NL289148A - - Google Patents
Info
- Publication number
- NL289148A NL289148A NL289148DA NL289148A NL 289148 A NL289148 A NL 289148A NL 289148D A NL289148D A NL 289148DA NL 289148 A NL289148 A NL 289148A
- Authority
- NL
- Netherlands
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9265—Special properties
- Y10S428/929—Electrical contact feature
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/939—Molten or fused coating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12528—Semiconductor component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12681—Ga-, In-, Tl- or Group VA metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12896—Ag-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12944—Ni-base component
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Fuses (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES0075279 | 1961-08-12 | ||
| DES0079235 | 1962-04-28 | ||
| DES0079236 | 1962-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL289148A true NL289148A (en:Method) |
Family
ID=27212735
Family Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL291270D NL291270A (en:Method) | 1961-08-12 | ||
| NL280742D NL280742A (en:Method) | 1961-08-12 | ||
| NL135878D NL135878C (en:Method) | 1961-08-12 | ||
| NL289148D NL289148A (en:Method) | 1961-08-12 | ||
| NL63291270A NL141328B (nl) | 1961-08-12 | 1963-04-08 | Halfgeleiderbouwelement, aangebracht in een gasdicht metalen huis. |
Family Applications Before (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL291270D NL291270A (en:Method) | 1961-08-12 | ||
| NL280742D NL280742A (en:Method) | 1961-08-12 | ||
| NL135878D NL135878C (en:Method) | 1961-08-12 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL63291270A NL141328B (nl) | 1961-08-12 | 1963-04-08 | Halfgeleiderbouwelement, aangebracht in een gasdicht metalen huis. |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US3221219A (en:Method) |
| CH (3) | CH395348A (en:Method) |
| DE (3) | DE1170558C2 (en:Method) |
| GB (3) | GB969587A (en:Method) |
| NL (5) | NL141328B (en:Method) |
| SE (1) | SE327239B (en:Method) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH396220A (de) * | 1962-03-30 | 1965-07-31 | Bbc Brown Boveri & Cie | Halbleiteranordnung |
| US3378735A (en) * | 1963-06-12 | 1968-04-16 | Siemens Ag | Semiconductor device housing with spring contact means and improved thermal characteristics |
| DE1231033B (de) * | 1963-09-13 | 1966-12-22 | Siemens Ag | Druckempfindliches Halbleiterbauelement mit drei Zonen abwechselnd entgegengesetztenLeitungstyps und einem Stempel auf einer Zone |
| US3313987A (en) * | 1964-04-22 | 1967-04-11 | Int Rectifier Corp | Compression bonded semiconductor device |
| BE672186A (en:Method) * | 1964-11-12 | |||
| US3337781A (en) * | 1965-06-14 | 1967-08-22 | Westinghouse Electric Corp | Encapsulation means for a semiconductor device |
| NL136731C (en:Method) * | 1965-06-23 | |||
| GB1121717A (en) * | 1966-06-20 | 1968-07-31 | Ass Elect Ind | Improvements in semi-conductor devices |
| DE1564665C3 (de) * | 1966-07-18 | 1975-10-30 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Halbleiterbauelement und Verfahren zu seiner Herstellung |
| US3457472A (en) * | 1966-10-10 | 1969-07-22 | Gen Electric | Semiconductor devices adapted for pressure mounting |
| US3607150A (en) * | 1968-12-30 | 1971-09-21 | Robert P Beekman | Gold-filled metal for jewelry manufacture |
| JPS5030428B1 (en:Method) * | 1969-03-31 | 1975-10-01 | ||
| GB1297046A (en:Method) * | 1969-08-25 | 1972-11-22 | ||
| JPS4944550B1 (en:Method) * | 1970-05-04 | 1974-11-28 | ||
| DE2257078A1 (de) * | 1972-11-21 | 1974-05-30 | Siemens Ag | Halbleiterbauelement mit druckkontakt |
| DE2603813C2 (de) * | 1976-02-02 | 1982-11-18 | Brown, Boveri & Cie Ag, 6800 Mannheim | Spannvorrichtung für ein thermisch und elektrisch druckkontaktiertes Halbleiterbauelement in Scheibenzellenbauweise |
| US4965173A (en) * | 1982-12-08 | 1990-10-23 | International Rectifier Corporation | Metallizing process and structure for semiconductor devices |
| SE8306663L (sv) * | 1982-12-08 | 1984-06-09 | Int Rectifier Corp | Forfarande for framstellning av halvledaranordning |
| BR8500047A (pt) * | 1984-01-09 | 1985-08-13 | Westinghouse Electric Corp | Dispositivo semicondutor de potencia aglutinado por compressao |
| DE3421672A1 (de) * | 1984-06-09 | 1985-12-12 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Wechsellastbestaendiges, schaltbares halbleiterbauelement |
| JPH0642337Y2 (ja) * | 1984-07-05 | 1994-11-02 | 三菱電機株式会社 | 半導体装置 |
| DE3426200C2 (de) * | 1984-07-17 | 1994-02-10 | Asea Brown Boveri | Überbrückungselement |
| US4666796A (en) * | 1984-09-26 | 1987-05-19 | Allied Corporation | Plated parts and their production |
| US4929516A (en) * | 1985-03-14 | 1990-05-29 | Olin Corporation | Semiconductor die attach system |
| US4872047A (en) * | 1986-11-07 | 1989-10-03 | Olin Corporation | Semiconductor die attach system |
| US4978052A (en) * | 1986-11-07 | 1990-12-18 | Olin Corporation | Semiconductor die attach system |
| JPH11307682A (ja) * | 1998-04-23 | 1999-11-05 | Hitachi Ltd | 半導体装置 |
| EP1286393A3 (de) * | 2001-06-28 | 2004-03-03 | F & K Delvotec Bondtechnik GmbH | Schaltkreisgehäuse |
| FR2826830B1 (fr) * | 2001-06-29 | 2003-11-07 | Thales Sa | Assemblage d'une diode et de deux electrodes |
| DE102006014145C5 (de) * | 2006-03-28 | 2015-12-17 | Semikron Elektronik Gmbh & Co. Kg | Druck kontaktierte Anordnung mit einem Leistungsbauelement, einem Metallformkörper und einer Verbindungseinrichtung |
| US20080314893A1 (en) * | 2007-06-25 | 2008-12-25 | Adair Joel E | Heating device with adjusting electrical contact |
| DE102009022659B4 (de) * | 2009-05-26 | 2012-01-19 | Semikron Elektronik Gmbh & Co. Kg | Kontakteinrichtung für ein Leistungshalbleitermodul |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2244771A (en) * | 1938-08-16 | 1941-06-10 | Int Standard Electric Corp | Composite conductor and contact between conductors |
| BE468420A (en:Method) * | 1945-06-21 | |||
| GB614355A (en) * | 1945-07-27 | 1948-12-14 | Western Electric Co | Improvements in electrical translating devices employing contact rectifiers |
| US2762953A (en) * | 1951-05-15 | 1956-09-11 | Sylvania Electric Prod | Contact rectifiers and methods |
| US2817797A (en) * | 1953-11-23 | 1957-12-24 | United Carr Fastener Corp | Rectifier |
| US2712619A (en) * | 1954-06-17 | 1955-07-05 | Westinghouse Air Brake Co | Dry disk rectifier assemblies |
| US2806187A (en) * | 1955-11-08 | 1957-09-10 | Westinghouse Electric Corp | Semiconductor rectifier device |
| US2863105A (en) * | 1955-11-10 | 1958-12-02 | Hoffman Electronics Corp | Rectifying device |
| US2956214A (en) * | 1955-11-30 | 1960-10-11 | Bogue Elec Mfg Co | Diode |
| US2986678A (en) * | 1957-06-20 | 1961-05-30 | Motorola Inc | Semiconductor device |
| CH363417A (de) * | 1957-10-10 | 1962-07-31 | Elektro Werk Muendersbach Gmbh | Selentrockengleichrichter |
| AT207950B (de) * | 1957-11-09 | 1960-03-10 | Bosch Gmbh Robert | Hochleistungsgleichrichter der Großflächenbauart mit einem als Gleichrichterelement dienenden p-n-Halbleiterkristall |
| US2957112A (en) * | 1957-12-09 | 1960-10-18 | Westinghouse Electric Corp | Treatment of tantalum semiconductor electrodes |
| GB859025A (en) * | 1958-08-13 | 1961-01-18 | Gen Electric Co Ltd | Improvements in or relating to electrical devices having hermetically sealed envelopes |
| DE1106872B (de) * | 1958-08-21 | 1961-05-18 | English Elek C Valve Co Ltd | Verfahren zur Herstellung einer Germaniumflaechengleichrichter-einheit |
| US2993153A (en) * | 1958-09-25 | 1961-07-18 | Westinghouse Electric Corp | Seal |
| US3059157A (en) * | 1958-11-14 | 1962-10-16 | Texas Instruments Inc | Semiconductor rectifier |
| DE1098103B (de) * | 1959-01-14 | 1961-01-26 | Standard Elektrik Lorenz Ag | Verfahren zum Einbau eines elektrischen Halbleiterelementes in ein Gehaeuse |
| DE1070302B (en:Method) * | 1959-09-30 | |||
| NL249694A (en:Method) * | 1959-12-30 |
-
0
- NL NL291270D patent/NL291270A/xx unknown
- NL NL280742D patent/NL280742A/xx unknown
- NL NL135878D patent/NL135878C/xx active
- NL NL289148D patent/NL289148A/xx unknown
-
1961
- 1961-08-12 DE DE19611170558 patent/DE1170558C2/de not_active Expired
- 1961-08-13 GB GB31045/61D patent/GB969587A/en not_active Expired
-
1962
- 1962-04-28 DE DE19621248813 patent/DE1248813C2/de not_active Expired
- 1962-04-28 DE DE19621439139 patent/DE1439139B2/de not_active Withdrawn
- 1962-06-19 CH CH734762A patent/CH395348A/de unknown
- 1962-08-10 US US216707A patent/US3221219A/en not_active Expired - Lifetime
-
1963
- 1963-02-07 CH CH153963A patent/CH430881A/de unknown
- 1963-04-08 NL NL63291270A patent/NL141328B/xx unknown
- 1963-04-25 SE SE04567/63A patent/SE327239B/xx unknown
- 1963-04-26 GB GB16615/63A patent/GB1043892A/en not_active Expired
- 1963-04-26 GB GB16614/63A patent/GB1043891A/en not_active Expired
- 1963-04-26 US US276061A patent/US3299328A/en not_active Expired - Lifetime
- 1963-04-29 CH CH535363A patent/CH426016A/de unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE1439139A1 (de) | 1968-12-12 |
| DE1248813B (de) | 1967-08-31 |
| GB969587A (en) | 1964-09-09 |
| US3221219A (en) | 1965-11-30 |
| NL291270A (en:Method) | |
| CH395348A (de) | 1965-07-15 |
| NL280742A (en:Method) | |
| SE327239B (en:Method) | 1970-08-17 |
| DE1248813C2 (de) | 1976-01-08 |
| DE1170558C2 (de) | 1973-10-18 |
| US3299328A (en) | 1967-01-17 |
| DE1170558B (en:Method) | 1973-10-18 |
| NL141328B (nl) | 1974-02-15 |
| CH430881A (de) | 1967-02-28 |
| GB1043892A (en) | 1966-09-28 |
| DE1439139B2 (de) | 1972-02-10 |
| CH426016A (de) | 1966-12-15 |
| NL135878C (en:Method) | |
| GB1043891A (en) | 1966-09-28 |