MY7300496A - Method of fitting semiconductor pellet on metal body - Google Patents

Method of fitting semiconductor pellet on metal body

Info

Publication number
MY7300496A
MY7300496A MY496/73A MY7300496A MY7300496A MY 7300496 A MY7300496 A MY 7300496A MY 496/73 A MY496/73 A MY 496/73A MY 7300496 A MY7300496 A MY 7300496A MY 7300496 A MY7300496 A MY 7300496A
Authority
MY
Malaysia
Prior art keywords
semiconductor pellet
metal body
fitting
gold
pellet
Prior art date
Application number
MY496/73A
Other languages
English (en)
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of MY7300496A publication Critical patent/MY7300496A/xx

Links

Classifications

    • H10W72/30—
    • H10P95/00—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/07355—
    • H10W72/075—
    • H10W72/3524—
    • H10W72/884—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Die Bonding (AREA)
MY496/73A 1967-10-02 1973-12-30 Method of fitting semiconductor pellet on metal body MY7300496A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6305967A JPS553815B1 (enExample) 1967-10-02 1967-10-02

Publications (1)

Publication Number Publication Date
MY7300496A true MY7300496A (en) 1973-12-31

Family

ID=13218374

Family Applications (1)

Application Number Title Priority Date Filing Date
MY496/73A MY7300496A (en) 1967-10-02 1973-12-30 Method of fitting semiconductor pellet on metal body

Country Status (6)

Country Link
US (1) US3641663A (enExample)
JP (1) JPS553815B1 (enExample)
DE (1) DE1800347B2 (enExample)
GB (1) GB1190290A (enExample)
MY (1) MY7300496A (enExample)
NL (1) NL6814014A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3869787A (en) * 1973-01-02 1975-03-11 Honeywell Inf Systems Method for precisely aligning circuit devices coarsely positioned on a substrate
DE3106376A1 (de) * 1981-02-20 1982-09-09 Siemens AG, 1000 Berlin und 8000 München Halbleiteranordnung mit aus blech ausgeschnittenen anschlussleitern
US4659006A (en) * 1985-09-26 1987-04-21 Rca Corporation Method of bonding a die to a substrate
US5008735A (en) * 1989-12-07 1991-04-16 General Instrument Corporation Packaged diode for high temperature operation
WO1991009699A1 (en) * 1989-12-29 1991-07-11 Williams Advanced Materials Inc. Welding of solder frame to ceramic lid in semi-conductor packaging
CN103887183B (zh) * 2012-12-21 2017-09-12 华为技术有限公司 金/硅共晶芯片焊接方法及晶体管
EP2973672B1 (en) * 2013-03-15 2018-07-11 Materion Corporation Method of spot-welding a die bond sheet preform containing gold and tin to a die bond area on a semiconductor package
GB2559146A (en) * 2017-01-26 2018-08-01 Sensata Technologies Inc Integrated circuit wire formed for welding

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3031747A (en) * 1957-12-31 1962-05-01 Tung Sol Electric Inc Method of forming ohmic contact to silicon
NL260635A (enExample) * 1960-04-25
US3307088A (en) * 1962-03-13 1967-02-28 Fujikawa Kyoichi Silver-lead alloy contacts containing dopants for semiconductors
DE1292755B (de) * 1964-03-26 1969-04-17 Siemens Ag Verfahren zum serienmaessigen Sockeln und Gehaeuseeinbau von Halbleiterbauelementen
US3273979A (en) * 1964-07-06 1966-09-20 Rca Corp Semiconductive devices
BE671953A (enExample) * 1964-11-05

Also Published As

Publication number Publication date
DE1800347B2 (de) 1971-07-29
NL6814014A (enExample) 1969-04-08
GB1190290A (en) 1970-04-29
JPS553815B1 (enExample) 1980-01-26
DE1800347A1 (de) 1969-06-26
US3641663A (en) 1972-02-15

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