CN1086632A - 简单、实用的电器封装材料 - Google Patents

简单、实用的电器封装材料 Download PDF

Info

Publication number
CN1086632A
CN1086632A CN 92112437 CN92112437A CN1086632A CN 1086632 A CN1086632 A CN 1086632A CN 92112437 CN92112437 CN 92112437 CN 92112437 A CN92112437 A CN 92112437A CN 1086632 A CN1086632 A CN 1086632A
Authority
CN
China
Prior art keywords
sealing material
electric appliance
simply
cement
shi yong
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 92112437
Other languages
English (en)
Inventor
葛少明
李正忠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EZHOU CLOCK FACTORY
Original Assignee
EZHOU CLOCK FACTORY
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EZHOU CLOCK FACTORY filed Critical EZHOU CLOCK FACTORY
Priority to CN 92112437 priority Critical patent/CN1086632A/zh
Publication of CN1086632A publication Critical patent/CN1086632A/zh
Pending legal-status Critical Current

Links

Landscapes

  • Paints Or Removers (AREA)

Abstract

一种电气、电子封装材料，它是单一的水泥，包括 硅酸盐、碳酸钙、火山灰等多种水泥，除具有树脂、沥 青的防湿、防水、防腐性能外，还具有散热性、防火性 好、价格低的优点。

Description

本发明属于电器封装材料。
电气、电子产品中，常常用有机或无机树脂、沥青进行封装，以防湿、防腐、防火、防烟，使器件在不良的使用环境里有较长的使用寿命，或者是为了消除元件之间的干绕，或者是为了保密使其不可拆卸。如环氧树脂封装，它可以防潮、防水，防腐蚀，但它仍有散热性、防火性不好、价格高的缺点，不适合用于需要散热的许多电器。而沥青除散热不好外，还有受热后变形的毛病。
本发明的目的在于克服现在封装材料的缺点，提供一种散热性、防火性好，价格低的电器封装材料。
本发明提供的封装材料是-单一的水泥，它包括硅酸盐，碳酸钙，火山灰等多种水泥。
封装的方法是：将水泥兑入滤除杂质的清水中，搅拌均匀成糊状，然后封装，凝固，如果遇有不能直接接触水的器件，就先做一次防水处理，然后再封装，办法是用漆（清漆、绝缘漆等）或石腊涂一层。水泥凝固后彻底烘干。
例如，对日光灯上用的电感镇流器用水泥封装消除了可能出现的噪音，与树脂相比除能防潮、防水、防尘外，还有散热性好、价格低的优点;对电子式镇流器用水泥封装也有同样的效果。树脂的导热率只有金属的5-10%，而水泥的导热率有金属的50-80%，因而有良好的散热效果，而且成本仅有树脂的1/100-1/1000.

Claims (1)

  1. 一种电器封装材料，其特征在于它是单一的水泥，包括硅酸盐、碳酸钙、火山灰等多种水泥。
CN 92112437 1992-10-31 1992-10-31 简单、实用的电器封装材料 Pending CN1086632A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 92112437 CN1086632A (zh) 1992-10-31 1992-10-31 简单、实用的电器封装材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 92112437 CN1086632A (zh) 1992-10-31 1992-10-31 简单、实用的电器封装材料

Publications (1)

Publication Number Publication Date
CN1086632A true CN1086632A (zh) 1994-05-11

Family

ID=4945951

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 92112437 Pending CN1086632A (zh) 1992-10-31 1992-10-31 简单、实用的电器封装材料

Country Status (1)

Country Link
CN (1) CN1086632A (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1333461C (zh) * 2003-01-15 2007-08-22 奥斯兰姆施尔凡尼亚公司 用于电子元件的封装材料
CN102282343A (zh) * 2008-11-19 2011-12-14 K·D·默里 从大气、工业和机动车燃烧废气中捕获二氧化碳
CN108352367A (zh) * 2015-11-26 2018-07-31 罗伯特·博世有限公司 用于制造具有包封外壳的电设备的方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1333461C (zh) * 2003-01-15 2007-08-22 奥斯兰姆施尔凡尼亚公司 用于电子元件的封装材料
CN102282343A (zh) * 2008-11-19 2011-12-14 K·D·默里 从大气、工业和机动车燃烧废气中捕获二氧化碳
CN102282343B (zh) * 2008-11-19 2014-12-17 K·D·默里 从大气、工业和机动车燃烧废气中捕获二氧化碳
CN108352367A (zh) * 2015-11-26 2018-07-31 罗伯特·博世有限公司 用于制造具有包封外壳的电设备的方法
CN108352367B (zh) * 2015-11-26 2021-03-23 罗伯特·博世有限公司 用于制造具有包封外壳的电设备的方法

Similar Documents

Publication Publication Date Title
CA2057537A1 (en) Heat resistant resin compositions, articles and method
TW342583B (en) Multilayer electronic assembly utilizing a sinterable composition and related method of forming
DE3375695D1 (en) Encapsulation of electronic components with calcium silicate-containing poly(arylene sulfide) compositions
GB2083064B (en) Radiation polymerizable composition for forming heat-resistant relief structures on electrical devices such as semiconductors and capacitors
CA2193903A1 (en) Universal type i.c./non-type i.c. recessed downlight housing can assembly and method for marking the can assembly
KR960701717A (ko) 금속 분말 가열 방법 및 장치(Methods and Apparatus for Heating Metal Powders)
MY118700A (en) Thermosetting resin compositions
CN1086632A (zh) 简单、实用的电器封装材料
CN103788872A (zh) 一种加成型有机硅灌封胶用底涂剂
HU9500486D0 (en) Process for encapsulating a waste material
DE69316891D1 (de) Dampfbarriere
CN103471066A (zh) 一种led模组的密封工艺
TW364919B (en) Thermosetting resin composition
Grady Harmonic power flow studies
CN1117827C (zh) 一种短时高效隔热涂料
CN206329993U (zh) 新型的三防灯结构
RU2089013C1 (ru) Полупроводниковый модуль
CN2153890Y (zh) 微型隔爆接线盒
CN207303506U (zh) 一种防水插座箱
JPS54128276A (en) Resin-sealed semiconductor device
CN207049639U (zh) 一种新型一体化方形三防灯
CN105526530A (zh) 新型led光源
JPS59219996A (ja) 電子機器用筐体
AU4455197A (en) Device for producing hot water by means of solar energy
BG51243A3 (en) Solder for aluminium cables

Legal Events

Date Code Title Description
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C06 Publication
PB01 Publication
C12 Rejection of a patent application after its publication
WD01 Invention patent application deemed withdrawn after publication