NL2007885C2 - Detector array with a through-via interposer. - Google Patents

Detector array with a through-via interposer. Download PDF

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Publication number
NL2007885C2
NL2007885C2 NL2007885A NL2007885A NL2007885C2 NL 2007885 C2 NL2007885 C2 NL 2007885C2 NL 2007885 A NL2007885 A NL 2007885A NL 2007885 A NL2007885 A NL 2007885A NL 2007885 C2 NL2007885 C2 NL 2007885C2
Authority
NL
Netherlands
Prior art keywords
sensor
integrated circuit
sensor element
interposer
detector array
Prior art date
Application number
NL2007885A
Other languages
English (en)
Dutch (nl)
Other versions
NL2007885A (en
Inventor
John Eric Tkaczyk
Jonathan David Short
Charles Gerard Woychik
James Wilson Rose
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of NL2007885A publication Critical patent/NL2007885A/en
Application granted granted Critical
Publication of NL2007885C2 publication Critical patent/NL2007885C2/en

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
    • H10F30/301—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices being sensitive to very short wavelength, e.g. being sensitive to X-rays, gamma-rays or corpuscular radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/24—Measuring radiation intensity with semiconductor detectors
    • G01T1/243—Modular detectors, e.g. arrays formed from self contained units
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/189—X-ray, gamma-ray or corpuscular radiation imagers
    • H10F39/1895—X-ray, gamma-ray or corpuscular radiation imagers of the hybrid type
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
    • A61B6/42—Arrangements for detecting radiation specially adapted for radiation diagnosis
    • A61B6/4208—Arrangements for detecting radiation specially adapted for radiation diagnosis characterised by using a particular type of detector
    • A61B6/4233—Arrangements for detecting radiation specially adapted for radiation diagnosis characterised by using a particular type of detector using matrix detectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Molecular Biology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Measurement Of Radiation (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Apparatus For Radiation Diagnosis (AREA)
NL2007885A 2010-11-30 2011-11-29 Detector array with a through-via interposer. NL2007885C2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/956,139 US8575558B2 (en) 2010-11-30 2010-11-30 Detector array with a through-via interposer
US95613910 2010-11-30

Publications (2)

Publication Number Publication Date
NL2007885A NL2007885A (en) 2012-05-31
NL2007885C2 true NL2007885C2 (en) 2013-11-20

Family

ID=45841571

Family Applications (1)

Application Number Title Priority Date Filing Date
NL2007885A NL2007885C2 (en) 2010-11-30 2011-11-29 Detector array with a through-via interposer.

Country Status (3)

Country Link
US (1) US8575558B2 (enExample)
JP (1) JP6039179B2 (enExample)
NL (1) NL2007885C2 (enExample)

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JP6169922B2 (ja) * 2012-08-29 2017-07-26 東芝メディカルシステムズ株式会社 Ｘ線検出サブモジュール、ｘ線検出モジュールおよびｘ線ｃｔ装置
CZ2013669A3 (cs) * 2013-08-30 2015-01-07 České vysoké učení technické v Praze Ústav technické a experimentální fyziky Detektor ionizujícího záření umožňující vytvoření souvislého digitálního obrazu
US9794499B2 (en) * 2014-04-29 2017-10-17 Fermi Research Alliance, Llc Wafer-scale pixelated detector system
US9788804B2 (en) * 2014-07-22 2017-10-17 Samsung Electronics Co., Ltd. Anatomical imaging system with improved detector block module
CN105765406B (zh) 2014-09-26 2018-01-05 皇家飞利浦有限公司 具有加热设备的辐射探测器
CN106662661B (zh) * 2014-10-31 2019-06-25 皇家飞利浦有限公司 用于探测辐射信号的传感器设备和成像系统
CN107533145B (zh) * 2015-04-07 2019-03-19 深圳帧观德芯科技有限公司 制作半导体x射线检测器的方法
US11137504B2 (en) * 2016-02-05 2021-10-05 General Electric Company Tiled radiation detector
WO2019152340A1 (en) * 2018-01-30 2019-08-08 Butterfly Network, Inc. Methods and apparatuses for packaging an ultrasound-on-a-chip
CN110664422A (zh) * 2019-09-09 2020-01-10 东软医疗系统股份有限公司 探测器模块、探测器及医疗成像设备
EP3839575A1 (en) 2019-12-17 2021-06-23 Koninklijke Philips N.V. Photon counting detector
JP7539272B2 (ja) * 2020-08-24 2024-08-23 富士フイルムヘルスケア株式会社 放射線検出器モジュール、放射線検出器、及び放射線撮像装置
WO2023101702A1 (en) * 2021-12-01 2023-06-08 Siemens Medical Solutions Usa, Inc. Interposer for semiconductor-based single photon emission computed tomography detector

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Also Published As

Publication number Publication date
NL2007885A (en) 2012-05-31
US20120133054A1 (en) 2012-05-31
US8575558B2 (en) 2013-11-05
JP6039179B2 (ja) 2016-12-07
JP2012118073A (ja) 2012-06-21

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