MY187337A - Photosensitive resin composition and photosensitive resin laminate - Google Patents
Photosensitive resin composition and photosensitive resin laminateInfo
- Publication number
- MY187337A MY187337A MYUI2018700686A MYUI2018700686A MY187337A MY 187337 A MY187337 A MY 187337A MY UI2018700686 A MYUI2018700686 A MY UI2018700686A MY UI2018700686 A MYUI2018700686 A MY UI2018700686A MY 187337 A MY187337 A MY 187337A
- Authority
- MY
- Malaysia
- Prior art keywords
- photosensitive resin
- alkali
- resin composition
- weight
- soluble polymer
- Prior art date
Links
Landscapes
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Polymerisation Methods In General (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017032102 | 2017-02-23 | ||
JP2018012025A JP7308014B2 (ja) | 2017-02-23 | 2018-01-26 | 感光性樹脂組成物及び感光性樹脂積層体 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY187337A true MY187337A (en) | 2021-09-22 |
Family
ID=63365528
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYUI2018700686A MY187337A (en) | 2017-02-23 | 2018-02-22 | Photosensitive resin composition and photosensitive resin laminate |
Country Status (3)
Country | Link |
---|---|
JP (2) | JP7308014B2 (ja) |
MY (1) | MY187337A (ja) |
TW (1) | TWI664498B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7339111B2 (ja) * | 2018-10-01 | 2023-09-05 | 旭化成株式会社 | マイクロ流路デバイス用感光性樹脂積層体 |
JP7252318B2 (ja) * | 2019-03-26 | 2023-04-04 | 富士フイルム株式会社 | 感光性樹脂組成物、転写フィルム、硬化膜、積層体、及び、タッチパネルの製造方法 |
CN114901454A (zh) * | 2020-01-28 | 2022-08-12 | 昭和电工材料株式会社 | 感光性元件、抗蚀剂图案的形成方法及印刷线路板的制造方法 |
TWI830425B (zh) | 2021-10-25 | 2024-01-21 | 日商旭化成股份有限公司 | 感光性元件、及光阻圖案之形成方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080268374A1 (en) * | 2004-07-14 | 2008-10-30 | Fujifilm Corporation | Photosensitive Composition, Pattern Forming Material, Photosensitive Laminate, Pattern Forming Apparatus, and Pattern Forming Process |
TW200622491A (en) * | 2004-09-28 | 2006-07-01 | Fuji Photo Film Co Ltd | Pattern-forming material, pattern-forming device and pattern-forming method |
JP4500657B2 (ja) * | 2004-11-30 | 2010-07-14 | 旭化成イーマテリアルズ株式会社 | パターン形成材料、並びにパターン形成装置及びパターン形成方法 |
JP2009217040A (ja) * | 2008-03-11 | 2009-09-24 | Fujifilm Corp | 感光性組成物、感光性フィルム、感光性積層体、永久パターン形成方法、及びプリント基板 |
JP6284913B2 (ja) * | 2014-08-29 | 2018-02-28 | 富士フイルム株式会社 | タッチパネル電極保護膜形成用組成物、転写フィルム、積層体、タッチパネル用電極の保護膜及びその形成方法、静電容量型入力装置、並びに、画像表示装置 |
WO2017018053A1 (ja) * | 2015-07-29 | 2017-02-02 | 日立化成株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
TW201707283A (zh) * | 2015-08-13 | 2017-02-16 | 凡甲科技股份有限公司 | 電連接器 |
JP6240288B2 (ja) * | 2016-10-06 | 2017-11-29 | 東芝テック株式会社 | 決済処理装置およびその制御プログラム |
JP2018124436A (ja) | 2017-02-01 | 2018-08-09 | 日立化成株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターンの製造方法、及びプリント配線板の製造方法 |
-
2018
- 2018-01-26 JP JP2018012025A patent/JP7308014B2/ja active Active
- 2018-02-13 TW TW107105177A patent/TWI664498B/zh active
- 2018-02-22 MY MYUI2018700686A patent/MY187337A/en unknown
-
2022
- 2022-03-22 JP JP2022045839A patent/JP7340643B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
TWI664498B (zh) | 2019-07-01 |
JP7308014B2 (ja) | 2023-07-13 |
JP2018136531A (ja) | 2018-08-30 |
TW201835681A (zh) | 2018-10-01 |
JP7340643B2 (ja) | 2023-09-07 |
JP2022082614A (ja) | 2022-06-02 |
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