - - Google Patents

Info

Publication number
JPS5013633B1
JPS5013633B1 JP48067663A JP6766373A JPS5013633B1 JP S5013633 B1 JPS5013633 B1 JP S5013633B1 JP 48067663 A JP48067663 A JP 48067663A JP 6766373 A JP6766373 A JP 6766373A JP S5013633 B1 JPS5013633 B1 JP S5013633B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48067663A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5013633B1 publication Critical patent/JPS5013633B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
    • H01L29/0638—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for preventing surface leakage due to surface inversion layer, e.g. with channel stopper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/028—Dicing
JP48067663A 1967-11-04 1973-06-15 Pending JPS5013633B1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL6715013A NL6715013A (ja) 1967-11-04 1967-11-04
NL676715014A NL154061B (nl) 1967-11-04 1967-11-04 Werkwijze voor het vervaardigen van een halfgeleiderinrichting en halfgeleiderinrichting vervaardigd met behulp van de werkwijze.

Publications (1)

Publication Number Publication Date
JPS5013633B1 true JPS5013633B1 (ja) 1975-05-21

Family

ID=26644261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48067663A Pending JPS5013633B1 (ja) 1967-11-04 1973-06-15

Country Status (11)

Country Link
US (2) US3839103A (ja)
JP (1) JPS5013633B1 (ja)
AT (1) AT281122B (ja)
BE (1) BE723340A (ja)
CH (1) CH483725A (ja)
DE (1) DE1805826C3 (ja)
ES (1) ES359847A1 (ja)
FR (1) FR1592176A (ja)
GB (1) GB1243355A (ja)
NL (2) NL6715013A (ja)
SE (1) SE354380B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5261333U (ja) * 1975-10-31 1977-05-06

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4819113B1 (ja) * 1969-08-27 1973-06-11
JPS573225B2 (ja) * 1974-08-19 1982-01-20
CH594989A5 (ja) * 1976-09-03 1978-01-31 Bbc Brown Boveri & Cie
US4076558A (en) * 1977-01-31 1978-02-28 International Business Machines Corporation Method of high current ion implantation and charge reduction by simultaneous kerf implant
US4665420A (en) * 1984-11-08 1987-05-12 Rca Corporation Edge passivated charge-coupled device image sensor
US4835592A (en) * 1986-03-05 1989-05-30 Ixys Corporation Semiconductor wafer with dice having briding metal structure and method of manufacturing same
JP2578600B2 (ja) * 1987-04-28 1997-02-05 オリンパス光学工業株式会社 半導体装置
US5237197A (en) * 1989-06-26 1993-08-17 University Of Hawaii Integrated VLSI radiation/particle detector with biased pin diodes
DE58909785D1 (de) * 1989-11-28 1997-04-10 Siemens Ag Halbleiterscheibe mit dotiertem Ritzrahmen
EP0462315B1 (en) * 1990-06-21 1994-06-01 Mu-Long Chiang A corner protective means for walls, beams, columns etc.
FR2694410B1 (fr) * 1992-07-30 1994-10-28 Sgs Thomson Microelectronics Procédé de test de la résistance par carré de couches diffusées.
DE19539527C2 (de) * 1995-10-24 2001-02-22 August Braun Winkelleiste mit Armierungsmaterial für den Putz auf einer Wärmedämmung
CN110832640B (zh) * 2017-06-27 2023-12-08 株式会社半导体能源研究所 半导体装置、半导体晶片、存储装置及电子设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL282779A (ja) * 1961-09-08
US3197681A (en) * 1961-09-29 1965-07-27 Texas Instruments Inc Semiconductor devices with heavily doped region to prevent surface inversion
NL294370A (ja) * 1963-06-20
GB993388A (en) * 1964-02-05 1965-05-26 Standard Telephones Cables Ltd Improvements in or relating to semiconductor devices
US3395320A (en) * 1965-08-25 1968-07-30 Bell Telephone Labor Inc Isolation technique for integrated circuit structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5261333U (ja) * 1975-10-31 1977-05-06

Also Published As

Publication number Publication date
DE1805826A1 (de) 1969-06-26
DE1805826B2 (de) 1976-04-22
ES359847A1 (es) 1970-10-01
NL6715013A (ja) 1969-05-06
GB1243355A (en) 1971-08-18
US3839103A (en) 1974-10-01
DE1805826C3 (de) 1978-06-01
NL154061B (nl) 1977-07-15
FR1592176A (ja) 1970-05-11
NL6715014A (ja) 1969-05-06
BE723340A (ja) 1969-05-05
AT281122B (de) 1970-05-11
CH483725A (de) 1969-12-31
SE354380B (ja) 1973-03-05
US3772576A (en) 1973-11-13

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