NL2013210A - Metrology method and apparatus, lithographic system and device manufacturing method. - Google Patents
Metrology method and apparatus, lithographic system and device manufacturing method. Download PDFInfo
- Publication number
- NL2013210A NL2013210A NL2013210A NL2013210A NL2013210A NL 2013210 A NL2013210 A NL 2013210A NL 2013210 A NL2013210 A NL 2013210A NL 2013210 A NL2013210 A NL 2013210A NL 2013210 A NL2013210 A NL 2013210A
- Authority
- NL
- Netherlands
- Prior art keywords
- overlay
- asymmetry
- target
- substrate
- grating
- Prior art date
Links
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/72—Repair or correction of mask defects
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/706835—Metrology information management or control
- G03F7/706839—Modelling, e.g. modelling scattering or solving inverse problems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/706843—Metrology apparatus
-
- H10P74/203—
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- H10P74/27—
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- H10P76/2041—
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361863150P | 2013-08-07 | 2013-08-07 | |
| US201361863150 | 2013-08-07 | ||
| US201461975312P | 2014-04-04 | 2014-04-04 | |
| US201461975312 | 2014-04-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL2013210A true NL2013210A (en) | 2015-02-10 |
Family
ID=51211228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL2013210A NL2013210A (en) | 2013-08-07 | 2014-07-18 | Metrology method and apparatus, lithographic system and device manufacturing method. |
Country Status (8)
| Country | Link |
|---|---|
| US (4) | US9910366B2 (enExample) |
| JP (2) | JP6336068B2 (enExample) |
| KR (2) | KR102124204B1 (enExample) |
| CN (2) | CN105452962B (enExample) |
| IL (1) | IL243854B (enExample) |
| NL (1) | NL2013210A (enExample) |
| TW (3) | TWI600981B (enExample) |
| WO (1) | WO2015018625A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111095112A (zh) * | 2017-09-11 | 2020-05-01 | Asml荷兰有限公司 | 光刻过程中的量测 |
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| WO2016124393A1 (en) | 2015-02-04 | 2016-08-11 | Asml Netherlands B.V. | Metrology method and apparatus, computer program and lithographic system |
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| WO2013143814A1 (en) | 2012-03-27 | 2013-10-03 | Asml Netherlands B.V. | Metrology method and apparatus, lithographic system and device manufacturing method |
| KR101967723B1 (ko) * | 2012-07-05 | 2019-04-10 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피를 위한 계측법 |
| WO2015018625A1 (en) | 2013-08-07 | 2015-02-12 | Asml Netherlands B.V. | Metrology method and apparatus, lithographic system and device manufacturing method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111095112A (zh) * | 2017-09-11 | 2020-05-01 | Asml荷兰有限公司 | 光刻过程中的量测 |
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| KR101855243B1 (ko) | 2018-05-04 |
| TW201704898A (zh) | 2017-02-01 |
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| US10126662B2 (en) | 2018-11-13 |
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| IL243854A0 (en) | 2016-04-21 |
| IL243854B (en) | 2021-01-31 |
| JP6336068B2 (ja) | 2018-06-06 |
| US20190278190A1 (en) | 2019-09-12 |
| CN108398856A (zh) | 2018-08-14 |
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| US10331041B2 (en) | 2019-06-25 |
| JP2016528549A (ja) | 2016-09-15 |
| US20180196357A1 (en) | 2018-07-12 |
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