MY187337A - Photosensitive resin composition and photosensitive resin laminate - Google Patents

Photosensitive resin composition and photosensitive resin laminate

Info

Publication number
MY187337A
MY187337A MYUI2018700686A MYUI2018700686A MY187337A MY 187337 A MY187337 A MY 187337A MY UI2018700686 A MYUI2018700686 A MY UI2018700686A MY UI2018700686 A MYUI2018700686 A MY UI2018700686A MY 187337 A MY187337 A MY 187337A
Authority
MY
Malaysia
Prior art keywords
photosensitive resin
alkali
resin composition
weight
soluble polymer
Prior art date
Application number
MYUI2018700686A
Other languages
English (en)
Inventor
Fujiwara Akira
Matsuda Takayuki
Nishimoto Hideaki
Original Assignee
Asahi Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Ind filed Critical Asahi Chemical Ind
Publication of MY187337A publication Critical patent/MY187337A/en

Links

Landscapes

  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
MYUI2018700686A 2017-02-23 2018-02-22 Photosensitive resin composition and photosensitive resin laminate MY187337A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017032102 2017-02-23
JP2018012025A JP7308014B2 (ja) 2017-02-23 2018-01-26 感光性樹脂組成物及び感光性樹脂積層体

Publications (1)

Publication Number Publication Date
MY187337A true MY187337A (en) 2021-09-22

Family

ID=63365528

Family Applications (1)

Application Number Title Priority Date Filing Date
MYUI2018700686A MY187337A (en) 2017-02-23 2018-02-22 Photosensitive resin composition and photosensitive resin laminate

Country Status (3)

Country Link
JP (2) JP7308014B2 (ja)
MY (1) MY187337A (ja)
TW (1) TWI664498B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7339111B2 (ja) * 2018-10-01 2023-09-05 旭化成株式会社 マイクロ流路デバイス用感光性樹脂積層体
JP7252318B2 (ja) * 2019-03-26 2023-04-04 富士フイルム株式会社 感光性樹脂組成物、転写フィルム、硬化膜、積層体、及び、タッチパネルの製造方法
CN114901454A (zh) * 2020-01-28 2022-08-12 昭和电工材料株式会社 感光性元件、抗蚀剂图案的形成方法及印刷线路板的制造方法
TWI830425B (zh) 2021-10-25 2024-01-21 日商旭化成股份有限公司 感光性元件、及光阻圖案之形成方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080268374A1 (en) * 2004-07-14 2008-10-30 Fujifilm Corporation Photosensitive Composition, Pattern Forming Material, Photosensitive Laminate, Pattern Forming Apparatus, and Pattern Forming Process
TW200622491A (en) * 2004-09-28 2006-07-01 Fuji Photo Film Co Ltd Pattern-forming material, pattern-forming device and pattern-forming method
JP4500657B2 (ja) * 2004-11-30 2010-07-14 旭化成イーマテリアルズ株式会社 パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2009217040A (ja) * 2008-03-11 2009-09-24 Fujifilm Corp 感光性組成物、感光性フィルム、感光性積層体、永久パターン形成方法、及びプリント基板
JP6284913B2 (ja) * 2014-08-29 2018-02-28 富士フイルム株式会社 タッチパネル電極保護膜形成用組成物、転写フィルム、積層体、タッチパネル用電極の保護膜及びその形成方法、静電容量型入力装置、並びに、画像表示装置
WO2017018053A1 (ja) * 2015-07-29 2017-02-02 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
TW201707283A (zh) * 2015-08-13 2017-02-16 凡甲科技股份有限公司 電連接器
JP6240288B2 (ja) * 2016-10-06 2017-11-29 東芝テック株式会社 決済処理装置およびその制御プログラム
JP2018124436A (ja) 2017-02-01 2018-08-09 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの製造方法、及びプリント配線板の製造方法

Also Published As

Publication number Publication date
TWI664498B (zh) 2019-07-01
JP7308014B2 (ja) 2023-07-13
JP2018136531A (ja) 2018-08-30
TW201835681A (zh) 2018-10-01
JP7340643B2 (ja) 2023-09-07
JP2022082614A (ja) 2022-06-02

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