FR1548079A - - Google Patents
Info
- Publication number
- FR1548079A FR1548079A FR1548079DA FR1548079A FR 1548079 A FR1548079 A FR 1548079A FR 1548079D A FR1548079D A FR 1548079DA FR 1548079 A FR1548079 A FR 1548079A
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
- H10W10/021—Manufacture or treatment of air gaps
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/40—Alkaline compositions for etching other metallic material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/60—Wet etching
- H10P50/64—Wet etching of semiconductor materials
- H10P50/642—Chemical etching
- H10P50/644—Anisotropic liquid etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
- H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials
- H10P50/693—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials characterised by their size, orientation, disposition, behaviour or shape, in horizontal or vertical plane
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/20—Air gaps
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US60329266A | 1966-12-20 | 1966-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR1548079A true FR1548079A (https=) | 1968-11-29 |
Family
ID=24414811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR1548079D Expired FR1548079A (https=) | 1966-12-20 | 1967-12-20 |
Country Status (7)
| Country | Link |
|---|---|
| BE (1) | BE708163A (https=) |
| DE (1) | DE1621532B2 (https=) |
| FR (1) | FR1548079A (https=) |
| GB (1) | GB1212379A (https=) |
| MY (1) | MY7300447A (https=) |
| NL (1) | NL144778B (https=) |
| SE (1) | SE342526B (https=) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2027429A1 (https=) * | 1968-12-31 | 1970-09-25 | Texas Instruments Inc | |
| FR2030114A1 (https=) * | 1968-12-31 | 1970-10-30 | Texas Instruments Inc | |
| FR2058343A1 (https=) * | 1969-08-18 | 1971-05-28 | Rca Corp | |
| FR2080989A1 (https=) * | 1970-02-13 | 1971-11-26 | Texas Instruments Inc | |
| EP0296348A1 (de) * | 1987-05-27 | 1988-12-28 | Siemens Aktiengesellschaft | Ätzverfahren zum Erzeugen von Lochöffnungen oder Gräben in n-dotiertem Silizium |
| WO1995024737A1 (en) * | 1994-03-07 | 1995-09-14 | National Semiconductor Corporation | Apparatus and method for achieving mechanical and thermal isolation of portions of integrated monolithic circuits |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA957782A (en) * | 1970-01-26 | 1974-11-12 | Theodore Kamprath | Capacitor structure for integrated circuits |
| US4668333A (en) * | 1985-12-13 | 1987-05-26 | Xerox Corporation | Image sensor array for assembly with like arrays to form a longer array |
| GB9204078D0 (en) * | 1992-02-26 | 1992-04-08 | Philips Electronics Uk Ltd | Infrared detector manufacture |
-
1967
- 1967-12-01 NL NL676716390A patent/NL144778B/xx not_active IP Right Cessation
- 1967-12-18 BE BE708163D patent/BE708163A/xx not_active IP Right Cessation
- 1967-12-19 DE DE19671621532 patent/DE1621532B2/de not_active Withdrawn
- 1967-12-19 SE SE17410/67A patent/SE342526B/xx unknown
- 1967-12-19 GB GB57551/67A patent/GB1212379A/en not_active Expired
- 1967-12-20 FR FR1548079D patent/FR1548079A/fr not_active Expired
-
1973
- 1973-12-30 MY MY447/73A patent/MY7300447A/xx unknown
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2027429A1 (https=) * | 1968-12-31 | 1970-09-25 | Texas Instruments Inc | |
| FR2030114A1 (https=) * | 1968-12-31 | 1970-10-30 | Texas Instruments Inc | |
| FR2058343A1 (https=) * | 1969-08-18 | 1971-05-28 | Rca Corp | |
| FR2080989A1 (https=) * | 1970-02-13 | 1971-11-26 | Texas Instruments Inc | |
| EP0296348A1 (de) * | 1987-05-27 | 1988-12-28 | Siemens Aktiengesellschaft | Ätzverfahren zum Erzeugen von Lochöffnungen oder Gräben in n-dotiertem Silizium |
| US4874484A (en) * | 1987-05-27 | 1989-10-17 | Siemens Aktiengesellschaft | Etching method for generating apertured openings or trenches in layers or substrates composed of n-doped silicon |
| WO1995024737A1 (en) * | 1994-03-07 | 1995-09-14 | National Semiconductor Corporation | Apparatus and method for achieving mechanical and thermal isolation of portions of integrated monolithic circuits |
Also Published As
| Publication number | Publication date |
|---|---|
| NL6716390A (https=) | 1968-06-21 |
| BE708163A (https=) | 1968-05-02 |
| SE342526B (https=) | 1972-02-07 |
| MY7300447A (en) | 1973-12-31 |
| GB1212379A (en) | 1970-11-18 |
| NL144778B (nl) | 1975-01-15 |
| DE1621532B2 (de) | 1971-10-07 |
| DE1621532A1 (de) | 1970-10-22 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |