NL1015624A1 - Stroomloze-plateringswerkwijze en stroomloze-platerings oplossing. - Google Patents
Stroomloze-plateringswerkwijze en stroomloze-platerings oplossing.Info
- Publication number
- NL1015624A1 NL1015624A1 NL1015624A NL1015624A NL1015624A1 NL 1015624 A1 NL1015624 A1 NL 1015624A1 NL 1015624 A NL1015624 A NL 1015624A NL 1015624 A NL1015624 A NL 1015624A NL 1015624 A1 NL1015624 A1 NL 1015624A1
- Authority
- NL
- Netherlands
- Prior art keywords
- electroless plating
- plating solution
- plating method
- solution
- electroless
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19270999 | 1999-07-07 | ||
JP11192709A JP2001020077A (ja) | 1999-07-07 | 1999-07-07 | 無電解めっき方法及び無電解めっき液 |
Publications (2)
Publication Number | Publication Date |
---|---|
NL1015624A1 true NL1015624A1 (nl) | 2001-01-09 |
NL1015624C2 NL1015624C2 (nl) | 2001-05-30 |
Family
ID=16295761
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL1015624A NL1015624C2 (nl) | 1999-07-07 | 2000-07-05 | Stroomloze-plateringswerkwijze en stroomloze-platerings oplossing. |
Country Status (6)
Country | Link |
---|---|
US (1) | US6534117B1 (nl) |
JP (1) | JP2001020077A (nl) |
KR (1) | KR20010015197A (nl) |
FR (1) | FR2796084B1 (nl) |
NL (1) | NL1015624C2 (nl) |
TW (1) | TW524882B (nl) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050081744A1 (en) * | 2003-10-16 | 2005-04-21 | Semitool, Inc. | Electroplating compositions and methods for electroplating |
JP2003013247A (ja) * | 2001-04-24 | 2003-01-15 | Murata Mfg Co Ltd | 無電解銅めっき浴及び高周波用電子部品 |
US20040126548A1 (en) * | 2001-05-28 | 2004-07-01 | Waseda University | ULSI wiring and method of manufacturing the same |
KR100772551B1 (ko) * | 2001-12-19 | 2007-11-02 | 주식회사 하이닉스반도체 | 반도체소자의 콘택 형성 방법 |
KR100438673B1 (ko) * | 2001-12-29 | 2004-07-03 | 주식회사 하이닉스반도체 | 무전해도금법을 이용한 백금막의 형성 방법 및 그를이용한 캐패시터의 제조 방법 |
US7297190B1 (en) * | 2006-06-28 | 2007-11-20 | Lam Research Corporation | Plating solutions for electroless deposition of copper |
US7087517B2 (en) * | 2003-12-24 | 2006-08-08 | Intel Corporation | Method to fabricate interconnect structures |
US6995088B2 (en) * | 2004-05-18 | 2006-02-07 | Texas Instruments Incorporated | Surface treatment of copper to improve interconnect formation |
US8771804B2 (en) * | 2005-08-31 | 2014-07-08 | Lam Research Corporation | Processes and systems for engineering a copper surface for selective metal deposition |
KR100707653B1 (ko) * | 2005-12-16 | 2007-04-13 | 동부일렉트로닉스 주식회사 | 초음파 전기 도금 장치 및 이를 이용한 웨이퍼 제조방법 |
TW200746266A (en) * | 2006-02-08 | 2007-12-16 | Varian Semiconductor Equipment | Techniques for depositing metallic films using ion implantation surface modification for catalysis of electroless deposition |
JP4917328B2 (ja) * | 2006-02-28 | 2012-04-18 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
US7686875B2 (en) * | 2006-05-11 | 2010-03-30 | Lam Research Corporation | Electroless deposition from non-aqueous solutions |
US7752996B2 (en) * | 2006-05-11 | 2010-07-13 | Lam Research Corporation | Apparatus for applying a plating solution for electroless deposition |
US7951414B2 (en) * | 2008-03-20 | 2011-05-31 | Micron Technology, Inc. | Methods of forming electrically conductive structures |
KR20090113995A (ko) * | 2008-04-29 | 2009-11-03 | 주식회사 피앤아이 | 금속 촉매층 및 금속 시드층을 포함하는 전해도금용 기판,및 이를 이용한 인쇄회로기판의 제조 방법 |
DE102009023602B4 (de) | 2009-06-02 | 2012-08-16 | Grenzebach Maschinenbau Gmbh | Vorrichtung zum industriellen Herstellen elastisch verformbarer großflächiger Glasplatten in hoher Stückzahl |
US8632628B2 (en) * | 2010-10-29 | 2014-01-21 | Lam Research Corporation | Solutions and methods for metal deposition |
US9611550B2 (en) | 2012-12-26 | 2017-04-04 | Rohm And Haas Electronic Materials Llc | Formaldehyde free electroless copper plating compositions and methods |
CN113874551B (zh) * | 2019-07-31 | 2023-10-03 | 株式会社力森诺科 | 层叠体及其制造方法 |
KR20210019752A (ko) * | 2019-08-13 | 2021-02-23 | 삼성전기주식회사 | 무전해 동도금용 조성물 및 이를 이용한 무전해 도금 방법 |
CN116057205A (zh) * | 2020-08-07 | 2023-05-02 | 东洋钢钣株式会社 | 覆铜层叠体及其制造方法 |
CN115537788A (zh) * | 2022-08-29 | 2022-12-30 | 深圳大学 | 一种化学镀活化剂及其制备方法与应用 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1283715A (en) | 1968-08-13 | 1972-08-02 | Shipley Co | Electroless copper plating |
US4301196A (en) * | 1978-09-13 | 1981-11-17 | Kollmorgen Technologies Corp. | Electroless copper deposition process having faster plating rates |
US4265943A (en) * | 1978-11-27 | 1981-05-05 | Macdermid Incorporated | Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions |
JPS57501786A (nl) * | 1980-09-15 | 1982-10-07 | ||
JPS61199069A (ja) * | 1985-02-28 | 1986-09-03 | C Uyemura & Co Ltd | めっき液濃度自動連続管理装置 |
US4695505A (en) | 1985-10-25 | 1987-09-22 | Shipley Company Inc. | Ductile electroless copper |
US5576052A (en) * | 1996-04-22 | 1996-11-19 | Motorola, Inc. | Method of metallizing high aspect ratio apertures |
-
1999
- 1999-07-07 JP JP11192709A patent/JP2001020077A/ja active Pending
-
2000
- 2000-06-30 US US09/607,934 patent/US6534117B1/en not_active Expired - Fee Related
- 2000-07-05 TW TW089113291A patent/TW524882B/zh not_active IP Right Cessation
- 2000-07-05 NL NL1015624A patent/NL1015624C2/nl not_active IP Right Cessation
- 2000-07-06 KR KR1020000038520A patent/KR20010015197A/ko not_active Application Discontinuation
- 2000-07-07 FR FR0008883A patent/FR2796084B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2796084B1 (fr) | 2002-04-19 |
FR2796084A1 (fr) | 2001-01-12 |
NL1015624C2 (nl) | 2001-05-30 |
US6534117B1 (en) | 2003-03-18 |
JP2001020077A (ja) | 2001-01-23 |
TW524882B (en) | 2003-03-21 |
KR20010015197A (ko) | 2001-02-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AD1A | A request for search or an international type search has been filed | ||
RD2N | Patents in respect of which a decision has been taken or a report has been made (novelty report) |
Effective date: 20010119 |
|
PD2B | A search report has been drawn up | ||
VD1 | Lapsed due to non-payment of the annual fee |
Effective date: 20070201 |