NL6608667A - - Google Patents

Info

Publication number
NL6608667A
NL6608667A NL6608667A NL6608667A NL6608667A NL 6608667 A NL6608667 A NL 6608667A NL 6608667 A NL6608667 A NL 6608667A NL 6608667 A NL6608667 A NL 6608667A NL 6608667 A NL6608667 A NL 6608667A
Authority
NL
Netherlands
Application number
NL6608667A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6608667A publication Critical patent/NL6608667A/xx

Links

Classifications

    • H10P95/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/252—
    • H10W72/5522—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
NL6608667A 1965-06-22 1966-06-22 NL6608667A (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US465943A US3373481A (en) 1965-06-22 1965-06-22 Method of electrically interconnecting conductors

Publications (1)

Publication Number Publication Date
NL6608667A true NL6608667A (cg-RX-API-DMAC10.html) 1966-12-23

Family

ID=23849803

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6608667A NL6608667A (cg-RX-API-DMAC10.html) 1965-06-22 1966-06-22

Country Status (4)

Country Link
US (1) US3373481A (cg-RX-API-DMAC10.html)
DE (1) DE1665648B1 (cg-RX-API-DMAC10.html)
GB (1) GB1109806A (cg-RX-API-DMAC10.html)
NL (1) NL6608667A (cg-RX-API-DMAC10.html)

Families Citing this family (88)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3436818A (en) * 1965-12-13 1969-04-08 Ibm Method of fabricating a bonded joint
US3508209A (en) * 1966-03-31 1970-04-21 Ibm Monolithic integrated memory array structure including fabrication and package therefor
US3447038A (en) * 1966-08-01 1969-05-27 Us Navy Method and apparatus for interconnecting microelectronic circuit wafers
US3470611A (en) * 1967-04-11 1969-10-07 Corning Glass Works Semiconductor device assembly method
US3496419A (en) * 1967-04-25 1970-02-17 J R Andresen Enterprises Inc Printed circuit breadboard
US3484933A (en) * 1967-05-04 1969-12-23 North American Rockwell Face bonding technique
US3539882A (en) * 1967-05-22 1970-11-10 Solitron Devices Flip chip thick film device
US3519896A (en) * 1969-03-11 1970-07-07 Motorola Inc Power transistor assembly
US3803711A (en) * 1971-02-04 1974-04-16 Texas Instruments Inc Electrical contact and method of fabrication
US3706126A (en) * 1971-02-23 1972-12-19 Western Electric Co Fusion bonding
US3921285A (en) * 1974-07-15 1975-11-25 Ibm Method for joining microminiature components to a carrying structure
JPS53149763A (en) * 1977-06-01 1978-12-27 Citizen Watch Co Ltd Mounting method of semiconductor integrate circuit
US4173768A (en) * 1978-01-16 1979-11-06 Rca Corporation Contact for semiconductor devices
US4179802A (en) * 1978-03-27 1979-12-25 International Business Machines Corporation Studded chip attachment process
US4332341A (en) * 1979-12-26 1982-06-01 Bell Telephone Laboratories, Incorporated Fabrication of circuit packages using solid phase solder bonding
US4664309A (en) * 1983-06-30 1987-05-12 Raychem Corporation Chip mounting device
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
US4558812A (en) * 1984-11-07 1985-12-17 At&T Technologies, Inc. Method and apparatus for batch solder bumping of chip carriers
US4581680A (en) * 1984-12-31 1986-04-08 Gte Communication Systems Corporation Chip carrier mounting arrangement
US4661192A (en) * 1985-08-22 1987-04-28 Motorola, Inc. Low cost integrated circuit bonding process
US5476211A (en) * 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US5829128A (en) * 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
WO1988004829A1 (en) * 1986-12-17 1988-06-30 Raychem Corporation Interconnection of electronic components
US5189507A (en) * 1986-12-17 1993-02-23 Raychem Corporation Interconnection of electronic components
US4955523A (en) * 1986-12-17 1990-09-11 Raychem Corporation Interconnection of electronic components
JPS63169793A (ja) * 1987-01-07 1988-07-13 株式会社村田製作所 プリント基板へのチツプ部品の取付構造
US4788767A (en) * 1987-03-11 1988-12-06 International Business Machines Corporation Method for mounting a flexible film semiconductor chip carrier on a circuitized substrate
US5170931A (en) * 1987-03-11 1992-12-15 International Business Machines Corporation Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
US5159535A (en) * 1987-03-11 1992-10-27 International Business Machines Corporation Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
US5054192A (en) * 1987-05-21 1991-10-08 Cray Computer Corporation Lead bonding of chips to circuit boards and circuit boards to circuit boards
US5195237A (en) * 1987-05-21 1993-03-23 Cray Computer Corporation Flying leads for integrated circuits
US5014419A (en) * 1987-05-21 1991-05-14 Cray Computer Corporation Twisted wire jumper electrical interconnector and method of making
US5184400A (en) * 1987-05-21 1993-02-09 Cray Computer Corporation Method for manufacturing a twisted wire jumper electrical interconnector
US5045975A (en) * 1987-05-21 1991-09-03 Cray Computer Corporation Three dimensionally interconnected module assembly
US5112232A (en) * 1987-05-21 1992-05-12 Cray Computer Corporation Twisted wire jumper electrical interconnector
JPS63304636A (ja) * 1987-06-05 1988-12-12 Hitachi Ltd はんだキヤリア及びその製法並びにこれを用いた半導体装置の実装方法
US4831724A (en) * 1987-08-04 1989-05-23 Western Digital Corporation Apparatus and method for aligning surface mountable electronic components on printed circuit board pads
US5014111A (en) * 1987-12-08 1991-05-07 Matsushita Electric Industrial Co., Ltd. Electrical contact bump and a package provided with the same
US5637925A (en) * 1988-02-05 1997-06-10 Raychem Ltd Uses of uniaxially electrically conductive articles
JP2573016B2 (ja) * 1988-02-27 1997-01-16 アンプ インコーポレーテッド マイクロ入出力ピンおよびその製造方法
US4893403A (en) * 1988-04-15 1990-01-16 Hewlett-Packard Company Chip alignment method
DE3824865A1 (de) * 1988-07-21 1990-01-25 Productech Gmbh Herstellen von loetflaechen
JPH0272642A (ja) * 1988-09-07 1990-03-12 Nec Corp 基板の接続構造および接続方法
JP2532615B2 (ja) * 1988-10-20 1996-09-11 松下電器産業株式会社 バンプ形成方法
US5255840A (en) * 1989-12-26 1993-10-26 Praxair Technology, Inc. Fluxless solder coating and joining
US5056216A (en) * 1990-01-26 1991-10-15 Sri International Method of forming a plurality of solder connections
KR920022482A (ko) * 1991-05-09 1992-12-19 가나이 쯔도무 전자부품 탑재모듈
JPH08510358A (ja) * 1993-04-14 1996-10-29 アムコール・エレクトロニクス・インク 集積回路チップと基板との相互接続
US7200930B2 (en) * 1994-11-15 2007-04-10 Formfactor, Inc. Probe for semiconductor devices
US5820014A (en) * 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US7084656B1 (en) 1993-11-16 2006-08-01 Formfactor, Inc. Probe for semiconductor devices
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US20020053734A1 (en) * 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US5455390A (en) * 1994-02-01 1995-10-03 Tessera, Inc. Microelectronics unit mounting with multiple lead bonding
US5798286A (en) 1995-09-22 1998-08-25 Tessera, Inc. Connecting multiple microelectronic elements with lead deformation
US5518964A (en) 1994-07-07 1996-05-21 Tessera, Inc. Microelectronic mounting with multiple lead deformation and bonding
US6361959B1 (en) 1994-07-07 2002-03-26 Tessera, Inc. Microelectronic unit forming methods and materials
US6117694A (en) * 1994-07-07 2000-09-12 Tessera, Inc. Flexible lead structures and methods of making same
US6828668B2 (en) * 1994-07-07 2004-12-07 Tessera, Inc. Flexible lead structures and methods of making same
US6429112B1 (en) 1994-07-07 2002-08-06 Tessera, Inc. Multi-layer substrates and fabrication processes
US5688716A (en) 1994-07-07 1997-11-18 Tessera, Inc. Fan-out semiconductor chip assembly
US5830782A (en) * 1994-07-07 1998-11-03 Tessera, Inc. Microelectronic element bonding with deformation of leads in rows
US6848173B2 (en) * 1994-07-07 2005-02-01 Tessera, Inc. Microelectric packages having deformed bonded leads and methods therefor
AU4160096A (en) * 1994-11-15 1996-06-06 Formfactor, Inc. Probe card assembly and kit, and methods of using same
US5673846A (en) 1995-08-24 1997-10-07 International Business Machines Corporation Solder anchor decal and method
US5994152A (en) * 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5795818A (en) * 1996-12-06 1998-08-18 Amkor Technology, Inc. Integrated circuit chip to substrate interconnection and method
US6133072A (en) 1996-12-13 2000-10-17 Tessera, Inc. Microelectronic connector with planar elastomer sockets
JP3065549B2 (ja) * 1997-01-09 2000-07-17 富士通株式会社 半導体チップ部品の実装方法
DE19823623A1 (de) * 1998-05-27 1999-12-02 Bosch Gmbh Robert Verfahren und Kontaktstelle zur Herstellung einer elektrischen Verbindung
US6325272B1 (en) 1998-10-09 2001-12-04 Robotic Vision Systems, Inc. Apparatus and method for filling a ball grid array
JP4130508B2 (ja) * 1999-01-22 2008-08-06 富士通株式会社 半田接合方法及び電子装置の製造方法
JP2000323534A (ja) * 1999-05-13 2000-11-24 Sony Corp 半導体素子の実装構造及び実装方法
JP3288654B2 (ja) * 1999-07-23 2002-06-04 ヒロセ電機株式会社 電気コネクタの製造方法
EP1275143B1 (en) * 2000-04-20 2007-08-22 Elwyn Paul Michael Wakefield Process for forming electrical/mechanical connections
US6523255B2 (en) * 2001-06-21 2003-02-25 International Business Machines Corporation Process and structure to repair damaged probes mounted on a space transformer
US7138583B2 (en) * 2002-05-08 2006-11-21 Sandisk Corporation Method and apparatus for maintaining a separation between contacts
US9084377B2 (en) * 2007-03-30 2015-07-14 Stats Chippac Ltd. Integrated circuit package system with mounting features for clearance
US20090014852A1 (en) * 2007-07-11 2009-01-15 Hsin-Hui Lee Flip-Chip Packaging with Stud Bumps
RU2371808C1 (ru) * 2008-03-27 2009-10-27 Федеральное государственное унитарное предприятие "НПО "ОРИОН" Способ изготовления индиевых столбиков
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
DE102018215672A1 (de) * 2018-09-14 2020-03-19 Continental Automotive Gmbh Verfahren zur Herstellung einer Leiterplattenanordnung und Leiterplattenanordnung
US20230268312A1 (en) * 2022-02-18 2023-08-24 Bae Systems Information And Electronic Systems Integration Inc. Soft touch eutectic solder pressure pad

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2740193A (en) * 1953-07-01 1956-04-03 Rca Corp Method of soldering printed circuits
BE559732A (cg-RX-API-DMAC10.html) * 1956-10-31 1900-01-01
US3073006A (en) * 1958-09-16 1963-01-15 Westinghouse Electric Corp Method and apparatus for the fabrication of alloyed transistors
FR1217793A (fr) * 1958-12-09 1960-05-05 Perfectionnements à la fabrication des éléments semi-conducteurs
US3075282A (en) * 1959-07-24 1963-01-29 Bell Telephone Labor Inc Semiconductor device contact
NL260810A (cg-RX-API-DMAC10.html) * 1961-02-03
US3271625A (en) * 1962-08-01 1966-09-06 Signetics Corp Electronic package assembly
US3252203A (en) * 1962-10-05 1966-05-24 Trw Inc Welding process
US3292240A (en) * 1963-08-08 1966-12-20 Ibm Method of fabricating microminiature functional components
US3303393A (en) * 1963-12-27 1967-02-07 Ibm Terminals for microminiaturized devices and methods of connecting same to circuit panels
US3286340A (en) * 1964-02-28 1966-11-22 Philco Corp Fabrication of semiconductor units
US3271555A (en) * 1965-03-29 1966-09-06 Int Resistance Co Handling and bonding apparatus

Also Published As

Publication number Publication date
DE1665648B1 (de) 1970-04-02
GB1109806A (en) 1968-04-18
US3373481A (en) 1968-03-19

Similar Documents

Publication Publication Date Title
JPS435493Y1 (cg-RX-API-DMAC10.html)
JPS4328094Y1 (cg-RX-API-DMAC10.html)
JPS424519Y1 (cg-RX-API-DMAC10.html)
BE674174A (cg-RX-API-DMAC10.html)
BE674623A (cg-RX-API-DMAC10.html)
NL6615069A (cg-RX-API-DMAC10.html)
NL6608667A (cg-RX-API-DMAC10.html)
NL6614800A (cg-RX-API-DMAC10.html)
NL6610755A (cg-RX-API-DMAC10.html)
NL6511555A (cg-RX-API-DMAC10.html)
LU51859A1 (cg-RX-API-DMAC10.html)
LU51421A1 (cg-RX-API-DMAC10.html)
BE674684A (cg-RX-API-DMAC10.html)
BE674650A (cg-RX-API-DMAC10.html)
BE674177A (cg-RX-API-DMAC10.html)
BE674154A (cg-RX-API-DMAC10.html)
BE673847A (cg-RX-API-DMAC10.html)
BE673812A (cg-RX-API-DMAC10.html)
BE673753A (cg-RX-API-DMAC10.html)
BE673621A (cg-RX-API-DMAC10.html)
BE673583A (cg-RX-API-DMAC10.html)
BE673317A (cg-RX-API-DMAC10.html)
BE672795A (cg-RX-API-DMAC10.html)
BE672778A (cg-RX-API-DMAC10.html)
BE672770A (cg-RX-API-DMAC10.html)