JPS547196B2 - - Google Patents

Info

Publication number
JPS547196B2
JPS547196B2 JP6527271A JP6527271A JPS547196B2 JP S547196 B2 JPS547196 B2 JP S547196B2 JP 6527271 A JP6527271 A JP 6527271A JP 6527271 A JP6527271 A JP 6527271A JP S547196 B2 JPS547196 B2 JP S547196B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6527271A
Other versions
JPS4831076A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6527271A priority Critical patent/JPS547196B2/ja
Priority to US00282859A priority patent/US3754170A/en
Priority to CA150,039A priority patent/CA963977A/en
Priority to GB3981772A priority patent/GB1407626A/en
Priority to DE19722242025 priority patent/DE2242025B2/de
Priority to NLAANVRAGE7211725,A priority patent/NL177059C/xx
Publication of JPS4831076A publication Critical patent/JPS4831076A/ja
Publication of JPS547196B2 publication Critical patent/JPS547196B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Receivers (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP6527271A 1971-08-26 1971-08-26 Expired JPS547196B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP6527271A JPS547196B2 (ja) 1971-08-26 1971-08-26
US00282859A US3754170A (en) 1971-08-26 1972-08-22 Integrated circuit device having monolithic rf shields
CA150,039A CA963977A (en) 1971-08-26 1972-08-23 Integrated circuit device having monolithic rf shields
GB3981772A GB1407626A (en) 1971-08-26 1972-08-25 Integrated circuit devices
DE19722242025 DE2242025B2 (de) 1971-08-26 1972-08-26 Zusammengesetzte halbleiterschaltung
NLAANVRAGE7211725,A NL177059C (nl) 1971-08-26 1972-08-28 Samengestelde halfgeleiderinrichting omvattend een halfgeleiderlichaam met halfgeleiderelementen en een isolerende houderplaat met een patroon van aansluitgeleiders.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6527271A JPS547196B2 (ja) 1971-08-26 1971-08-26

Publications (2)

Publication Number Publication Date
JPS4831076A JPS4831076A (ja) 1973-04-24
JPS547196B2 true JPS547196B2 (ja) 1979-04-04

Family

ID=13282109

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6527271A Expired JPS547196B2 (ja) 1971-08-26 1971-08-26

Country Status (6)

Country Link
US (1) US3754170A (ja)
JP (1) JPS547196B2 (ja)
CA (1) CA963977A (ja)
DE (1) DE2242025B2 (ja)
GB (1) GB1407626A (ja)
NL (1) NL177059C (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020159322A1 (ko) * 2019-02-01 2020-08-06 주식회사 엘지화학 리튬이차전지용 음극 및 이를 포함하는 리튬이차전지

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3974517A (en) * 1973-11-02 1976-08-10 Harris Corporation Metallic ground grid for integrated circuits
JPS50156999A (ja) * 1974-06-07 1975-12-18
JPS5611180Y2 (ja) * 1974-08-16 1981-03-13
JPS51135383A (en) * 1975-05-20 1976-11-24 Sony Corp Semiconductor variable capacitance device
US4153988A (en) * 1977-07-15 1979-05-15 International Business Machines Corporation High performance integrated circuit semiconductor package and method of making
US5007083A (en) * 1981-03-17 1991-04-09 Constant James N Secure computer
JPS5984542A (ja) * 1982-11-08 1984-05-16 Nec Corp 高周波半導体集積回路
US4572972A (en) * 1983-01-18 1986-02-25 At&T Laboratories CMOS Logic circuits with all pull-up transistors integrated in separate chip from all pull-down transistors
CA1218713A (en) * 1983-05-31 1987-03-03 Hiroshi Saka Microwave integrated circuit immune to adverse shielding effects
US5155570A (en) * 1988-06-21 1992-10-13 Sanyo Electric Co., Ltd. Semiconductor integrated circuit having a pattern layout applicable to various custom ICs
US5050238A (en) * 1988-07-12 1991-09-17 Sanyo Electric Co., Ltd. Shielded front end receiver circuit with IF amplifier on an IC
US5025306A (en) * 1988-08-09 1991-06-18 Texas Instruments Incorporated Assembly of semiconductor chips
US4947235A (en) * 1989-02-21 1990-08-07 Delco Electronics Corporation Integrated circuit shield
US5256590A (en) * 1989-11-24 1993-10-26 Mitsubishi Denki Kabushiki Kaisha Method of making a shielded semiconductor device
JPH03165058A (ja) * 1989-11-24 1991-07-17 Mitsubishi Electric Corp 半導体装置
FR2655195B1 (fr) * 1989-11-24 1997-07-18 Mitsubishi Electric Corp Dispositif a semiconducteurs comportant un blindage contre le rayonnement electromagnetique et procede de fabrication.
US5089929A (en) * 1990-03-08 1992-02-18 The United States Of America As Represented By The Secretary Of The Air Force Retrofit integrated circuit terminal protection device
US5031027A (en) * 1990-07-13 1991-07-09 Motorola, Inc. Shielded electrical circuit
US5983363A (en) * 1992-11-20 1999-11-09 Micron Communications, Inc. In-sheet transceiver testing
US5338970A (en) * 1993-03-24 1994-08-16 Intergraph Corporation Multi-layered integrated circuit package with improved high frequency performance
US5794159A (en) * 1996-08-07 1998-08-11 Nokia Mobile Phones Limited Dual band mobile station employing cross-connected transmitter and receiver circuits
US5937114A (en) * 1997-07-21 1999-08-10 Hewlett-Packard Company Micro-photonics module with a partition wall
US6714121B1 (en) 1999-08-09 2004-03-30 Micron Technology, Inc. RFID material tracking method and apparatus
JP2001308226A (ja) * 2000-04-24 2001-11-02 Nec Corp 半導体装置
US7282906B2 (en) * 2005-04-21 2007-10-16 Stmicroelectronics S.A. Electronic circuit protection device
JP2007242722A (ja) * 2006-03-06 2007-09-20 Renesas Technology Corp 横型バイポーラトランジスタ

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL134388C (ja) * 1964-05-15 1900-01-01
US3518494A (en) * 1964-06-29 1970-06-30 Signetics Corp Radiation resistant semiconductor device and method
US3381182A (en) * 1964-10-19 1968-04-30 Philco Ford Corp Microcircuits having buried conductive layers
US3465210A (en) * 1967-05-23 1969-09-02 Rca Corp Housing and lead assembly for high-frequency semiconductor devices
GB1204805A (en) * 1967-07-07 1970-09-09 Hitachi Ltd Semiconductor device
US3611071A (en) * 1969-04-10 1971-10-05 Ibm Inversion prevention system for semiconductor devices
US3614546A (en) * 1970-01-07 1971-10-19 Rca Corp Shielded semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020159322A1 (ko) * 2019-02-01 2020-08-06 주식회사 엘지화학 리튬이차전지용 음극 및 이를 포함하는 리튬이차전지

Also Published As

Publication number Publication date
DE2242025A1 (de) 1973-03-08
NL177059C (nl) 1985-07-16
NL7211725A (ja) 1973-02-28
DE2242025B2 (de) 1976-04-08
GB1407626A (en) 1975-09-24
CA963977A (en) 1975-03-04
US3754170A (en) 1973-08-21
NL177059B (nl) 1985-02-18
JPS4831076A (ja) 1973-04-24

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