BR8500047A - Dispositivo semicondutor de potencia aglutinado por compressao - Google Patents

Dispositivo semicondutor de potencia aglutinado por compressao

Info

Publication number
BR8500047A
BR8500047A BR8500047A BR8500047A BR8500047A BR 8500047 A BR8500047 A BR 8500047A BR 8500047 A BR8500047 A BR 8500047A BR 8500047 A BR8500047 A BR 8500047A BR 8500047 A BR8500047 A BR 8500047A
Authority
BR
Brazil
Prior art keywords
agglutinated
semi
compression
power device
conductive power
Prior art date
Application number
BR8500047A
Other languages
English (en)
Inventor
Thomas John Hunt
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of BR8500047A publication Critical patent/BR8500047A/pt

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492Bases or plates or solder therefor
    • H01L23/4924Bases or plates or solder therefor characterised by the materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
BR8500047A 1984-01-09 1985-01-07 Dispositivo semicondutor de potencia aglutinado por compressao BR8500047A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US56907784A 1984-01-09 1984-01-09

Publications (1)

Publication Number Publication Date
BR8500047A true BR8500047A (pt) 1985-08-13

Family

ID=24274012

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8500047A BR8500047A (pt) 1984-01-09 1985-01-07 Dispositivo semicondutor de potencia aglutinado por compressao

Country Status (4)

Country Link
EP (1) EP0152168A3 (pt)
JP (1) JPS60161625A (pt)
BR (1) BR8500047A (pt)
CA (1) CA1218765A (pt)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115020525B (zh) * 2022-07-12 2023-11-07 晶澳(扬州)太阳能科技有限公司 一种背结太阳能电池及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL135878C (pt) * 1961-08-12
JPS552734B2 (pt) * 1972-08-31 1980-01-22
DE2257078A1 (de) * 1972-11-21 1974-05-30 Siemens Ag Halbleiterbauelement mit druckkontakt
JPS5510134A (en) * 1978-07-05 1980-01-24 Arai Pump Mfg Co Ltd Shaft sealing unit
JPS6014507B2 (ja) * 1980-05-26 1985-04-13 三菱電機株式会社 加圧接触形半導体装置

Also Published As

Publication number Publication date
JPS60161625A (ja) 1985-08-23
CA1218765A (en) 1987-03-03
EP0152168A2 (en) 1985-08-21
JPH0247103B2 (pt) 1990-10-18
EP0152168A3 (en) 1987-01-21

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