JPS553815B1 - - Google Patents

Info

Publication number
JPS553815B1
JPS553815B1 JP6305967A JP6305967A JPS553815B1 JP S553815 B1 JPS553815 B1 JP S553815B1 JP 6305967 A JP6305967 A JP 6305967A JP 6305967 A JP6305967 A JP 6305967A JP S553815 B1 JPS553815 B1 JP S553815B1
Authority
JP
Japan
Prior art keywords
gold
nickel
pellet
welding
preliminarily
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6305967A
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6305967A priority Critical patent/JPS553815B1/ja
Priority to GB45843/68A priority patent/GB1190290A/en
Priority to US763201A priority patent/US3641663A/en
Priority to DE19681800347 priority patent/DE1800347B2/de
Priority to NL6814014A priority patent/NL6814014A/xx
Priority to MY496/73A priority patent/MY7300496A/xx
Publication of JPS553815B1 publication Critical patent/JPS553815B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07355—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H10W72/3524—Eutectic alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
JP6305967A 1967-10-02 1967-10-02 Pending JPS553815B1 (enExample)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP6305967A JPS553815B1 (enExample) 1967-10-02 1967-10-02
GB45843/68A GB1190290A (en) 1967-10-02 1968-09-26 Method of Fitting Semiconductor Pellet on Metal Body
US763201A US3641663A (en) 1967-10-02 1968-09-27 Method for fitting semiconductor pellet on metal body
DE19681800347 DE1800347B2 (de) 1967-10-02 1968-10-01 Verfahren zum herstellen einer halbleiteranordnung
NL6814014A NL6814014A (enExample) 1967-10-02 1968-10-01
MY496/73A MY7300496A (en) 1967-10-02 1973-12-30 Method of fitting semiconductor pellet on metal body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6305967A JPS553815B1 (enExample) 1967-10-02 1967-10-02

Publications (1)

Publication Number Publication Date
JPS553815B1 true JPS553815B1 (enExample) 1980-01-26

Family

ID=13218374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6305967A Pending JPS553815B1 (enExample) 1967-10-02 1967-10-02

Country Status (6)

Country Link
US (1) US3641663A (enExample)
JP (1) JPS553815B1 (enExample)
DE (1) DE1800347B2 (enExample)
GB (1) GB1190290A (enExample)
MY (1) MY7300496A (enExample)
NL (1) NL6814014A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3869787A (en) * 1973-01-02 1975-03-11 Honeywell Inf Systems Method for precisely aligning circuit devices coarsely positioned on a substrate
DE3106376A1 (de) * 1981-02-20 1982-09-09 Siemens AG, 1000 Berlin und 8000 München Halbleiteranordnung mit aus blech ausgeschnittenen anschlussleitern
US4659006A (en) * 1985-09-26 1987-04-21 Rca Corporation Method of bonding a die to a substrate
US5008735A (en) * 1989-12-07 1991-04-16 General Instrument Corporation Packaged diode for high temperature operation
WO1991009699A1 (en) * 1989-12-29 1991-07-11 Williams Advanced Materials Inc. Welding of solder frame to ceramic lid in semi-conductor packaging
US8975176B2 (en) 2013-03-15 2015-03-10 Materion Corporation Gold die bond sheet preform
GB2559146A (en) * 2017-01-26 2018-08-01 Sensata Technologies Inc Integrated circuit wire formed for welding

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3031747A (en) * 1957-12-31 1962-05-01 Tung Sol Electric Inc Method of forming ohmic contact to silicon
NL260635A (enExample) * 1960-04-25
US3307088A (en) * 1962-03-13 1967-02-28 Fujikawa Kyoichi Silver-lead alloy contacts containing dopants for semiconductors
DE1292755B (de) * 1964-03-26 1969-04-17 Siemens Ag Verfahren zum serienmaessigen Sockeln und Gehaeuseeinbau von Halbleiterbauelementen
US3273979A (en) * 1964-07-06 1966-09-20 Rca Corp Semiconductive devices
BE671953A (enExample) * 1964-11-05

Also Published As

Publication number Publication date
MY7300496A (en) 1973-12-31
US3641663A (en) 1972-02-15
DE1800347A1 (de) 1969-06-26
DE1800347B2 (de) 1971-07-29
NL6814014A (enExample) 1969-04-08
GB1190290A (en) 1970-04-29

Similar Documents

Publication Publication Date Title
GB906524A (en) Semiconductor switching devices
SE355436B (enExample)
JPS553815B1 (enExample)
NL7018311A (enExample)
FR2203169B3 (enExample)
GB1198884A (en) Silicon Semiconductor with Metal-Silicide Heterojunction
GB1216593A (en) Semiconductor device with heat dissipation plate.
GB942331A (en) Improvements in or relating to semiconductor devices
GB1529857A (en) Semiconductors
MY7400320A (en) Thermal fatigue-free semiconductor device
GB1076654A (en) Improvements in and relating to methods of applying ohmic contacts to silicon
US3733691A (en) Process for making semiconductor devices
GB1305156A (enExample)
GB942232A (en) Improvements in semi-conductor devices
GB1017423A (en) Improvements in semiconductor devices
GB1275343A (en) Improvements relating to lead frames for use with semiconductor devices
GB1087688A (en) Improved method of semiconductor die soldering
JPS5411690A (en) Semiconductor laser unit
JPS542068A (en) Manufacture for semiconductor device
GB1244867A (en) Semiconductor device
GB1077656A (en) Improvements in or relating to semiconductor devices
JPS5229173A (en) Sealed terminal for cold pressure junction
ES423383A1 (es) Perfeccionamientos en la construccion de diodos de barrera superficial para la conduccion de corrientes de energia re- lativamente alta.
JPS51132969A (en) Semiconductor device
GB903259A (en) A method of applying a contact to a semiconductor device