JPH09110484A - Cement raw material and cement - Google Patents

Cement raw material and cement

Info

Publication number
JPH09110484A
JPH09110484A JP27036895A JP27036895A JPH09110484A JP H09110484 A JPH09110484 A JP H09110484A JP 27036895 A JP27036895 A JP 27036895A JP 27036895 A JP27036895 A JP 27036895A JP H09110484 A JPH09110484 A JP H09110484A
Authority
JP
Japan
Prior art keywords
cement
raw material
epoxy resin
electric
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP27036895A
Other languages
Japanese (ja)
Inventor
Takeshi Shimizu
健 清水
Masayuki Tanaka
正幸 田中
Hiroki Sakamoto
宏紀 坂元
Takaharu Akaha
高治 赤羽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP27036895A priority Critical patent/JPH09110484A/en
Publication of JPH09110484A publication Critical patent/JPH09110484A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B18/00—Use of agglomerated or waste materials or refuse as fillers for mortars, concrete or artificial stone; Treatment of agglomerated or waste materials or refuse, specially adapted to enhance their filling properties in mortars, concrete or artificial stone
    • C04B18/04—Waste materials; Refuse
    • C04B18/18—Waste materials; Refuse organic
    • C04B18/20—Waste materials; Refuse organic from macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B7/00—Hydraulic cements
    • C04B7/36—Manufacture of hydraulic cements in general
    • C04B7/38—Preparing or treating the raw materials individually or as batches, e.g. mixing with fuel
    • C04B7/42—Active ingredients added before, or during, the burning process
    • C04B7/428—Organic materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/91—Use of waste materials as fillers for mortars or concrete

Abstract

PROBLEM TO BE SOLVED: To enable to reutilize the residue after sealing of an electric and electronic parts by using an epoxy resin composition for electric and electronic part sealing. SOLUTION: The epoxy resin composition for sealing of the electric and electronic parts consisting of 4-29wt.% the total of epoxy resin and a hardener and 70-95wt.% inorganic filler is reutilized as cement raw material, and cement is obtained by compounding this cement raw material having <=0.1% Sb, <=70wt.% SiO2 and <=0.5wt.% halogen with lime stone, clay and gypsum.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、セメント用原料に関す
るものであり、また電気・電子部品封止用樹脂の廃棄方
法にも関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a raw material for cement, and also relates to a method of discarding a resin for sealing electric / electronic parts.

【０００２】[0002]

【従来の技術】[Prior art]

【０００３】[0003]

【発明が解決しようとする課題】セメント（例えばポル
トランドセメント）は、石灰石、粘土、ケイ石、酸化鉄
材料、石膏などを原料としており、化学組成としてはシ
リカ、アルミナ、酸化鉄（III）、石灰、マグネシア、
三酸化硫黄などからなっている。Cement (for example, Portland cement) is made of limestone, clay, silica stone, iron oxide material, gypsum, etc. as its raw material, and its chemical composition is silica, alumina, iron (III) oxide, lime. , Magnesia,
It is composed of sulfur trioxide.

【０００４】セメントの性質（短期強度、水和熱量、化
学的抵抗性）は、その成分によって決定されるため、必
要とされる性質を発現させるために成分調整が不可欠で
ある。しかし、例えばポルトランドセメントの場合は、
天然鉱物をそのまま原料としているために、成分調整を
十分に行っても、出来上がったセメントの組成・性質は
かなりの変動を避けられなかった。Since the properties of cement (short-term strength, heat of hydration, chemical resistance) are determined by its components, it is essential to adjust the components in order to develop the required properties. However, for example in the case of Portland cement,
Since natural minerals were used as raw materials, even if the components were adjusted sufficiently, the composition and properties of the finished cement could not be avoided.

【０００５】一方、電子・電気部品、特に半導体の分野
では、その封止のためにエポキシ樹脂および無機充填剤
を含有するエポキシ樹脂組成物が使用されている。その
樹脂封止の方法には、主にトランスファ成形法が用いら
れている。トランスファ成形法は２分割の金型を型締め
装置などので型締めし、加熱溶解した樹脂組成物をプラ
ンジャーで金型内に送る方法である。成形の後、成形機
のランナー部にも、樹脂組成物が残余する。この残余物
は、再利用が困難であり、実際には廃棄物として処理さ
れていた。しかしこのような電気・電子部品封止用エポ
キシ樹脂組成物は、多くの無機充填剤を含有しており、
焼却、化学処理などの手段によっても、残査を多く残す
という問題が生じていた。On the other hand, in the field of electronic / electrical parts, especially semiconductors, epoxy resin compositions containing an epoxy resin and an inorganic filler are used for sealing the same. A transfer molding method is mainly used as the resin sealing method. The transfer molding method is a method in which a two-divided mold is clamped by a mold clamping device or the like, and the heat-melted resin composition is fed into the mold by a plunger. After molding, the resin composition remains on the runner part of the molding machine. This residue was difficult to reuse and was actually treated as waste. However, such an epoxy resin composition for sealing electric / electronic parts contains many inorganic fillers,
Even by means such as incineration and chemical treatment, the problem of leaving a large amount of residue has occurred.

【０００６】[0006]

【課題を解決するための手段】本発明者らは、「電気・
電子部品を樹脂封止する際に発生する電気・電子部品封
止用エポキシ樹脂組成物をセメント用原料とすること」
により、上記課題を解決できることを見出した。[Means for Solving the Problems]
Use the epoxy resin composition for electrical / electronic component encapsulation generated when resin-encapsulating electronic components as a raw material for cement. "
It has been found that the above can solve the above problems.

【０００７】[0007]

【発明の実施の形態】以下、本発明を詳述する。なお本
発明において「重量」とは「質量」を意味する。BEST MODE FOR CARRYING OUT THE INVENTION The present invention is described in detail below. In the present invention, “weight” means “mass”.

【０００８】本発明においては電気・電子部品封止用エ
ポキシ樹脂組成物のうち、半導体封止用エポキシ樹脂組
成物が好ましく用いられる。電気・電子部品用エポキシ
樹脂組成物は、通常Ａ．エポキシ樹脂、Ｂ．硬化剤、
Ｃ．無機充填剤の各成分を含有する。Ａ成分であるエポ
キシ樹脂とは通常エポキシ基を２個以上有する化合物が
使用される。またＢ．硬化剤としてはエポキシ樹脂を硬
化させる官能基を通常２個以上有するものが使用され、
フェノール系化合物やアミン化合物が例示される。In the present invention, of the epoxy resin compositions for encapsulating electric / electronic parts, the epoxy resin composition for encapsulating semiconductors is preferably used. Epoxy resin compositions for electric / electronic parts are usually manufactured by A.P. Epoxy resin, B.I. Curing agent,
C. Contains each component of the inorganic filler. As the epoxy resin which is the component A, a compound having two or more epoxy groups is usually used. In addition, B. As the curing agent, one having two or more functional groups for curing the epoxy resin is usually used,
Examples include phenolic compounds and amine compounds.

【０００９】組成としてはエポキシ樹脂組成物に対し
て、ＡおよびＢ成分の和が４〜２９重量％、Ｃ成分が７
０〜９５重量％を含有するものが一般的に使用される。
本発明のエポキシ樹脂組成物には、さらに表面処理剤、
硬化触媒、難燃剤、難燃助剤、着色材、イオン補足材、
エラストマー、ワックス等の各種添加剤を含有していて
もよい。The composition is such that the sum of the A and B components is 4 to 29% by weight and the C component is 7 relative to the epoxy resin composition.
Those containing 0 to 95% by weight are generally used.
The epoxy resin composition of the present invention further includes a surface treatment agent,
Curing catalyst, flame retardant, flame retardant aid, colorant, ion supplement,
It may contain various additives such as elastomer and wax.

【００１０】また、エポキシ樹脂組成物としては、セメ
ントに使用される場合の環境保護およびセメント硬化物
の性能安定性の観点から、電気・電子部品用エポキシ樹
脂組成物に、しばしば難燃剤や難燃助剤として配合され
るアンチモン化合物やハロゲン化有機化合物の量が少な
いものが好ましい。具体的な量としては、アンチモン原
子について０．１重量％以下、さらに０．０５重量％以
下であるものが好ましく、ハロゲン原子については０．
５重量％以下、さらに０．２重量％以下、またさらに
０．０５重量％以下であることが好ましい。さらに臭素
原子に注目しても０．５重量％、さらに０．２重量％、
またさらに０．０５重量％以下であることが好ましい。As the epoxy resin composition, from the viewpoints of environmental protection when used in cement and performance stability of the hardened cement product, the epoxy resin composition for electric and electronic parts often contains a flame retardant or a flame retardant. It is preferable that the amount of the antimony compound or the halogenated organic compound blended as an auxiliary is small. A specific amount is preferably 0.1% by weight or less, more preferably 0.05% by weight or less for antimony atoms, and 0.1% by weight or less for halogen atoms.
It is preferably 5% by weight or less, more preferably 0.2% by weight or less, and further preferably 0.05% by weight or less. Further focusing on the bromine atom, 0.5% by weight, 0.2% by weight,
Further, it is preferably 0.05% by weight or less.

【００１１】また無機充填剤としては、結晶性シリカ、
溶融シリカ、この他に炭酸カルシウム、炭酸マグネシウ
ム、アルミナ、マグネシア、タルク、クレー、ケイ酸カ
ルシウム、酸化チタン、アスベスト、ガラス繊維などが
例示されるが、シリカなどの酸化ケイ素、アルミナが一
般的に使用される。As the inorganic filler, crystalline silica,
Examples of the fused silica include calcium carbonate, magnesium carbonate, alumina, magnesia, talc, clay, calcium silicate, titanium oxide, asbestos, and glass fiber, but silicon oxide such as silica and alumina are generally used. To be done.

【００１２】これらの無機充填剤では、セメント原料と
して使用するために、セメント組成に近いものが好まし
く、そのようなものとしては例えば、シリカ、アルミ
ナ、酸化鉄（III ）、石灰、マグネシアなどが上げられ
る。なかでもシリカなどの酸化ケイ素を大量に含有して
いるものが、セメントの組成との整合性から好ましく、
エポキシ樹脂組成物中で７０重量％以上、さらに８０重
量％以上であることが好ましい。Of these inorganic fillers, those used as a raw material for cement are preferably close to the cement composition. Examples of such inorganic fillers include silica, alumina, iron (III) oxide, lime and magnesia. To be Among them, those containing a large amount of silicon oxide such as silica are preferable from the viewpoint of compatibility with the composition of cement,
It is preferably 70% by weight or more, and more preferably 80% by weight or more in the epoxy resin composition.

【００１３】さらに、エポキシ樹脂組成物は、電気・電
子部品の封止用に製造されているため、無機充填剤の品
質（例えば、組成、形状、粒子径）が均一で安定してお
り、セメント材料に用いた場合に、セメントの組成を安
定化させることが可能となる。Furthermore, since the epoxy resin composition is manufactured for sealing electric / electronic parts, the quality (for example, composition, shape, particle size) of the inorganic filler is uniform and stable, and When used as a material, it becomes possible to stabilize the composition of cement.

【００１４】本発明のエポキシ樹脂組成物からなるセメ
ント用原料は、電気・電子部品を封止した際に発生した
エポキシ樹脂組成物の不要物であることが好ましい。例
えば、電気・電子部品の規格外品の封止樹脂、また成形
時にカル・ランナーに存在する樹脂、金型でバリとして
発生する樹脂などである。本発明のエポキシ樹脂組成物
からなるセメント用原料は、エポキシ樹脂が未硬化、部
分的に硬化、完全に硬化したものいずれであってもよ
い。The cement raw material comprising the epoxy resin composition of the present invention is preferably an unnecessary substance of the epoxy resin composition generated when the electric / electronic component is sealed. For example, it is a non-standard sealing resin for electric / electronic parts, a resin existing in a cull runner at the time of molding, a resin generated as a burr in a mold, and the like. The raw material for cement made of the epoxy resin composition of the present invention may be any of uncured, partially cured and completely cured epoxy resin.

【００１５】このようなセメント用原料は、５００℃以
上の熱処理、特に燃焼処理することによって、エポキシ
樹脂などの有機成分をなるべく除去してセメント用素材
と利用するのが、最終的に硬化したセメントの強度保持
のために好ましい。セメント用原料は石灰石、粘土およ
び石膏とともに配合され、必要に応じて、ケイ石、酸化
鉄をも配合されて、熱処理されてセメントとなる。Such a cement raw material is subjected to a heat treatment at 500 ° C. or higher, particularly a combustion treatment to remove organic components such as epoxy resin as much as possible to use as a cement raw material. Is preferred for maintaining strength. The raw material for cement is mixed with limestone, clay, and gypsum, and if necessary, silica stone and iron oxide are also mixed and heat-treated to obtain cement.

【００１６】[0016]

【発明の効果】本発明の原料を使用することによって、
セメントの組成が安定化するとともに、電気・電子部品
封止用のエポキシ樹脂組成物の封止後の残査の再利用が
可能となる。By using the raw material of the present invention,
The composition of the cement is stabilized, and the residue of the epoxy resin composition for encapsulating electric / electronic parts after encapsulation can be reused.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 赤羽 高治 千葉県浦安市美浜１丁目８番１号 東レ株 式会社東京事業場内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takaharu Akabane 1-8-1, Mihama, Urayasu, Chiba Toray Co., Ltd. Tokyo office

Claims (7)

【特許請求の範囲】[Claims] 【請求項１】電気・電子部品封止用エポキシ樹脂組成物
からなるセメント用原料。1. A raw material for cement comprising an epoxy resin composition for encapsulating electric / electronic parts. 【請求項２】前記エポキシ樹脂組成物が電気・電子部品
封止工程で発生する不要物である請求項１記載のセメン
ト用原料。2. The raw material for cement according to claim 1, wherein the epoxy resin composition is an unnecessary substance generated in an electric / electronic component sealing step. 【請求項３】電気・電子部品が半導体装置である請求項
１〜２いずれかに記載のセメント用原料。3. The raw material for cement according to claim 1, wherein the electric / electronic component is a semiconductor device. 【請求項４】酸化ケイ素成分を７０重量％以上含有する
請求項１〜３いずれかに記載のセメント用原料。4. The raw material for cement according to claim 1, which contains 70% by weight or more of a silicon oxide component. 【請求項５】アンチモン原子が０．１重量％以下である
請求項１〜４いずれかに記載のセメント用原料。5. The raw material for cement according to claim 1, wherein the content of antimony atom is 0.1% by weight or less. 【請求項６】ハロゲン原子が０．５重量％以下である請
求項１〜５いずれかに記載のセメント用原料。6. The raw material for cement according to claim 1, wherein the halogen atom content is 0.5% by weight or less. 【請求項７】請求項１〜６いずれかのセメント用原料、
石灰石、粘土および石膏を配合してなるセメント。7. A raw material for cement according to claim 1,
A cement made by mixing limestone, clay and gypsum.
JP27036895A 1995-10-18 1995-10-18 Cement raw material and cement Withdrawn JPH09110484A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27036895A JPH09110484A (en) 1995-10-18 1995-10-18 Cement raw material and cement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27036895A JPH09110484A (en) 1995-10-18 1995-10-18 Cement raw material and cement

Publications (1)

Publication Number Publication Date
JPH09110484A true JPH09110484A (en) 1997-04-28

Family

ID=17485296

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27036895A Withdrawn JPH09110484A (en) 1995-10-18 1995-10-18 Cement raw material and cement

Country Status (1)

Country Link
JP (1) JPH09110484A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108352368A (en) * 2015-11-26 2018-07-31 罗伯特·博世有限公司 Method for manufacturing the electric installation with lapping
CN108352367A (en) * 2015-11-26 2018-07-31 罗伯特·博世有限公司 Method for manufacturing the electric equipment with encapsulating shell

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108352368A (en) * 2015-11-26 2018-07-31 罗伯特·博世有限公司 Method for manufacturing the electric installation with lapping
CN108352367A (en) * 2015-11-26 2018-07-31 罗伯特·博世有限公司 Method for manufacturing the electric equipment with encapsulating shell
CN108352367B (en) * 2015-11-26 2021-03-23 罗伯特·博世有限公司 Method for producing an electrical device with an enveloping housing
CN108352368B (en) * 2015-11-26 2021-08-10 罗伯特·博世有限公司 Method for producing an electrical device with a covering material

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