MY195582A - Method For Manufacturing Electronic Component Carrier Tape - Google Patents

Method For Manufacturing Electronic Component Carrier Tape

Info

Publication number
MY195582A
MY195582A MYPI2019001777A MYPI2019001777A MY195582A MY 195582 A MY195582 A MY 195582A MY PI2019001777 A MYPI2019001777 A MY PI2019001777A MY PI2019001777 A MYPI2019001777 A MY PI2019001777A MY 195582 A MY195582 A MY 195582A
Authority
MY
Malaysia
Prior art keywords
stepped
receiver
embossed
resin sheet
electronic component
Prior art date
Application number
MYPI2019001777A
Other languages
English (en)
Inventor
Aizawa Junichi
Original Assignee
Shin Etsu Polymer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Publication of MY195582A publication Critical patent/MY195582A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
MYPI2019001777A 2016-11-09 2017-10-20 Method For Manufacturing Electronic Component Carrier Tape MY195582A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016218906A JP6751652B2 (ja) 2016-11-09 2016-11-09 電子部品用キャリアテープの製造方法
PCT/JP2017/038084 WO2018088178A1 (ja) 2016-11-09 2017-10-20 電子部品用キャリアテープの製造方法

Publications (1)

Publication Number Publication Date
MY195582A true MY195582A (en) 2023-02-02

Family

ID=62109179

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019001777A MY195582A (en) 2016-11-09 2017-10-20 Method For Manufacturing Electronic Component Carrier Tape

Country Status (4)

Country Link
JP (1) JP6751652B2 (ja)
CN (1) CN109906192B (ja)
MY (1) MY195582A (ja)
WO (1) WO2018088178A1 (ja)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2593498Y2 (ja) * 1992-07-20 1999-04-12 信越ポリマー株式会社 キャリアテープ
JPH0741040A (ja) * 1993-07-29 1995-02-10 Shin Etsu Polymer Co Ltd キャリアテープの製造方法
JPH09267344A (ja) * 1996-03-31 1997-10-14 Press Kogyo Kk プレス成形方法およびプレス成形用金型
JP3360551B2 (ja) * 1996-11-08 2002-12-24 ソニー株式会社 角形チップ部品の搬送容器
US6568535B1 (en) * 2000-01-14 2003-05-27 Peak International Ltd. Apparatus and methods for improving uniform cover tape adhesion on a carrier tape
CN2433214Y (zh) * 2000-07-27 2001-06-06 彭志敏 电子元件包装卷带的改良结构
JP2006151398A (ja) * 2004-11-25 2006-06-15 Yamaha Corp 半導体集積回路用梱包テープキャリア
JP5366040B2 (ja) * 2008-08-06 2013-12-11 株式会社イー・ピー・アイ 小形製品包装体および小形製品の包装方法
TWI482725B (zh) * 2011-05-06 2015-05-01 Lextar Electronics Corp 封合帶改良結構
CN102745406A (zh) * 2012-08-03 2012-10-24 厦门市海德龙电子有限公司 一种电子元器件载带结构
JP6430811B2 (ja) * 2014-12-24 2018-11-28 信越ポリマー株式会社 電子部品用キャリアテープ及びその製造方法
JP6446262B2 (ja) * 2014-12-25 2018-12-26 信越ポリマー株式会社 電子部品用キャリアテープ及びその製造方法

Also Published As

Publication number Publication date
CN109906192A (zh) 2019-06-18
WO2018088178A1 (ja) 2018-05-17
JP2018076093A (ja) 2018-05-17
JP6751652B2 (ja) 2020-09-09
CN109906192B (zh) 2021-03-30

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