MY206652A - Housing and prober - Google Patents

Housing and prober

Info

Publication number
MY206652A
MY206652A MYPI2024003091A MYPI2024003091A MY206652A MY 206652 A MY206652 A MY 206652A MY PI2024003091 A MYPI2024003091 A MY PI2024003091A MY PI2024003091 A MYPI2024003091 A MY PI2024003091A MY 206652 A MY206652 A MY 206652A
Authority
MY
Malaysia
Prior art keywords
layer
side frame
housing
prober
floor base
Prior art date
Application number
MYPI2024003091A
Other languages
English (en)
Inventor
Nagashima Hideaki
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of MY206652A publication Critical patent/MY206652A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
MYPI2024003091A 2021-12-02 2022-09-30 Housing and prober MY206652A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021196404A JP7817523B2 (ja) 2021-12-02 2021-12-02 筐体及びプローバ
PCT/JP2022/036737 WO2023100463A1 (ja) 2021-12-02 2022-09-30 筐体及びプローバ

Publications (1)

Publication Number Publication Date
MY206652A true MY206652A (en) 2024-12-30

Family

ID=86611939

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2024003091A MY206652A (en) 2021-12-02 2022-09-30 Housing and prober

Country Status (6)

Country Link
US (1) US12399215B2 (https=)
JP (2) JP7817523B2 (https=)
KR (1) KR102707853B1 (https=)
CN (1) CN118355479A (https=)
MY (1) MY206652A (https=)
WO (1) WO2023100463A1 (https=)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7100340B2 (en) * 2001-08-31 2006-09-05 Asyst Technologies, Inc. Unified frame for semiconductor material handling system
JP5120018B2 (ja) * 2007-05-15 2013-01-16 東京エレクトロン株式会社 プローブ装置
US9304412B2 (en) * 2007-08-24 2016-04-05 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and measuring method
KR20110039763A (ko) * 2009-10-12 2011-04-20 뉴센트 주식회사 프로브카드 자동클리닝시스템
JP6042760B2 (ja) * 2013-03-28 2016-12-14 東京エレクトロン株式会社 プローブ装置
JP6267928B2 (ja) * 2013-10-29 2018-01-24 東京エレクトロン株式会社 ウエハ検査装置の整備用台車及びウエハ検査装置の整備方法
JP5967510B1 (ja) 2015-03-24 2016-08-10 株式会社東京精密 プローバ
JP6908858B2 (ja) * 2015-03-25 2021-07-28 株式会社東京精密 筐体
JP6478106B2 (ja) 2015-03-25 2019-03-06 株式会社東京精密 プローバ
JP6041175B2 (ja) 2015-03-30 2016-12-07 株式会社東京精密 プローバ
JP6652361B2 (ja) * 2015-09-30 2020-02-19 東京エレクトロン株式会社 ウエハ検査装置及びウエハ検査方法
JP6365953B1 (ja) * 2017-03-07 2018-08-01 株式会社東京精密 プローバ
JP2020096028A (ja) * 2018-12-11 2020-06-18 東京エレクトロン株式会社 検査装置、及び、検査方法
KR102222827B1 (ko) * 2019-08-12 2021-03-04 주식회사 쎄믹스 그룹 프로버 시스템 및 이의 설치 방법
JP7458161B2 (ja) 2019-09-24 2024-03-29 東京エレクトロン株式会社 検査装置の制御方法および検査装置

Also Published As

Publication number Publication date
JP2026063507A (ja) 2026-04-10
WO2023100463A1 (ja) 2023-06-08
JP2023082554A (ja) 2023-06-14
CN118355479A (zh) 2024-07-16
US20240319264A1 (en) 2024-09-26
US12399215B2 (en) 2025-08-26
KR102707853B1 (ko) 2024-09-23
JP7817523B2 (ja) 2026-02-19
KR20240091037A (ko) 2024-06-21

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