FR1548079A - - Google Patents

Info

Publication number
FR1548079A
FR1548079A FR1548079DA FR1548079A FR 1548079 A FR1548079 A FR 1548079A FR 1548079D A FR1548079D A FR 1548079DA FR 1548079 A FR1548079 A FR 1548079A
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
French (fr)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of FR1548079A publication Critical patent/FR1548079A/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01Manufacture or treatment
    • H10W10/021Manufacture or treatment of air gaps
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/10Etching compositions
    • C23F1/14Aqueous compositions
    • C23F1/32Alkaline compositions
    • C23F1/40Alkaline compositions for etching other metallic material
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • H10P50/60Wet etching
    • H10P50/64Wet etching of semiconductor materials
    • H10P50/642Chemical etching
    • H10P50/644Anisotropic liquid etching
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • H10P50/69Etching of wafers, substrates or parts of devices using masks for semiconductor materials
    • H10P50/691Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials
    • H10P50/693Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials characterised by their size, orientation, disposition, behaviour or shape, in horizontal or vertical plane
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/20Air gaps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Weting (AREA)
FR1548079D 1966-12-20 1967-12-20 Expired FR1548079A (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US60329266A 1966-12-20 1966-12-20

Publications (1)

Publication Number Publication Date
FR1548079A true FR1548079A (https=) 1968-11-29

Family

ID=24414811

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1548079D Expired FR1548079A (https=) 1966-12-20 1967-12-20

Country Status (7)

Country Link
BE (1) BE708163A (https=)
DE (1) DE1621532B2 (https=)
FR (1) FR1548079A (https=)
GB (1) GB1212379A (https=)
MY (1) MY7300447A (https=)
NL (1) NL144778B (https=)
SE (1) SE342526B (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2027429A1 (https=) * 1968-12-31 1970-09-25 Texas Instruments Inc
FR2030114A1 (https=) * 1968-12-31 1970-10-30 Texas Instruments Inc
FR2058343A1 (https=) * 1969-08-18 1971-05-28 Rca Corp
FR2080989A1 (https=) * 1970-02-13 1971-11-26 Texas Instruments Inc
EP0296348A1 (de) * 1987-05-27 1988-12-28 Siemens Aktiengesellschaft Ätzverfahren zum Erzeugen von Lochöffnungen oder Gräben in n-dotiertem Silizium
WO1995024737A1 (en) * 1994-03-07 1995-09-14 National Semiconductor Corporation Apparatus and method for achieving mechanical and thermal isolation of portions of integrated monolithic circuits

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA957782A (en) * 1970-01-26 1974-11-12 Theodore Kamprath Capacitor structure for integrated circuits
US4668333A (en) * 1985-12-13 1987-05-26 Xerox Corporation Image sensor array for assembly with like arrays to form a longer array
GB9204078D0 (en) * 1992-02-26 1992-04-08 Philips Electronics Uk Ltd Infrared detector manufacture

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2027429A1 (https=) * 1968-12-31 1970-09-25 Texas Instruments Inc
FR2030114A1 (https=) * 1968-12-31 1970-10-30 Texas Instruments Inc
FR2058343A1 (https=) * 1969-08-18 1971-05-28 Rca Corp
FR2080989A1 (https=) * 1970-02-13 1971-11-26 Texas Instruments Inc
EP0296348A1 (de) * 1987-05-27 1988-12-28 Siemens Aktiengesellschaft Ätzverfahren zum Erzeugen von Lochöffnungen oder Gräben in n-dotiertem Silizium
US4874484A (en) * 1987-05-27 1989-10-17 Siemens Aktiengesellschaft Etching method for generating apertured openings or trenches in layers or substrates composed of n-doped silicon
WO1995024737A1 (en) * 1994-03-07 1995-09-14 National Semiconductor Corporation Apparatus and method for achieving mechanical and thermal isolation of portions of integrated monolithic circuits

Also Published As

Publication number Publication date
NL6716390A (https=) 1968-06-21
BE708163A (https=) 1968-05-02
SE342526B (https=) 1972-02-07
MY7300447A (en) 1973-12-31
GB1212379A (en) 1970-11-18
NL144778B (nl) 1975-01-15
DE1621532B2 (de) 1971-10-07
DE1621532A1 (de) 1970-10-22

Similar Documents

Publication Publication Date Title
AU5917865A (https=)
AU428063B2 (https=)
AU424443B2 (https=)
AU414526B2 (https=)
AU433222B2 (https=)
AU421822B2 (https=)
AU417216B2 (https=)
AU415165B1 (https=)
AU612166A (https=)
AU5895065A (https=)
AU1111066A (https=)
AU1144366A (https=)
AU218666A (https=)
BE284991A (https=)
BE618801A (https=)
AU415780B2 (https=)
AU433620A (https=)
BE683707A (https=)
AU407778B2 (https=)
AU411645B2 (https=)
BE686929A (https=)
SE342526B (https=)
AU6852465A (https=)
AU855865A (https=)
AU92366A (https=)

Legal Events

Date Code Title Description
ST Notification of lapse