GB1013666A - Semiconductor device assemblage - Google Patents

Semiconductor device assemblage

Info

Publication number
GB1013666A
GB1013666A GB1660363A GB1660363A GB1013666A GB 1013666 A GB1013666 A GB 1013666A GB 1660363 A GB1660363 A GB 1660363A GB 1660363 A GB1660363 A GB 1660363A GB 1013666 A GB1013666 A GB 1013666A
Authority
GB
United Kingdom
Prior art keywords
die
diodes
solder
semi
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1660363A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Radio Corporation of America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp, Radio Corporation of America filed Critical RCA Corp
Publication of GB1013666A publication Critical patent/GB1013666A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Products (AREA)

Abstract

1,013,666. Semi-conductor devices. RADIO CORPORATION OF AMERICA. April 26, 1963 [May 17, 1962], No. 16603/63. Heading H1K. A semi - conductor die 40 is mounted between the ends of two resilient lead wires 14, 16 which pass through a base member 11 and press on to the sides of the die. The die is surface coated with solder before being wedged between the ends of the leads and the assembly is subsequently heated in a reducing atmosphere to melt the solder and bond the contacts. It is then enclosed in a capsule. The die may be of germanium, silicon, silicon carbide, phosphide, arsenide and antimonide of aluminium, gallium or indium, or sulphide, selenide or tellur- .ide of mercury, zinc or cadmium. The solder used may be of lead and tin and the leads are preferably of iron, nickel or cobalt alloy. The invention may be applied to diodes, variable capacitance diodes, tunnel diodes, PNPN diodes or. multielectrode transistors.
GB1660363A 1962-05-17 1963-04-26 Semiconductor device assemblage Expired GB1013666A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US19554562A 1962-05-17 1962-05-17

Publications (1)

Publication Number Publication Date
GB1013666A true GB1013666A (en) 1965-12-15

Family

ID=22721812

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1660363A Expired GB1013666A (en) 1962-05-17 1963-04-26 Semiconductor device assemblage

Country Status (3)

Country Link
BE (1) BE632510A (en)
GB (1) GB1013666A (en)
NL (1) NL292862A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2150747A (en) * 1983-12-02 1985-07-03 Philips Electronic Associated Pyroelectric infra-red radiation detector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2150747A (en) * 1983-12-02 1985-07-03 Philips Electronic Associated Pyroelectric infra-red radiation detector

Also Published As

Publication number Publication date
NL292862A (en)
BE632510A (en)

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