MY7300447A - Improvements in or relating to methods of making semiconductor devices - Google Patents

Improvements in or relating to methods of making semiconductor devices

Info

Publication number
MY7300447A
MY7300447A MY447/73A MY7300447A MY7300447A MY 7300447 A MY7300447 A MY 7300447A MY 447/73 A MY447/73 A MY 447/73A MY 7300447 A MY7300447 A MY 7300447A MY 7300447 A MY7300447 A MY 7300447A
Authority
MY
Malaysia
Prior art keywords
relating
methods
semiconductor devices
making semiconductor
making
Prior art date
Application number
MY447/73A
Other languages
English (en)
Inventor
Roger Clyde Kragness
Herbert Atkin Waggener
Original Assignee
Us Government
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Us Government filed Critical Us Government
Publication of MY7300447A publication Critical patent/MY7300447A/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01Manufacture or treatment
    • H10W10/021Manufacture or treatment of air gaps
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/10Etching compositions
    • C23F1/14Aqueous compositions
    • C23F1/32Alkaline compositions
    • C23F1/40Alkaline compositions for etching other metallic material
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • H10P50/60Wet etching
    • H10P50/64Wet etching of semiconductor materials
    • H10P50/642Chemical etching
    • H10P50/644Anisotropic liquid etching
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • H10P50/69Etching of wafers, substrates or parts of devices using masks for semiconductor materials
    • H10P50/691Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials
    • H10P50/693Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials characterised by their size, orientation, disposition, behaviour or shape, in horizontal or vertical plane
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/20Air gaps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Weting (AREA)
MY447/73A 1966-12-20 1973-12-30 Improvements in or relating to methods of making semiconductor devices MY7300447A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US60329266A 1966-12-20 1966-12-20

Publications (1)

Publication Number Publication Date
MY7300447A true MY7300447A (en) 1973-12-31

Family

ID=24414811

Family Applications (1)

Application Number Title Priority Date Filing Date
MY447/73A MY7300447A (en) 1966-12-20 1973-12-30 Improvements in or relating to methods of making semiconductor devices

Country Status (7)

Country Link
BE (1) BE708163A (https=)
DE (1) DE1621532B2 (https=)
FR (1) FR1548079A (https=)
GB (1) GB1212379A (https=)
MY (1) MY7300447A (https=)
NL (1) NL144778B (https=)
SE (1) SE342526B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1288278A (https=) * 1968-12-31 1972-09-06
US3844858A (en) * 1968-12-31 1974-10-29 Texas Instruments Inc Process for controlling the thickness of a thin layer of semiconductor material and semiconductor substrate
US3579057A (en) * 1969-08-18 1971-05-18 Rca Corp Method of making a semiconductor article and the article produced thereby
CA957782A (en) * 1970-01-26 1974-11-12 Theodore Kamprath Capacitor structure for integrated circuits
DE2106540A1 (de) * 1970-02-13 1971-08-19 Texas Instruments Inc Halbleiterschaltung und Verfahren zu ihrer Herstellung
US4668333A (en) * 1985-12-13 1987-05-26 Xerox Corporation Image sensor array for assembly with like arrays to form a longer array
EP0296348B1 (de) * 1987-05-27 1993-03-31 Siemens Aktiengesellschaft Ätzverfahren zum Erzeugen von Lochöffnungen oder Gräben in n-dotiertem Silizium
GB9204078D0 (en) * 1992-02-26 1992-04-08 Philips Electronics Uk Ltd Infrared detector manufacture
US5508231A (en) * 1994-03-07 1996-04-16 National Semiconductor Corporation Apparatus and method for achieving mechanical and thermal isolation of portions of integrated monolithic circuits

Also Published As

Publication number Publication date
NL6716390A (https=) 1968-06-21
BE708163A (https=) 1968-05-02
SE342526B (https=) 1972-02-07
GB1212379A (en) 1970-11-18
NL144778B (nl) 1975-01-15
FR1548079A (https=) 1968-11-29
DE1621532B2 (de) 1971-10-07
DE1621532A1 (de) 1970-10-22

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