NL1015799C2 - Moederboard. - Google Patents

Moederboard. Download PDF

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Publication number
NL1015799C2
NL1015799C2 NL1015799A NL1015799A NL1015799C2 NL 1015799 C2 NL1015799 C2 NL 1015799C2 NL 1015799 A NL1015799 A NL 1015799A NL 1015799 A NL1015799 A NL 1015799A NL 1015799 C2 NL1015799 C2 NL 1015799C2
Authority
NL
Netherlands
Prior art keywords
motherboard
board
connector
bus line
connectors
Prior art date
Application number
NL1015799A
Other languages
English (en)
Dutch (nl)
Inventor
Hiroshi Higashida
Kimiyasu Makino
Original Assignee
Kel Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kel Kk filed Critical Kel Kk
Application granted granted Critical
Publication of NL1015799C2 publication Critical patent/NL1015799C2/nl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1458—Active back panels; Back panels with filtering means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/40—Bus structure
    • G06F13/4063—Device-to-bus coupling
    • G06F13/409—Mechanical coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
NL1015799A 1999-07-28 2000-07-25 Moederboard. NL1015799C2 (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP21397199A JP3621608B2 (ja) 1999-07-28 1999-07-28 マザーボード
JP21397199 1999-07-28

Publications (1)

Publication Number Publication Date
NL1015799C2 true NL1015799C2 (nl) 2001-01-30

Family

ID=16648107

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1015799A NL1015799C2 (nl) 1999-07-28 2000-07-25 Moederboard.

Country Status (5)

Country Link
US (1) US6328572B1 (ja)
JP (1) JP3621608B2 (ja)
DE (1) DE10036934B4 (ja)
FR (1) FR2797527B1 (ja)
NL (1) NL1015799C2 (ja)

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US6770078B2 (en) 2000-01-14 2004-08-03 Peter M. Bonutti Movable knee implant and methods therefor
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US6724082B2 (en) * 2001-07-23 2004-04-20 Intel Corporation Systems having modules with selectable on die terminations
US6711027B2 (en) * 2001-07-23 2004-03-23 Intel Corporation Modules having paths of different impedances
US6674648B2 (en) * 2001-07-23 2004-01-06 Intel Corporation Termination cards and systems therefore
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US6631083B2 (en) 2001-07-23 2003-10-07 Intel Corporation Systems with modules and clocking therefore
US6674649B2 (en) * 2001-07-23 2004-01-06 Intel Corporation Systems having modules sharing on module terminations
US7708741B1 (en) 2001-08-28 2010-05-04 Marctec, Llc Method of preparing bones for knee replacement surgery
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US9345548B2 (en) 2006-02-27 2016-05-24 Biomet Manufacturing, Llc Patient-specific pre-operative planning
US8591516B2 (en) 2006-02-27 2013-11-26 Biomet Manufacturing, Llc Patient-specific orthopedic instruments
US9113971B2 (en) 2006-02-27 2015-08-25 Biomet Manufacturing, Llc Femoral acetabular impingement guide
US9339278B2 (en) 2006-02-27 2016-05-17 Biomet Manufacturing, Llc Patient-specific acetabular guides and associated instruments
US8407067B2 (en) 2007-04-17 2013-03-26 Biomet Manufacturing Corp. Method and apparatus for manufacturing an implant
US7780672B2 (en) 2006-02-27 2010-08-24 Biomet Manufacturing Corp. Femoral adjustment device and associated method
US10278711B2 (en) 2006-02-27 2019-05-07 Biomet Manufacturing, Llc Patient-specific femoral guide
US8070752B2 (en) 2006-02-27 2011-12-06 Biomet Manufacturing Corp. Patient specific alignment guide and inter-operative adjustment
US8603180B2 (en) 2006-02-27 2013-12-10 Biomet Manufacturing, Llc Patient-specific acetabular alignment guides
US9918740B2 (en) 2006-02-27 2018-03-20 Biomet Manufacturing, Llc Backup surgical instrument system and method
US9907659B2 (en) 2007-04-17 2018-03-06 Biomet Manufacturing, Llc Method and apparatus for manufacturing an implant
US9173661B2 (en) 2006-02-27 2015-11-03 Biomet Manufacturing, Llc Patient specific alignment guide with cutting surface and laser indicator
US7704253B2 (en) 2006-03-06 2010-04-27 Howmedica Osteonics Corp. Single use resection guide
US7695520B2 (en) 2006-05-31 2010-04-13 Biomet Manufacturing Corp. Prosthesis and implementation system
US9795399B2 (en) 2006-06-09 2017-10-24 Biomet Manufacturing, Llc Patient-specific knee alignment guide and associated method
CN101217379A (zh) 2008-01-10 2008-07-09 华为技术有限公司 一种背板和通信设备
JPWO2010010625A1 (ja) * 2008-07-25 2012-01-05 富士通株式会社 電子装置及び基板ユニット
CN107069274B (zh) 2010-05-07 2020-08-18 安费诺有限公司 高性能线缆连接器
US9968376B2 (en) 2010-11-29 2018-05-15 Biomet Manufacturing, Llc Patient-specific orthopedic instruments
US8636543B2 (en) 2011-02-02 2014-01-28 Amphenol Corporation Mezzanine connector
US9241745B2 (en) 2011-03-07 2016-01-26 Biomet Manufacturing, Llc Patient-specific femoral version guide
TWI464563B (zh) * 2012-04-20 2014-12-11 Gemtek Technology Co Ltd 電子裝置組合結構
US9831588B2 (en) 2012-08-22 2017-11-28 Amphenol Corporation High-frequency electrical connector
CN106463859B (zh) 2014-01-22 2019-05-17 安费诺有限公司 具有边缘至宽边过渡的超高速高密度电互连系统
CN114552261A (zh) 2015-07-07 2022-05-27 安费诺富加宜（亚洲）私人有限公司 电连接器
CN112151987B (zh) 2016-08-23 2022-12-30 安费诺有限公司 可配置为高性能的连接器
US10722310B2 (en) 2017-03-13 2020-07-28 Zimmer Biomet CMF and Thoracic, LLC Virtual surgery planning system and method
CN208862209U (zh) 2018-09-26 2019-05-14 安费诺东亚电子科技(深圳)有限公司 一种连接器及其应用的pcb板
CN109548280A (zh) * 2018-11-09 2019-03-29 天津航空机电有限公司 一种可单独更换的插卡式功率输出电路板卡
WO2021154718A1 (en) 2020-01-27 2021-08-05 Fci Usa Llc High speed, high density direct mate orthogonal connector
CN115428275A (zh) 2020-01-27 2022-12-02 富加宜（美国）有限责任公司 高速连接器
CN215816516U (zh) 2020-09-22 2022-02-11 安费诺商用电子产品(成都)有限公司 电连接器
CN213636403U (zh) 2020-09-25 2021-07-06 安费诺商用电子产品(成都)有限公司 电连接器

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Also Published As

Publication number Publication date
JP3621608B2 (ja) 2005-02-16
FR2797527B1 (fr) 2002-04-19
JP2001042981A (ja) 2001-02-16
US6328572B1 (en) 2001-12-11
DE10036934A1 (de) 2001-02-01
FR2797527A1 (fr) 2001-02-16
DE10036934B4 (de) 2006-01-05

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V1 Lapsed because of non-payment of the annual fee

Effective date: 20130201