MY193405A - Method for producing an electrical device comprising a covering material - Google Patents

Method for producing an electrical device comprising a covering material

Info

Publication number
MY193405A
MY193405A MYPI2018700625A MYPI2018700625A MY193405A MY 193405 A MY193405 A MY 193405A MY PI2018700625 A MYPI2018700625 A MY PI2018700625A MY PI2018700625 A MYPI2018700625 A MY PI2018700625A MY 193405 A MY193405 A MY 193405A
Authority
MY
Malaysia
Prior art keywords
covering material
producing
electrical device
additive
cement material
Prior art date
Application number
MYPI2018700625A
Inventor
Tjalf Pirk
Helmut Schmidt
Petra Stedile
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of MY193405A publication Critical patent/MY193405A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Insulating Bodies (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention relates to a method for producing an electrical device (10) having an electrical component (12) which is at least partially covered by a covering material (20) that comprises a cement material (22). The method comprises the following steps: - supplying the cement material (22); - mixing an additive (28) into the cement material (22); - applying the covering material (20), comprising the cement material (22) with the additive (28), onto said electrical component (12); and - treating the covering material (20), this treatment allowing the additive (28) from the cement material (22) to reach a boundary surface (24) between the covering material (20) and the electrical component (12), and to form a functional layer (26) at this boundary surface (24), and/or to augment the boundary surface (24) wetted by the covering material (20). Fig. 1
MYPI2018700625A 2015-11-26 2016-11-17 Method for producing an electrical device comprising a covering material MY193405A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015223415.0A DE102015223415A1 (en) 2015-11-26 2015-11-26 Method for producing an electrical device with an encapsulation compound
PCT/EP2016/077933 WO2017089211A1 (en) 2015-11-26 2016-11-17 Method for producing an electrical device comprising a covering material

Publications (1)

Publication Number Publication Date
MY193405A true MY193405A (en) 2022-10-11

Family

ID=57348664

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018700625A MY193405A (en) 2015-11-26 2016-11-17 Method for producing an electrical device comprising a covering material

Country Status (6)

Country Link
JP (1) JP6629447B2 (en)
KR (1) KR102577381B1 (en)
CN (1) CN108352367B (en)
DE (1) DE102015223415A1 (en)
MY (1) MY193405A (en)
WO (1) WO2017089211A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018215694A1 (en) * 2018-09-14 2020-03-19 Robert Bosch Gmbh Potting compound, electrically insulated electrical or electronic component and method for its electrical insulation

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2491487A (en) * 1945-07-09 1949-12-20 Roy C Faulwetter Process of making water-impervious concrete
JPS5111303B1 (en) * 1970-06-18 1976-04-10
DE2810416C2 (en) * 1978-03-10 1983-09-01 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Semiconductor component with plastic coating
CN1086632A (en) * 1992-10-31 1994-05-11 鄂州市钟厂 Simply, Shi Yong sealing material for electric appliance
JPH09110484A (en) * 1995-10-18 1997-04-28 Toray Ind Inc Cement raw material and cement
DE19736090B4 (en) * 1997-08-20 2005-04-14 Daimlerchrysler Ag Protective layer device and method for producing a protective layer for a device
CN1292491C (en) * 2003-03-10 2006-12-27 友达光电股份有限公司 Sealing structure and producing method thereof
WO2007108437A1 (en) * 2006-03-17 2007-09-27 Denki Kagaku Kogyo Kabushiki Kaisha Silica powder and use thereof
KR20090107882A (en) * 2008-04-10 2009-10-14 삼성전자주식회사 Graded composition encapsulation thin film comprising anchoring layer and method of fabricating the same
JP4941509B2 (en) * 2008-10-20 2012-05-30 株式会社デンソー Electronic control device
JP5657095B2 (en) * 2010-04-01 2015-01-21 エボニック デグサ ゲーエムベーハーＥｖｏｎｉｋ Ｄｅｇｕｓｓａ ＧｍｂＨ Curable mixture
KR101487780B1 (en) * 2010-10-28 2015-01-29 쿄세라 코포레이션 Electronic device
JP5809349B2 (en) * 2011-04-14 2015-11-10 エイディエイ テクノロジーズ インコーポレイテッドＡｄａ Ｔｅｃｈｎｏｌｏｇｉｅｓ，Ｉｎｃ． Thermal interface material and compositions, systems and devices containing the same
DE102013112267A1 (en) 2013-11-07 2015-05-07 Heraeus Deutschland GmbH & Co. KG Semiconductor module with a semiconductor device covering a cover mass
DE102014200492A1 (en) * 2014-01-14 2015-07-16 Robert Bosch Gmbh Circuit carrier with a silicone polymer coating

Also Published As

Publication number Publication date
JP2018536997A (en) 2018-12-13
KR20180087258A (en) 2018-08-01
DE102015223415A1 (en) 2017-06-01
CN108352367B (en) 2021-03-23
KR102577381B1 (en) 2023-09-13
CN108352367A (en) 2018-07-31
JP6629447B2 (en) 2020-01-15
WO2017089211A1 (en) 2017-06-01

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