IL243854B - Metrological method and standard, lithographic system and method for making the standard - Google Patents
Metrological method and standard, lithographic system and method for making the standardInfo
- Publication number
- IL243854B IL243854B IL243854A IL24385416A IL243854B IL 243854 B IL243854 B IL 243854B IL 243854 A IL243854 A IL 243854A IL 24385416 A IL24385416 A IL 24385416A IL 243854 B IL243854 B IL 243854B
- Authority
- IL
- Israel
- Prior art keywords
- device manufacturing
- lithographic system
- metrology
- metrology method
- lithographic
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/72—Repair or correction of mask defects
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/706835—Metrology information management or control
- G03F7/706839—Modelling, e.g. modelling scattering or solving inverse problems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/706843—Metrology apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361863150P | 2013-08-07 | 2013-08-07 | |
| US201461975312P | 2014-04-04 | 2014-04-04 | |
| PCT/EP2014/065461 WO2015018625A1 (en) | 2013-08-07 | 2014-07-18 | Metrology method and apparatus, lithographic system and device manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL243854A0 IL243854A0 (en) | 2016-04-21 |
| IL243854B true IL243854B (en) | 2021-01-31 |
Family
ID=51211228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL243854A IL243854B (en) | 2013-08-07 | 2016-01-31 | Metrological method and standard, lithographic system and method for making the standard |
Country Status (8)
| Country | Link |
|---|---|
| US (4) | US9910366B2 (enExample) |
| JP (2) | JP6336068B2 (enExample) |
| KR (2) | KR101855243B1 (enExample) |
| CN (2) | CN108398856B (enExample) |
| IL (1) | IL243854B (enExample) |
| NL (1) | NL2013210A (enExample) |
| TW (3) | TWI636341B (enExample) |
| WO (1) | WO2015018625A1 (enExample) |
Families Citing this family (82)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9927718B2 (en) * | 2010-08-03 | 2018-03-27 | Kla-Tencor Corporation | Multi-layer overlay metrology target and complimentary overlay metrology measurement systems |
| US10890436B2 (en) | 2011-07-19 | 2021-01-12 | Kla Corporation | Overlay targets with orthogonal underlayer dummyfill |
| NL2011477A (en) * | 2012-10-10 | 2014-04-14 | Asml Netherlands Bv | Mark position measuring apparatus and method, lithographic apparatus and device manufacturing method. |
| WO2014062972A1 (en) * | 2012-10-18 | 2014-04-24 | Kla-Tencor Corporation | Symmetric target design in scatterometry overlay metrology |
| KR101855243B1 (ko) | 2013-08-07 | 2018-05-04 | 에이에스엠엘 네델란즈 비.브이. | 메트롤로지 방법 및 장치, 리소그래피 시스템 및 디바이스 제조 방법 |
| CN112698551B (zh) * | 2014-11-25 | 2024-04-23 | 科磊股份有限公司 | 分析及利用景观 |
| KR102294349B1 (ko) | 2014-11-26 | 2021-08-26 | 에이에스엠엘 네델란즈 비.브이. | 계측 방법, 컴퓨터 제품 및 시스템 |
| JP6510658B2 (ja) | 2015-02-04 | 2019-05-08 | エーエスエムエル ネザーランズ ビー．ブイ． | メトロロジの方法及び装置、コンピュータプログラム、並びにリソグラフィシステム |
| WO2016162228A1 (en) | 2015-04-10 | 2016-10-13 | Asml Netherlands B.V. | Method and apparatus for inspection and metrology |
| JP6524256B2 (ja) | 2015-04-21 | 2019-06-05 | エーエスエムエル ネザーランズ ビー．ブイ． | メトロロジ方法及び装置、コンピュータプログラム、並びにリソグラフィシステム |
| TWI656409B (zh) * | 2015-09-09 | 2019-04-11 | 美商克萊譚克公司 | 基於輔助電磁場之引入之一階散射測量疊加之新方法 |
| KR102351636B1 (ko) * | 2015-09-21 | 2022-01-13 | 케이엘에이 코포레이션 | 유연적 샘플링을 이용한 공정 제어 방법 및 시스템 |
| WO2017108453A1 (en) | 2015-12-24 | 2017-06-29 | Asml Netherlands B.V. | Methods of controlling a patterning process, device manufacturing method, control system for a lithographic apparatus and lithographic apparatus |
| WO2017140528A1 (en) | 2016-02-19 | 2017-08-24 | Asml Netherlands B.V. | Method of measuring a structure, inspection apparatus, lithographic system, device manufacturing method and wavelength-selective filter for use therein |
| CN108700829B (zh) * | 2016-02-26 | 2021-05-18 | Asml荷兰有限公司 | 测量结构的方法、检查设备、光刻系统、器件制造方法 |
| US10615084B2 (en) * | 2016-03-01 | 2020-04-07 | Asml Netherlands B.V. | Method and apparatus to determine a patterning process parameter, associated with a change in a physical configuration, using measured pixel optical characteristic values |
| IL262114B2 (en) * | 2016-04-22 | 2023-04-01 | Asml Netherlands Bv | Determining the stack difference and correcting with the help of the stack difference |
| US10115621B2 (en) | 2016-05-13 | 2018-10-30 | Globalfoundries Inc. | Method for in-die overlay control using FEOL dummy fill layer |
| CN109313392B (zh) * | 2016-06-10 | 2021-01-08 | Imec 非营利协会 | 用于半导体制造工艺的计量方法和装置 |
| IL263765B2 (en) | 2016-07-15 | 2023-04-01 | Asml Netherlands Bv | Method and device for designing a target field for metrology |
| US10048132B2 (en) | 2016-07-28 | 2018-08-14 | Kla-Tencor Corporation | Simultaneous capturing of overlay signals from multiple targets |
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| WO2018087207A1 (en) * | 2016-11-10 | 2018-05-17 | Asml Netherlands B.V. | Design and correction using stack difference |
| EP3333631A1 (en) | 2016-12-06 | 2018-06-13 | ASML Netherlands B.V. | Method of measuring a target, metrology apparatus, polarizer assembly |
| EP3333632A1 (en) | 2016-12-08 | 2018-06-13 | ASML Netherlands B.V. | Metrology apparatus |
| US10983005B2 (en) | 2016-12-15 | 2021-04-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Spectroscopic overlay metrology |
| EP3336607A1 (en) | 2016-12-16 | 2018-06-20 | ASML Netherlands B.V. | Method of measuring a property of a substrate, inspection apparatus, lithographic system and device manufacturing method |
| EP3358413A1 (en) * | 2017-02-02 | 2018-08-08 | ASML Netherlands B.V. | Metrology method, apparatus and computer program |
| US10656535B2 (en) * | 2017-03-31 | 2020-05-19 | Imec Vzw | Metrology method for a semiconductor manufacturing process |
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| EP3399371A1 (en) * | 2017-05-05 | 2018-11-07 | ASML Netherlands B.V. | Method of measuring a parameter of interest, device manufacturing method, metrology apparatus, and lithographic system |
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| EP3454126A1 (en) | 2017-09-08 | 2019-03-13 | ASML Netherlands B.V. | Method for estimating overlay |
| JP6979529B2 (ja) * | 2017-09-11 | 2021-12-15 | エーエスエムエル ネザーランズ ビー．ブイ． | リソグラフィプロセスにおける計測 |
| EP3462239A1 (en) * | 2017-09-27 | 2019-04-03 | ASML Netherlands B.V. | Metrology in lithographic processes |
| EP3457211A1 (en) * | 2017-09-13 | 2019-03-20 | ASML Netherlands B.V. | A method of aligning a pair of complementary diffraction patterns and associated metrology method and apparatus |
| WO2019057578A1 (en) | 2017-09-22 | 2019-03-28 | Asml Netherlands B.V. | METHOD FOR DETERMINING A PARAMETER OF PATTERN CREATION PROCESS |
| EP3460574A1 (en) | 2017-09-22 | 2019-03-27 | ASML Netherlands B.V. | Method to determine a patterning process parameter |
| US10795268B2 (en) | 2017-09-29 | 2020-10-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for measuring overlay errors using overlay measurement patterns |
| CN111279268B (zh) * | 2017-10-26 | 2022-04-01 | Asml荷兰有限公司 | 确定所关注的参数的值的方法、清除包含关于所关注的参数的信息的信号的方法 |
| EP3492985A1 (en) | 2017-12-04 | 2019-06-05 | ASML Netherlands B.V. | Method of determining information about a patterning process, method of reducing error in measurement data, method of calibrating a metrology process, method of selecting metrology targets |
| US10705435B2 (en) | 2018-01-12 | 2020-07-07 | Globalfoundries Inc. | Self-referencing and self-calibrating interference pattern overlay measurement |
| EP3518040A1 (en) | 2018-01-30 | 2019-07-31 | ASML Netherlands B.V. | A measurement apparatus and a method for determining a substrate grid |
| JP7227988B2 (ja) * | 2018-02-27 | 2023-02-22 | エーエスエムエル ネザーランズ ビー．ブイ． | 基板上の１つ又は複数の構造の特性を算出するメトロロジ装置及び方法 |
| NL2021848A (en) | 2018-04-09 | 2018-11-06 | Stichting Vu | Holographic metrology apparatus. |
| EP3557327A1 (en) * | 2018-04-18 | 2019-10-23 | ASML Netherlands B.V. | Method of determining a value of a parameter of interest of a target formed by a patterning process |
| WO2019233738A1 (en) | 2018-06-08 | 2019-12-12 | Asml Netherlands B.V. | Metrology apparatus and method for determining a characteristic of one or more structures on a substrate |
| EP3579052A1 (en) | 2018-06-08 | 2019-12-11 | ASML Netherlands B.V. | Metrology apparatus and method for determining a characteristic of one or more structures on a substrate |
| NL2021852A (en) | 2018-08-01 | 2018-11-09 | Asml Netherlands Bv | Metrology apparatus and method for determining a characteristic of one or more structures on a substrate |
| EP3605230A1 (en) | 2018-08-01 | 2020-02-05 | Stichting VU | Metrology apparatus and method for determining a characteristic of one or more structures on a substrate |
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| EP3770682A1 (en) | 2019-07-25 | 2021-01-27 | ASML Netherlands B.V. | Method and system for determining information about a target structure |
| US12209994B2 (en) | 2019-08-14 | 2025-01-28 | Asml Netherlands B.V. | Method and metrology tool for determining information about a target structure, and cantilever probe |
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| EP3839635A1 (en) | 2019-12-17 | 2021-06-23 | ASML Netherlands B.V. | Dark field digital holographic microscope and associated metrology method |
| EP3876036A1 (en) | 2020-03-04 | 2021-09-08 | ASML Netherlands B.V. | Vibration isolation system and associated applications in lithography |
| JP7468630B2 (ja) * | 2020-04-13 | 2024-04-16 | 株式会社ニコン | 計測装置、露光装置、および計測方法 |
| US12429781B2 (en) | 2020-06-24 | 2025-09-30 | Asml Netherlands B.V. | Metrology method and associated metrology and lithographic apparatuses |
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| EP3964892A1 (en) | 2020-09-02 | 2022-03-09 | Stichting VU | Illumination arrangement and associated dark field digital holographic microscope |
| WO2022113338A1 (ja) * | 2020-11-30 | 2022-06-02 | 日本電気株式会社 | 情報処理装置、情報処理方法、及び、記録媒体 |
| EP4224254A1 (en) | 2022-02-04 | 2023-08-09 | ASML Netherlands B.V. | Metrology method and associated metrology device |
| EP4246231A1 (en) | 2022-03-18 | 2023-09-20 | Stichting VU | A method for determining a vertical position of a structure on a substrate and associated apparatuses |
| WO2023174648A1 (en) | 2022-03-18 | 2023-09-21 | Stichting Vu | Illumination arrangement for a metrology device and associated method |
| EP4246232A1 (en) | 2022-03-18 | 2023-09-20 | Stichting VU | Illumination arrangement for a metrology device and associated method |
| CN114678282B (zh) * | 2022-05-27 | 2022-08-02 | 湖北三维半导体集成创新中心有限责任公司 | 一种键合补偿方法及装置、芯片再布线方法、键合结构 |
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| EP4332678A1 (en) | 2022-09-05 | 2024-03-06 | ASML Netherlands B.V. | Holographic metrology apparatus and method |
| WO2025131523A1 (en) | 2023-12-21 | 2025-06-26 | Asml Netherlands B.V. | Metrology method for a digital holographic microscope and associated computer program |
| WO2025203521A1 (ja) * | 2024-03-28 | 2025-10-02 | 株式会社ニコン | マーク計測方法、計測装置、露光装置、演算装置、プログラム及び記憶媒体 |
| WO2025233088A1 (en) | 2024-05-08 | 2025-11-13 | Asml Netherlands B.V. | Semiconductor bonding alignment systems and methods |
| CN118299285B (zh) * | 2024-06-06 | 2024-08-16 | 华芯程(杭州)科技有限公司 | 多重图形蚀刻补偿方法、装置、介质、程序产品及终端 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7170604B2 (en) * | 2002-07-03 | 2007-01-30 | Tokyo Electron Limited | Overlay metrology method and apparatus using more than one grating per measurement direction |
| US7791727B2 (en) * | 2004-08-16 | 2010-09-07 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
| US7408642B1 (en) * | 2006-02-17 | 2008-08-05 | Kla-Tencor Technologies Corporation | Registration target design for managing both reticle grid error and wafer overlay |
| US7704850B2 (en) * | 2006-09-08 | 2010-04-27 | Asml Netherlands B.V. | Semiconductor device for measuring an overlay error, method for measuring an overlay error, lithographic apparatus and device manufacturing method |
| NL1036245A1 (nl) | 2007-12-17 | 2009-06-18 | Asml Netherlands Bv | Diffraction based overlay metrology tool and method of diffraction based overlay metrology. |
| NL1036597A1 (nl) | 2008-02-29 | 2009-09-01 | Asml Netherlands Bv | Metrology method and apparatus, lithographic apparatus, and device manufacturing method. |
| US8665417B2 (en) | 2008-06-11 | 2014-03-04 | Asml Netherlands B.V. | Apparatus and method for inspecting a substrate |
| NL2005162A (en) | 2009-07-31 | 2011-02-02 | Asml Netherlands Bv | Methods and scatterometers, lithographic systems, and lithographic processing cells. |
| US8189202B2 (en) | 2009-08-04 | 2012-05-29 | Zygo Corporation | Interferometer for determining overlay errors |
| CN102483582B (zh) * | 2009-08-24 | 2016-01-20 | Asml荷兰有限公司 | 量测方法和设备、光刻设备、光刻处理单元和包括量测目标的衬底 |
| DE202009012606U1 (de) | 2009-09-18 | 2010-01-14 | Sma Solar Technology Ag | Steckbare elektrische Verbindung zwischen zwei Bauteile aufweisenden Gehäusen |
| JP6008851B2 (ja) * | 2010-07-19 | 2016-10-19 | エーエスエムエル ネザーランズ ビー．ブイ． | オーバレイ誤差を決定する方法及び装置 |
| CN103201682B (zh) * | 2010-11-12 | 2015-06-17 | Asml荷兰有限公司 | 量测方法和设备、光刻系统和器件制造方法 |
| IL217843A (en) * | 2011-02-11 | 2016-11-30 | Asml Netherlands Bv | A system and method for testing, a lithographic system, a cell for lithographic processing, and a method for producing a device |
| NL2009294A (en) | 2011-08-30 | 2013-03-04 | Asml Netherlands Bv | Method and apparatus for determining an overlay error. |
| NL2009508A (en) | 2011-10-24 | 2013-04-25 | Asml Netherlands Bv | Metrology method and apparatus, and device manufacturing method. |
| US10107621B2 (en) * | 2012-02-15 | 2018-10-23 | Nanometrics Incorporated | Image based overlay measurement with finite gratings |
| NL2010401A (en) | 2012-03-27 | 2013-09-30 | Asml Netherlands Bv | Metrology method and apparatus, lithographic system and device manufacturing method. |
| JP6133980B2 (ja) | 2012-07-05 | 2017-05-24 | エーエスエムエル ネザーランズ ビー．ブイ． | リソグラフィのためのメトロロジ |
| KR101855243B1 (ko) | 2013-08-07 | 2018-05-04 | 에이에스엠엘 네델란즈 비.브이. | 메트롤로지 방법 및 장치, 리소그래피 시스템 및 디바이스 제조 방법 |
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2014
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- 2014-07-18 NL NL2013210A patent/NL2013210A/en not_active Application Discontinuation
- 2014-07-18 WO PCT/EP2014/065461 patent/WO2015018625A1/en not_active Ceased
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- 2014-07-18 KR KR1020187012297A patent/KR102124204B1/ko active Active
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| TW201809902A (zh) | 2018-03-16 |
| NL2013210A (en) | 2015-02-10 |
| CN108398856A (zh) | 2018-08-14 |
| TW201704898A (zh) | 2017-02-01 |
| KR20180049220A (ko) | 2018-05-10 |
| CN108398856B (zh) | 2020-10-16 |
| JP6577086B2 (ja) | 2019-09-18 |
| WO2015018625A1 (en) | 2015-02-12 |
| KR101855243B1 (ko) | 2018-05-04 |
| US10725386B2 (en) | 2020-07-28 |
| CN105452962B (zh) | 2018-02-09 |
| JP2018142006A (ja) | 2018-09-13 |
| US10331041B2 (en) | 2019-06-25 |
| TWI600981B (zh) | 2017-10-01 |
| KR102124204B1 (ko) | 2020-06-18 |
| TWI636341B (zh) | 2018-09-21 |
| US20190278190A1 (en) | 2019-09-12 |
| JP2016528549A (ja) | 2016-09-15 |
| JP6336068B2 (ja) | 2018-06-06 |
| IL243854A0 (en) | 2016-04-21 |
| US10126662B2 (en) | 2018-11-13 |
| TW201506554A (zh) | 2015-02-16 |
| KR20160042008A (ko) | 2016-04-18 |
| US20180196357A1 (en) | 2018-07-12 |
| CN105452962A (zh) | 2016-03-30 |
| US9910366B2 (en) | 2018-03-06 |
| TWI563345B (en) | 2016-12-21 |
| US20160161864A1 (en) | 2016-06-09 |
| US20190049860A1 (en) | 2019-02-14 |
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