NL2018244B1 - Endeffektor - Google Patents

Endeffektor Download PDF

Info

Publication number
NL2018244B1
NL2018244B1 NL2018244A NL2018244A NL2018244B1 NL 2018244 B1 NL2018244 B1 NL 2018244B1 NL 2018244 A NL2018244 A NL 2018244A NL 2018244 A NL2018244 A NL 2018244A NL 2018244 B1 NL2018244 B1 NL 2018244B1
Authority
NL
Netherlands
Prior art keywords
end effector
layers
holding
effector according
fluid channel
Prior art date
Application number
NL2018244A
Other languages
English (en)
Dutch (nl)
Inventor
bogner Bernhard
Original Assignee
Suss Microtec Lithography Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suss Microtec Lithography Gmbh filed Critical Suss Microtec Lithography Gmbh
Priority to NL2018244A priority Critical patent/NL2018244B1/en
Priority to DE102018100855.4A priority patent/DE102018100855A1/de
Priority to US15/875,708 priority patent/US10343292B2/en
Priority to TW107102183A priority patent/TWI710437B/zh
Priority to ATA50058/2018A priority patent/AT519588B1/de
Priority to JP2018011616A priority patent/JP7109927B2/ja
Priority to KR1020180009853A priority patent/KR20180088597A/ko
Priority to SG10201800713TA priority patent/SG10201800713TA/en
Priority to CN201810083865.7A priority patent/CN108364896A/zh
Application granted granted Critical
Publication of NL2018244B1 publication Critical patent/NL2018244B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3206—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/288—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyketones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/08—Interconnection of layers by mechanical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/30—End effector
    • Y10S901/40—Vacuum or mangetic

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
NL2018244A 2017-01-27 2017-01-27 Endeffektor NL2018244B1 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
NL2018244A NL2018244B1 (en) 2017-01-27 2017-01-27 Endeffektor
DE102018100855.4A DE102018100855A1 (de) 2017-01-27 2018-01-16 Endeffektor
US15/875,708 US10343292B2 (en) 2017-01-27 2018-01-19 End effector
TW107102183A TWI710437B (zh) 2017-01-27 2018-01-22 末端執行器
ATA50058/2018A AT519588B1 (de) 2017-01-27 2018-01-24 Endeffektor
JP2018011616A JP7109927B2 (ja) 2017-01-27 2018-01-26 エンドエフェクタ
KR1020180009853A KR20180088597A (ko) 2017-01-27 2018-01-26 엔드 이펙터
SG10201800713TA SG10201800713TA (en) 2017-01-27 2018-01-26 End effector
CN201810083865.7A CN108364896A (zh) 2017-01-27 2018-01-29 末端执行器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL2018244A NL2018244B1 (en) 2017-01-27 2017-01-27 Endeffektor

Publications (1)

Publication Number Publication Date
NL2018244B1 true NL2018244B1 (en) 2018-08-07

Family

ID=58606566

Family Applications (1)

Application Number Title Priority Date Filing Date
NL2018244A NL2018244B1 (en) 2017-01-27 2017-01-27 Endeffektor

Country Status (9)

Country Link
US (1) US10343292B2 (https=)
JP (1) JP7109927B2 (https=)
KR (1) KR20180088597A (https=)
CN (1) CN108364896A (https=)
AT (1) AT519588B1 (https=)
DE (1) DE102018100855A1 (https=)
NL (1) NL2018244B1 (https=)
SG (1) SG10201800713TA (https=)
TW (1) TWI710437B (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11688617B2 (en) * 2018-12-11 2023-06-27 Rorze Corporation Electrostatic capacitance sensor
JP7175735B2 (ja) * 2018-12-11 2022-11-21 平田機工株式会社 基板搬送装置
US11574837B2 (en) 2020-06-12 2023-02-07 Taiwan Semiconductor Manufacturing Co., Ltd. Robot blade having multiple sensors for multiple different alignment tasks
FR3112980B1 (fr) * 2020-07-28 2022-07-22 Defitech Caisson d’aspiration pour un préhenseur
USD949219S1 (en) * 2020-08-20 2022-04-19 Grey Orange Pte. Ltd. Spatula gripper
JP7741631B2 (ja) * 2020-12-21 2025-09-18 キヤノン株式会社 搬送ハンド
TWI796709B (zh) * 2021-06-16 2023-03-21 盛詮科技股份有限公司 晶圓懸浮手臂
EP4273911A1 (de) 2022-05-03 2023-11-08 Werner Lieb GmbH Haltevorrichtung und verfahren zum halten und/oder transportieren von werkstücken und/oder bauteilen, optional mit werkzeugfrei auswechselbaren saugerelementen
CN118156204A (zh) * 2022-12-07 2024-06-07 纬创资通(重庆)有限公司 晶圆搬运设备及其吸盘模块
CN115632023B (zh) * 2022-12-22 2023-08-04 河北博特半导体设备科技有限公司 一种双臂晶圆传输装置
TWI814679B (zh) * 2023-02-13 2023-09-01 盛詮科技股份有限公司 載板懸浮手臂
CN116313977A (zh) * 2023-03-21 2023-06-23 上海卡贝尼精密陶瓷有限公司 真空手臂及其制造方法
EP4734153A1 (en) * 2023-06-23 2026-04-29 Semics Inc. Wafer support structure and wafer transfer apparatus having same
KR102849386B1 (ko) * 2023-06-23 2025-08-22 주식회사 쎄믹스 웨이퍼 지지 구조체 및 이를 구비한 웨이퍼 이송 장치
EP4636483A3 (en) * 2025-08-22 2026-04-22 ASML Netherlands B.V. Suction clamp for clamping a substrate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5556147A (en) * 1993-07-15 1996-09-17 Applied Materials, Inc. Wafer tray and ceramic blade for semiconductor processing apparatus
JP2004186355A (ja) * 2002-12-03 2004-07-02 Nikon Corp 吸着保持部材及び吸着保持装置
JP2011110682A (ja) * 2009-11-30 2011-06-09 Jx Nippon Oil & Energy Corp ロボットハンド及びその製造方法
US20150086316A1 (en) * 2013-09-26 2015-03-26 Applied Materials, Inc. Pneumatic end effector apparatus, substrate transportation systems, and methods for transporting substrates

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4620738A (en) * 1985-08-19 1986-11-04 Varian Associates, Inc. Vacuum pick for semiconductor wafers
US5226636A (en) * 1992-06-10 1993-07-13 International Business Machines Corporation Holding fixture for substrates
JPH09139413A (ja) * 1995-11-14 1997-05-27 Du Pont Kk 基板搬送部品および基板搬送装置
JPH11354607A (ja) * 1998-06-10 1999-12-24 Mitsubishi Chemical Corp 搬送装置用ハンド
US6244641B1 (en) * 1999-12-02 2001-06-12 M.E.C. Technology, Inc. Wafer transfer arm
JP2003168718A (ja) * 2001-11-30 2003-06-13 Murata Mach Ltd 枚葉移載装置
KR100989012B1 (ko) * 2002-07-29 2010-10-20 신닛뽄 세끼유 가부시끼가이샤 반사 표면을 갖는 탄소섬유 복합물 전달 부재
US6942265B1 (en) * 2002-10-23 2005-09-13 Kla-Tencor Technologies Corporation Apparatus comprising a flexible vacuum seal pad structure capable of retaining non-planar substrates thereto
US20050110292A1 (en) * 2002-11-26 2005-05-26 Axcelis Technologies, Inc. Ceramic end effector for micro circuit manufacturing
US7055875B2 (en) * 2003-07-11 2006-06-06 Asyst Technologies, Inc. Ultra low contact area end effector
DE102006031434B4 (de) * 2006-07-07 2019-11-14 Erich Thallner Handhabungsvorrichtung sowie Handhabungsverfahren für Wafer
US20080247857A1 (en) * 2007-04-05 2008-10-09 Ichiro Yuasa End effector and robot for transporting substrate
JP2009285823A (ja) * 2008-05-28 2009-12-10 Meian Kokusai Gigyo Kofun Yugenkoshi ロボットアーム、並びに、その保持手段の構成材及び該構成材の製造方法
MY181832A (en) * 2011-08-24 2021-01-08 Harmotec Co Ltd Non-contacting conveyance equipment
JP2013078810A (ja) * 2011-10-03 2013-05-02 Smc Corp 真空吸着装置
US20150290815A1 (en) * 2014-04-11 2015-10-15 Varian Semiconductor Equipment Associates, Inc. Planar end effector and method of making a planar end effector
US9415519B2 (en) * 2014-07-01 2016-08-16 Varian Semiconductor Equipment Associates, Inc. Composite end effector and method of making a composite end effector
US20160254176A1 (en) * 2015-02-27 2016-09-01 AZSimilate, LLC Positive Pressure Bernoulli Wand with Coiled Path

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5556147A (en) * 1993-07-15 1996-09-17 Applied Materials, Inc. Wafer tray and ceramic blade for semiconductor processing apparatus
JP2004186355A (ja) * 2002-12-03 2004-07-02 Nikon Corp 吸着保持部材及び吸着保持装置
JP2011110682A (ja) * 2009-11-30 2011-06-09 Jx Nippon Oil & Energy Corp ロボットハンド及びその製造方法
US20150086316A1 (en) * 2013-09-26 2015-03-26 Applied Materials, Inc. Pneumatic end effector apparatus, substrate transportation systems, and methods for transporting substrates

Also Published As

Publication number Publication date
US10343292B2 (en) 2019-07-09
TWI710437B (zh) 2020-11-21
JP7109927B2 (ja) 2022-08-01
AT519588A3 (de) 2020-02-15
AT519588A2 (de) 2018-08-15
AT519588B1 (de) 2021-10-15
JP2018174302A (ja) 2018-11-08
DE102018100855A1 (de) 2018-08-02
SG10201800713TA (en) 2018-08-30
CN108364896A (zh) 2018-08-03
TW201829140A (zh) 2018-08-16
US20180215048A1 (en) 2018-08-02
KR20180088597A (ko) 2018-08-06

Similar Documents

Publication Publication Date Title
NL2018244B1 (en) Endeffektor
US11420337B2 (en) Transport apparatus
NL2018243B1 (en) Suction apparatus for an end effector, end effector for holding substrates and method of producing an end effector
TW202013591A (zh) 銷舉升裝置
US20160016318A1 (en) Suction device
KR20130120857A (ko) 기판 이송 로봇 및 이를 이용한 멀티 챔버 기판 처리 장치와 그 제어 방법
JP6106176B2 (ja) ロードステーション
JP6310705B2 (ja) 基板保持装置および成膜装置
EP3687693B1 (en) Test tube vacuum retainer
CN109563609A (zh) 用于在真空腔室中处理基板的设备与系统和在真空腔室中运输载体的方法
TWI850456B (zh) 吸引保持具以及環狀框架之保持機構
KR101553826B1 (ko) 이송장치 및 이를 이용한 웨이퍼 이송방법
CN102246266B (zh) 常温接合装置
KR20190001227A (ko) 반도체 웨이퍼의 정밀이송을 위한 경량 진공척
US9550296B2 (en) Conveying apparatus and conveying system with cant surfaces
JP7641187B2 (ja) ワーク搬送用ハンド
KR101571812B1 (ko) 기판 디척킹 장치 및 기판 디척킹 방법, 이를 이용한 기판 처리 장치 및 기판 처리 방법
JP2014162571A (ja) ワーク搬送システム，ワーク受渡システム，ワーク収納システム，ワーク貼合システム，ワーク搬送方法，ワーク受渡方法，ワーク収納方法及びワーク貼合方法
KR101571808B1 (ko) 기판 처리 장치, 기판 부착 장치 및 기판 처리 장치의 제어 방법