NL260635A - - Google Patents

Info

Publication number
NL260635A
NL260635A NL260635DA NL260635A NL 260635 A NL260635 A NL 260635A NL 260635D A NL260635D A NL 260635DA NL 260635 A NL260635 A NL 260635A
Authority
NL
Netherlands
Prior art keywords
temperature
minutes
wafer
assemblies
furnace
Prior art date
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL260635A publication Critical patent/NL260635A/xx

Links

Classifications

    • H10P95/00—
    • H10W72/30—
    • H10W72/073—
    • H10W72/07336—
    • H10W90/753—
    • H10W90/754—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
    • Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material

Landscapes

  • Contacts (AREA)
  • Die Bonding (AREA)
NL260635D 1960-04-25 NL260635A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US24465A US3071854A (en) 1960-04-25 1960-04-25 Method of producing a broad area low resistance contact to a silicon semiconductor body

Publications (1)

Publication Number Publication Date
NL260635A true NL260635A (enExample)

Family

ID=21820716

Family Applications (1)

Application Number Title Priority Date Filing Date
NL260635D NL260635A (enExample) 1960-04-25

Country Status (3)

Country Link
US (1) US3071854A (enExample)
GB (1) GB916953A (enExample)
NL (1) NL260635A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3179785A (en) * 1960-09-20 1965-04-20 Hughes Aircraft Co Apparatus for thermo-compression bonding
US3187973A (en) * 1960-11-30 1965-06-08 Trw Semiconductors Inc Fusion apparatus
GB1064290A (en) * 1963-01-14 1967-04-05 Motorola Inc Method of making semiconductor devices
JPS553815B1 (enExample) * 1967-10-02 1980-01-26
US3680196A (en) * 1970-05-08 1972-08-01 Us Navy Process for bonding chip devices to hybrid circuitry
US4576659A (en) * 1982-12-02 1986-03-18 International Business Machines Corporation Process for inhibiting metal migration during heat cycling of multilayer thin metal film structures
GB8323065D0 (en) * 1983-08-26 1983-09-28 Rca Corp Flux free photo-detector soldering
US5906310A (en) * 1994-11-10 1999-05-25 Vlt Corporation Packaging electrical circuits
JP2732823B2 (ja) * 1995-02-02 1998-03-30 ヴィエルティー コーポレーション はんだ付け方法
US6985341B2 (en) * 2001-04-24 2006-01-10 Vlt, Inc. Components having actively controlled circuit elements
US7443229B1 (en) 2001-04-24 2008-10-28 Picor Corporation Active filtering

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE664913C (de) * 1936-07-11 1938-09-07 Askania Werke A G Vormals Cent Verfahren zum Loeten und gleichzeitigen Entlueften von Aneroiddosen
US2763822A (en) * 1955-05-10 1956-09-18 Westinghouse Electric Corp Silicon semiconductor devices
US2863105A (en) * 1955-11-10 1958-12-02 Hoffman Electronics Corp Rectifying device

Also Published As

Publication number Publication date
US3071854A (en) 1963-01-08
GB916953A (en) 1963-01-30

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