MY179648A - Jet solder height confirmation jig and method for handling same - Google Patents

Jet solder height confirmation jig and method for handling same

Info

Publication number
MY179648A
MY179648A MYPI2019003142A MYPI2019003142A MY179648A MY 179648 A MY179648 A MY 179648A MY PI2019003142 A MYPI2019003142 A MY PI2019003142A MY PI2019003142 A MYPI2019003142 A MY PI2019003142A MY 179648 A MY179648 A MY 179648A
Authority
MY
Malaysia
Prior art keywords
jet
level confirmation
level
confirmation unit
molten solder
Prior art date
Application number
MYPI2019003142A
Other languages
English (en)
Inventor
Ryoichi Suzuki
Yasuji Kawashima
Shigeo Komine
Takashi Sugihara
Henri HANZAWA
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of MY179648A publication Critical patent/MY179648A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
MYPI2019003142A 2016-12-28 2017-11-01 Jet solder height confirmation jig and method for handling same MY179648A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016255939A JP6197942B1 (ja) 2016-12-28 2016-12-28 噴流はんだ高さ確認治具及びその取り扱い方法

Publications (1)

Publication Number Publication Date
MY179648A true MY179648A (en) 2020-11-11

Family

ID=59895604

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019003142A MY179648A (en) 2016-12-28 2017-11-01 Jet solder height confirmation jig and method for handling same

Country Status (4)

Country Link
JP (1) JP6197942B1 (zh)
CN (1) CN110121394B (zh)
MY (1) MY179648A (zh)
WO (1) WO2018123261A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6508299B1 (ja) * 2017-11-29 2019-05-08 千住金属工業株式会社 噴流はんだ高さ確認治具及びその取り扱い方法
JP7230436B2 (ja) * 2018-11-02 2023-03-01 富士フイルムビジネスイノベーション株式会社 はんだ付け装置、基板装置の製造方法
KR20220116185A (ko) * 2019-12-27 2022-08-22 하리마 카세이 가부시키가이샤 납땜재의 도포 방법 및 납땜용 금속 부재의 제조 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6244223U (zh) * 1985-09-04 1987-03-17
JPH026163U (zh) * 1988-06-24 1990-01-16
JP2538007Y2 (ja) * 1990-10-02 1997-06-04 富士通テン株式会社 溶融半田の噴流高さ測定装置
JP2920285B2 (ja) * 1995-06-20 1999-07-19 大阪アサヒ化学株式会社 噴流半田の波高と脈動の測定方法およびその装置
JP2008053655A (ja) * 2006-08-28 2008-03-06 Nihon Dennetsu Keiki Co Ltd はんだ付け装置及びはんだ付け方法
WO2010087374A1 (ja) * 2009-01-27 2010-08-05 千住金属工業株式会社 噴流はんだ槽
WO2010131752A1 (ja) * 2009-05-14 2010-11-18 株式会社デンソー 噴流はんだ槽及びはんだ付け装置
JP5288012B2 (ja) * 2012-01-25 2013-09-11 千住金属工業株式会社 噴流はんだ高さ確認治具及びその取り扱い方法
CN104754881B (zh) * 2013-12-31 2017-07-14 深圳市堃琦鑫华股份有限公司 一种喷流焊焊接方法
CN104754880B (zh) * 2013-12-31 2018-03-06 深圳市堃琦鑫华股份有限公司 喷流焊焊接方法

Also Published As

Publication number Publication date
JP6197942B1 (ja) 2017-09-20
JP2018103256A (ja) 2018-07-05
CN110121394A (zh) 2019-08-13
WO2018123261A1 (ja) 2018-07-05
CN110121394B (zh) 2020-09-18

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