NL177059C - Samengestelde halfgeleiderinrichting omvattend een halfgeleiderlichaam met halfgeleiderelementen en een isolerende houderplaat met een patroon van aansluitgeleiders. - Google Patents
Samengestelde halfgeleiderinrichting omvattend een halfgeleiderlichaam met halfgeleiderelementen en een isolerende houderplaat met een patroon van aansluitgeleiders.Info
- Publication number
- NL177059C NL177059C NLAANVRAGE7211725,A NL7211725A NL177059C NL 177059 C NL177059 C NL 177059C NL 7211725 A NL7211725 A NL 7211725A NL 177059 C NL177059 C NL 177059C
- Authority
- NL
- Netherlands
- Prior art keywords
- semiconductor
- pattern
- device containing
- holder plate
- insulating holder
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 3
- 239000002131 composite material Substances 0.000 title 1
- 239000004020 conductor Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Receivers (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6527271A JPS547196B2 (de) | 1971-08-26 | 1971-08-26 |
Publications (3)
Publication Number | Publication Date |
---|---|
NL7211725A NL7211725A (de) | 1973-02-28 |
NL177059B NL177059B (nl) | 1985-02-18 |
NL177059C true NL177059C (nl) | 1985-07-16 |
Family
ID=13282109
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NLAANVRAGE7211725,A NL177059C (nl) | 1971-08-26 | 1972-08-28 | Samengestelde halfgeleiderinrichting omvattend een halfgeleiderlichaam met halfgeleiderelementen en een isolerende houderplaat met een patroon van aansluitgeleiders. |
Country Status (6)
Country | Link |
---|---|
US (1) | US3754170A (de) |
JP (1) | JPS547196B2 (de) |
CA (1) | CA963977A (de) |
DE (1) | DE2242025B2 (de) |
GB (1) | GB1407626A (de) |
NL (1) | NL177059C (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3974517A (en) * | 1973-11-02 | 1976-08-10 | Harris Corporation | Metallic ground grid for integrated circuits |
JPS50156999A (de) * | 1974-06-07 | 1975-12-18 | ||
JPS5611180Y2 (de) * | 1974-08-16 | 1981-03-13 | ||
JPS51135383A (en) * | 1975-05-20 | 1976-11-24 | Sony Corp | Semiconductor variable capacitance device |
US4153988A (en) * | 1977-07-15 | 1979-05-15 | International Business Machines Corporation | High performance integrated circuit semiconductor package and method of making |
US5007083A (en) * | 1981-03-17 | 1991-04-09 | Constant James N | Secure computer |
JPS5984542A (ja) * | 1982-11-08 | 1984-05-16 | Nec Corp | 高周波半導体集積回路 |
US4572972A (en) * | 1983-01-18 | 1986-02-25 | At&T Laboratories | CMOS Logic circuits with all pull-up transistors integrated in separate chip from all pull-down transistors |
US4648128A (en) * | 1983-05-31 | 1987-03-03 | Matsushita Electric Industrial Co., Ltd. | Microwave integrated circuit immune to adverse shielding effects |
US5155570A (en) * | 1988-06-21 | 1992-10-13 | Sanyo Electric Co., Ltd. | Semiconductor integrated circuit having a pattern layout applicable to various custom ICs |
US5050238A (en) * | 1988-07-12 | 1991-09-17 | Sanyo Electric Co., Ltd. | Shielded front end receiver circuit with IF amplifier on an IC |
US5025306A (en) * | 1988-08-09 | 1991-06-18 | Texas Instruments Incorporated | Assembly of semiconductor chips |
US4947235A (en) * | 1989-02-21 | 1990-08-07 | Delco Electronics Corporation | Integrated circuit shield |
JPH03165058A (ja) * | 1989-11-24 | 1991-07-17 | Mitsubishi Electric Corp | 半導体装置 |
FR2655195B1 (fr) * | 1989-11-24 | 1997-07-18 | Mitsubishi Electric Corp | Dispositif a semiconducteurs comportant un blindage contre le rayonnement electromagnetique et procede de fabrication. |
US5256590A (en) * | 1989-11-24 | 1993-10-26 | Mitsubishi Denki Kabushiki Kaisha | Method of making a shielded semiconductor device |
US5089929A (en) * | 1990-03-08 | 1992-02-18 | The United States Of America As Represented By The Secretary Of The Air Force | Retrofit integrated circuit terminal protection device |
US5031027A (en) * | 1990-07-13 | 1991-07-09 | Motorola, Inc. | Shielded electrical circuit |
US5983363A (en) | 1992-11-20 | 1999-11-09 | Micron Communications, Inc. | In-sheet transceiver testing |
US5338970A (en) * | 1993-03-24 | 1994-08-16 | Intergraph Corporation | Multi-layered integrated circuit package with improved high frequency performance |
US5794159A (en) * | 1996-08-07 | 1998-08-11 | Nokia Mobile Phones Limited | Dual band mobile station employing cross-connected transmitter and receiver circuits |
US5937114A (en) * | 1997-07-21 | 1999-08-10 | Hewlett-Packard Company | Micro-photonics module with a partition wall |
US6714121B1 (en) | 1999-08-09 | 2004-03-30 | Micron Technology, Inc. | RFID material tracking method and apparatus |
JP2001308226A (ja) * | 2000-04-24 | 2001-11-02 | Nec Corp | 半導体装置 |
US7282906B2 (en) * | 2005-04-21 | 2007-10-16 | Stmicroelectronics S.A. | Electronic circuit protection device |
JP2007242722A (ja) * | 2006-03-06 | 2007-09-20 | Renesas Technology Corp | 横型バイポーラトランジスタ |
WO2020159322A1 (ko) * | 2019-02-01 | 2020-08-06 | 주식회사 엘지화학 | 리튬이차전지용 음극 및 이를 포함하는 리튬이차전지 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL134388C (de) * | 1964-05-15 | 1900-01-01 | ||
US3518494A (en) * | 1964-06-29 | 1970-06-30 | Signetics Corp | Radiation resistant semiconductor device and method |
US3381182A (en) * | 1964-10-19 | 1968-04-30 | Philco Ford Corp | Microcircuits having buried conductive layers |
US3465210A (en) * | 1967-05-23 | 1969-09-02 | Rca Corp | Housing and lead assembly for high-frequency semiconductor devices |
GB1204805A (en) * | 1967-07-07 | 1970-09-09 | Hitachi Ltd | Semiconductor device |
US3611071A (en) * | 1969-04-10 | 1971-10-05 | Ibm | Inversion prevention system for semiconductor devices |
US3614546A (en) * | 1970-01-07 | 1971-10-19 | Rca Corp | Shielded semiconductor device |
-
1971
- 1971-08-26 JP JP6527271A patent/JPS547196B2/ja not_active Expired
-
1972
- 1972-08-22 US US00282859A patent/US3754170A/en not_active Expired - Lifetime
- 1972-08-23 CA CA150,039A patent/CA963977A/en not_active Expired
- 1972-08-25 GB GB3981772A patent/GB1407626A/en not_active Expired
- 1972-08-26 DE DE19722242025 patent/DE2242025B2/de not_active Ceased
- 1972-08-28 NL NLAANVRAGE7211725,A patent/NL177059C/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPS4831076A (de) | 1973-04-24 |
DE2242025B2 (de) | 1976-04-08 |
NL177059B (nl) | 1985-02-18 |
US3754170A (en) | 1973-08-21 |
DE2242025A1 (de) | 1973-03-08 |
NL7211725A (de) | 1973-02-28 |
CA963977A (en) | 1975-03-04 |
JPS547196B2 (de) | 1979-04-04 |
GB1407626A (en) | 1975-09-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
BC | A request for examination has been filed | ||
A85 | Still pending on 85-01-01 | ||
V1 | Lapsed because of non-payment of the annual fee |