SG11201710511UA - Copper alloy for electronic/electrical device, copper alloy plastically worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar - Google Patents
Copper alloy for electronic/electrical device, copper alloy plastically worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbarInfo
- Publication number
- SG11201710511UA SG11201710511UA SG11201710511UA SG11201710511UA SG11201710511UA SG 11201710511U A SG11201710511U A SG 11201710511UA SG 11201710511U A SG11201710511U A SG 11201710511UA SG 11201710511U A SG11201710511U A SG 11201710511UA SG 11201710511U A SG11201710511U A SG 11201710511UA
- Authority
- SG
- Singapore
- Prior art keywords
- electronic
- electrical device
- copper alloy
- busbar
- terminal
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/02—Single bars, rods, wires, or strips
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015177743 | 2015-09-09 | ||
JP2015235096A JP5910790B1 (en) | 2015-12-01 | 2015-12-01 | Copper alloy for electronic and electric equipment, copper alloy plastic working material for electronic and electric equipment, parts for electronic and electric equipment, terminals, and bus bars |
JP2016069077A JP6187629B1 (en) | 2016-03-30 | 2016-03-30 | Copper alloy for electronic and electric equipment, copper alloy plastic working material for electronic and electric equipment, parts for electronic and electric equipment, terminals, and bus bars |
PCT/JP2016/076376 WO2017043556A1 (en) | 2015-09-09 | 2016-09-08 | Copper alloy for electronic/electrical device, copper alloy plastically worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201710511UA true SG11201710511UA (en) | 2018-03-28 |
Family
ID=58239797
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201710511UA SG11201710511UA (en) | 2015-09-09 | 2016-09-08 | Copper alloy for electronic/electrical device, copper alloy plastically worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar |
Country Status (10)
Country | Link |
---|---|
US (1) | US20180171437A1 (en) |
EP (1) | EP3348656B1 (en) |
KR (1) | KR102474009B1 (en) |
CN (1) | CN107614714B (en) |
MX (1) | MX2018000330A (en) |
MY (1) | MY184755A (en) |
PH (1) | PH12017502294A1 (en) |
SG (1) | SG11201710511UA (en) |
TW (1) | TWI740842B (en) |
WO (1) | WO2017043556A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11203806B2 (en) * | 2016-03-30 | 2021-12-21 | Mitsubishi Materials Corporation | Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay |
FI3438299T3 (en) * | 2016-03-30 | 2023-05-23 | Mitsubishi Materials Corp | Copper alloy plate strip for electronic and electrical equipment, component, terminal, busbar and movable piece for relays |
EP3778941A4 (en) * | 2018-03-30 | 2021-11-24 | Mitsubishi Materials Corporation | Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar |
JP6780187B2 (en) * | 2018-03-30 | 2020-11-04 | 三菱マテリアル株式会社 | Copper alloys for electronic / electrical equipment, copper alloy strips for electronic / electrical equipment, parts for electronic / electrical equipment, terminals, and busbars |
JP6981588B2 (en) * | 2019-11-29 | 2021-12-15 | 三菱マテリアル株式会社 | Copper alloys, plastic working materials for copper alloys, parts for electronic and electrical equipment, terminals, bus bars, heat dissipation boards |
JP7136157B2 (en) * | 2020-06-30 | 2022-09-13 | 三菱マテリアル株式会社 | Copper alloys, copper alloy plastic working materials, parts for electronic and electrical equipment, terminals |
CN114457254B (en) * | 2022-01-13 | 2023-04-07 | 武汉正威新材料科技有限公司 | Preparation method of ultrafine grained copper-magnesium alloy based on combined extrusion and alloy obtained by preparation method |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61284946A (en) * | 1985-06-11 | 1986-12-15 | Mitsubishi Shindo Kk | Cu alloy lead blank for semiconductor device |
JP2661462B2 (en) * | 1992-05-01 | 1997-10-08 | 三菱伸銅株式会社 | Straight line excellent in repeated bending property: Cu alloy ultrafine wire of 0.1 mm or less |
JP3796784B2 (en) * | 1995-12-01 | 2006-07-12 | 三菱伸銅株式会社 | Copper alloy thin plate for manufacturing connectors and connectors manufactured with the thin plates |
JP4756197B2 (en) * | 2005-08-23 | 2011-08-24 | Dowaメタルテック株式会社 | Cu-Mg-P-based copper alloy and method for producing the same |
JP5260992B2 (en) * | 2008-03-19 | 2013-08-14 | Dowaメタルテック株式会社 | Copper alloy sheet and manufacturing method thereof |
JP4516154B1 (en) * | 2009-12-23 | 2010-08-04 | 三菱伸銅株式会社 | Cu-Mg-P copper alloy strip and method for producing the same |
JP5045783B2 (en) | 2010-05-14 | 2012-10-10 | 三菱マテリアル株式会社 | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, and rolled copper alloy material for electronic equipment |
JP5908796B2 (en) * | 2012-06-05 | 2016-04-26 | 三菱伸銅株式会社 | Cu-Mg-P-based copper alloy plate excellent in mechanical formability and method for producing the same |
JP6055242B2 (en) * | 2012-08-30 | 2016-12-27 | 三菱伸銅株式会社 | Cu-Mg-P-based copper alloy Sn plated plate and method for producing the same |
JP6076724B2 (en) | 2012-12-06 | 2017-02-08 | 古河電気工業株式会社 | Copper alloy material and method for producing the same |
JP5962707B2 (en) * | 2013-07-31 | 2016-08-03 | 三菱マテリアル株式会社 | Copper alloy for electronic / electric equipment, copper alloy plastic working material for electronic / electric equipment, manufacturing method of copper alloy plastic working material for electronic / electric equipment, electronic / electric equipment parts and terminals |
SG11201705831UA (en) * | 2015-09-09 | 2017-08-30 | Mitsubishi Materials Corp | Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar |
KR102474714B1 (en) * | 2015-09-09 | 2022-12-05 | 미쓰비시 마테리알 가부시키가이샤 | Copper alloy for electronic/electrical device, copper alloy plastically worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar |
-
2016
- 2016-09-08 MY MYPI2017705081A patent/MY184755A/en unknown
- 2016-09-08 TW TW105129156A patent/TWI740842B/en active
- 2016-09-08 EP EP16844417.2A patent/EP3348656B1/en active Active
- 2016-09-08 SG SG11201710511UA patent/SG11201710511UA/en unknown
- 2016-09-08 WO PCT/JP2016/076376 patent/WO2017043556A1/en active Application Filing
- 2016-09-08 CN CN201680032070.2A patent/CN107614714B/en active Active
- 2016-09-08 MX MX2018000330A patent/MX2018000330A/en unknown
- 2016-09-08 KR KR1020177030942A patent/KR102474009B1/en active IP Right Grant
- 2016-09-08 US US15/737,642 patent/US20180171437A1/en not_active Abandoned
-
2017
- 2017-12-13 PH PH12017502294A patent/PH12017502294A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP3348656A1 (en) | 2018-07-18 |
MY184755A (en) | 2021-04-20 |
KR102474009B1 (en) | 2022-12-02 |
EP3348656A4 (en) | 2019-05-15 |
MX2018000330A (en) | 2018-04-20 |
TW201730349A (en) | 2017-09-01 |
US20180171437A1 (en) | 2018-06-21 |
TWI740842B (en) | 2021-10-01 |
KR20180043197A (en) | 2018-04-27 |
PH12017502294A1 (en) | 2018-06-11 |
EP3348656B1 (en) | 2020-12-30 |
CN107614714B (en) | 2020-09-11 |
CN107614714A (en) | 2018-01-19 |
WO2017043556A1 (en) | 2017-03-16 |
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