MY193405A - Method for producing an electrical device comprising a covering material - Google Patents
Method for producing an electrical device comprising a covering materialInfo
- Publication number
- MY193405A MY193405A MYPI2018700625A MYPI2018700625A MY193405A MY 193405 A MY193405 A MY 193405A MY PI2018700625 A MYPI2018700625 A MY PI2018700625A MY PI2018700625 A MYPI2018700625 A MY PI2018700625A MY 193405 A MY193405 A MY 193405A
- Authority
- MY
- Malaysia
- Prior art keywords
- covering material
- producing
- electrical device
- additive
- cement material
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Insulating Bodies (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015223415.0A DE102015223415A1 (de) | 2015-11-26 | 2015-11-26 | Verfahren zur Herstellung einer elektrischen Vorrichtung mit einer Umhüllmasse |
PCT/EP2016/077933 WO2017089211A1 (de) | 2015-11-26 | 2016-11-17 | Verfahren zur herstellung einer elektrischen vorrichtung mit einer umhüllmasse |
Publications (1)
Publication Number | Publication Date |
---|---|
MY193405A true MY193405A (en) | 2022-10-11 |
Family
ID=57348664
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2018700625A MY193405A (en) | 2015-11-26 | 2016-11-17 | Method for producing an electrical device comprising a covering material |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6629447B2 (zh) |
KR (1) | KR102577381B1 (zh) |
CN (1) | CN108352367B (zh) |
DE (1) | DE102015223415A1 (zh) |
MY (1) | MY193405A (zh) |
WO (1) | WO2017089211A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018215694A1 (de) * | 2018-09-14 | 2020-03-19 | Robert Bosch Gmbh | Vergussmasse, elektrisch isoliertes elektrisches oder elektronisches Bauteil und Verfahren zu dessen elektrischer Isolierung |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2491487A (en) * | 1945-07-09 | 1949-12-20 | Roy C Faulwetter | Process of making water-impervious concrete |
JPS5111303B1 (zh) * | 1970-06-18 | 1976-04-10 | ||
DE2810416C2 (de) * | 1978-03-10 | 1983-09-01 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Halbleiterbauelement mit Kunststoffummantelung |
CN1086632A (zh) * | 1992-10-31 | 1994-05-11 | 鄂州市钟厂 | 简单、实用的电器封装材料 |
JPH09110484A (ja) * | 1995-10-18 | 1997-04-28 | Toray Ind Inc | セメント用原料およびセメント |
DE19736090B4 (de) * | 1997-08-20 | 2005-04-14 | Daimlerchrysler Ag | Bauelement mit Schutzschicht und Verfahren zur Herstellung einer Schutzschicht für ein Bauelement |
CN1292491C (zh) * | 2003-03-10 | 2006-12-27 | 友达光电股份有限公司 | 封装结构及其制作方法 |
US7820750B2 (en) * | 2006-03-17 | 2010-10-26 | Denki Kagaku Kogyo Kabushiki Kaisha | Silica powder and use thereof |
KR20090107882A (ko) | 2008-04-10 | 2009-10-14 | 삼성전자주식회사 | 고정층을 포함하는 경사 조성 봉지 박막 및 그의 제조방법 |
JP4941509B2 (ja) * | 2008-10-20 | 2012-05-30 | 株式会社デンソー | 電子制御装置 |
WO2011121027A1 (de) | 2010-04-01 | 2011-10-06 | Evonik Degussa Gmbh | Härtbare mischung |
CN103081095B (zh) * | 2010-10-28 | 2015-07-15 | 京瓷株式会社 | 电子装置 |
JP5809349B2 (ja) * | 2011-04-14 | 2015-11-10 | エイディエイ テクノロジーズ インコーポレイテッドAda Technologies,Inc. | サーマルインターフェースマテリアルならびにそれを含む組成物、システムおよび装置 |
DE102013112267A1 (de) | 2013-11-07 | 2015-05-07 | Heraeus Deutschland GmbH & Co. KG | Halbleitermodul mit einer einen Halbleiterbaustein bedeckenden Umhüllungsmasse |
DE102014200492A1 (de) | 2014-01-14 | 2015-07-16 | Robert Bosch Gmbh | Schaltungsträger mit einer Silikonpolymer-Beschichtung |
-
2015
- 2015-11-26 DE DE102015223415.0A patent/DE102015223415A1/de active Pending
-
2016
- 2016-11-17 JP JP2018527208A patent/JP6629447B2/ja active Active
- 2016-11-17 CN CN201680069318.2A patent/CN108352367B/zh active Active
- 2016-11-17 WO PCT/EP2016/077933 patent/WO2017089211A1/de active Application Filing
- 2016-11-17 KR KR1020187014659A patent/KR102577381B1/ko active IP Right Grant
- 2016-11-17 MY MYPI2018700625A patent/MY193405A/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN108352367B (zh) | 2021-03-23 |
KR20180087258A (ko) | 2018-08-01 |
DE102015223415A1 (de) | 2017-06-01 |
KR102577381B1 (ko) | 2023-09-13 |
JP6629447B2 (ja) | 2020-01-15 |
CN108352367A (zh) | 2018-07-31 |
JP2018536997A (ja) | 2018-12-13 |
WO2017089211A1 (de) | 2017-06-01 |
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