MY7300447A - Improvements in or relating to methods of making semiconductor devices - Google Patents
Improvements in or relating to methods of making semiconductor devicesInfo
- Publication number
- MY7300447A MY7300447A MY447/73A MY7300447A MY7300447A MY 7300447 A MY7300447 A MY 7300447A MY 447/73 A MY447/73 A MY 447/73A MY 7300447 A MY7300447 A MY 7300447A MY 7300447 A MY7300447 A MY 7300447A
- Authority
- MY
- Malaysia
- Prior art keywords
- relating
- methods
- semiconductor devices
- making semiconductor
- making
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
- H10W10/021—Manufacture or treatment of air gaps
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/40—Alkaline compositions for etching other metallic material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/60—Wet etching
- H10P50/64—Wet etching of semiconductor materials
- H10P50/642—Chemical etching
- H10P50/644—Anisotropic liquid etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
- H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials
- H10P50/693—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials characterised by their size, orientation, disposition, behaviour or shape, in horizontal or vertical plane
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/20—Air gaps
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US60329266A | 1966-12-20 | 1966-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY7300447A true MY7300447A (en) | 1973-12-31 |
Family
ID=24414811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MY447/73A MY7300447A (en) | 1966-12-20 | 1973-12-30 | Improvements in or relating to methods of making semiconductor devices |
Country Status (7)
| Country | Link |
|---|---|
| BE (1) | BE708163A (https=) |
| DE (1) | DE1621532B2 (https=) |
| FR (1) | FR1548079A (https=) |
| GB (1) | GB1212379A (https=) |
| MY (1) | MY7300447A (https=) |
| NL (1) | NL144778B (https=) |
| SE (1) | SE342526B (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1288278A (https=) * | 1968-12-31 | 1972-09-06 | ||
| US3844858A (en) * | 1968-12-31 | 1974-10-29 | Texas Instruments Inc | Process for controlling the thickness of a thin layer of semiconductor material and semiconductor substrate |
| US3579057A (en) * | 1969-08-18 | 1971-05-18 | Rca Corp | Method of making a semiconductor article and the article produced thereby |
| CA957782A (en) * | 1970-01-26 | 1974-11-12 | Theodore Kamprath | Capacitor structure for integrated circuits |
| DE2106540A1 (de) * | 1970-02-13 | 1971-08-19 | Texas Instruments Inc | Halbleiterschaltung und Verfahren zu ihrer Herstellung |
| US4668333A (en) * | 1985-12-13 | 1987-05-26 | Xerox Corporation | Image sensor array for assembly with like arrays to form a longer array |
| EP0296348B1 (de) * | 1987-05-27 | 1993-03-31 | Siemens Aktiengesellschaft | Ätzverfahren zum Erzeugen von Lochöffnungen oder Gräben in n-dotiertem Silizium |
| GB9204078D0 (en) * | 1992-02-26 | 1992-04-08 | Philips Electronics Uk Ltd | Infrared detector manufacture |
| US5508231A (en) * | 1994-03-07 | 1996-04-16 | National Semiconductor Corporation | Apparatus and method for achieving mechanical and thermal isolation of portions of integrated monolithic circuits |
-
1967
- 1967-12-01 NL NL676716390A patent/NL144778B/xx not_active IP Right Cessation
- 1967-12-18 BE BE708163D patent/BE708163A/xx not_active IP Right Cessation
- 1967-12-19 DE DE19671621532 patent/DE1621532B2/de not_active Withdrawn
- 1967-12-19 SE SE17410/67A patent/SE342526B/xx unknown
- 1967-12-19 GB GB57551/67A patent/GB1212379A/en not_active Expired
- 1967-12-20 FR FR1548079D patent/FR1548079A/fr not_active Expired
-
1973
- 1973-12-30 MY MY447/73A patent/MY7300447A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| NL6716390A (https=) | 1968-06-21 |
| BE708163A (https=) | 1968-05-02 |
| SE342526B (https=) | 1972-02-07 |
| GB1212379A (en) | 1970-11-18 |
| NL144778B (nl) | 1975-01-15 |
| FR1548079A (https=) | 1968-11-29 |
| DE1621532B2 (de) | 1971-10-07 |
| DE1621532A1 (de) | 1970-10-22 |
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