MY167525A - Jet solder level checking jig and method of handing the same - Google Patents

Jet solder level checking jig and method of handing the same

Info

Publication number
MY167525A
MY167525A MYPI2014001174A MYPI2014001174A MY167525A MY 167525 A MY167525 A MY 167525A MY PI2014001174 A MYPI2014001174 A MY PI2014001174A MY PI2014001174 A MYPI2014001174 A MY PI2014001174A MY 167525 A MY167525 A MY 167525A
Authority
MY
Malaysia
Prior art keywords
side electrode
level
molten solder
jet
led display
Prior art date
Application number
MYPI2014001174A
Inventor
Yasuji Kawashima
Takanori Kudou
Shigeo Komine
Takashi Sugihara
Henri HANZAWA
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of MY167525A publication Critical patent/MY167525A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
    • G01F23/24—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of resistance of resistors due to contact with conductor fluid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/04—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by dip members, e.g. dip-sticks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
    • G01F23/24—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of resistance of resistors due to contact with conductor fluid
    • G01F23/245—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of resistance of resistors due to contact with conductor fluid with a probe moved by an auxiliary power, e.g. meter, to follow automatically the level
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Abstract

A JET SOLDER LEVEL CHECKING JIG (100) HAS, AS SHOWN IN 1, A CONDUCTIVE GAUGE MEMBER (10) FOR EXECUTING AT LEAST ONE OF SETTING AND MEASUREMENT OF A LEVEL OF THE JET WAVE OF MOLTEN SOLDER (7), A SLIDABLE HOLD MEMBER (20) HAVING A MINUS SIDE ELECTRODE (21A, 21B) AND A PLUS SIDE ELECTRODE (22) AND HOLDING THE GAUGE MEMBER (10) IN A SLIDABLY CONTACT MANNER WITH THE GAUGE MEMBER (10) BEING SLIDABLY CONNECTED TO THE MINUS SIDE ELECTRODE (21A, 21B), AN LED DISPLAY MEMBER (30) PROVIDED AT THE SLIDABLE HOLD MEMBER (20) AND CONNECTED TO MINUS SIDE ELECTRODE (21A, 21B) FOR CHECKING A TOUCHING OPERATION, AND A CONDUCTIVE BRIDGE MEMBER (40) HAVING A LENGTH ENOUGH TO BRIDGE BETWEEN METAL MEMBERS (51, 52) AT AN UPPER PORTION OF A VESSEL RECEIVING THE MOLTEN SOLDER (7), BEING SLIDABLY CONNECTING WITH THE PLUS SIDE ELECTRODE (22) CONNECTED TO THE LED DISPLAY MEMBER (30) AND SUPPORTING THE SLIDABLE HOLD MEMBER (20). THE GAUGE MEMBER (10) AND THE MOLTEN SOLDER (7) JET WAVE ACT AS A DRIVE SWITCH (CONTACT POINTS) OF THE LED DISPLAY MEMBER (30). AS A RESULT THEREOF, WHEN THE LEVEL OF THE JET WAVE OF THE MOLTEN SOLDER (7) IS ADJUSTED, A CONDITION THAT THE LEVEL OF THE JET WAVE OF THE MOLTEN SOLDER (7) REACHES A TARGET JET LEVEL CAN BE CHECKED BY A BLINKING OF THE EMITTED LIGHT COLOR, AN INTERMITTENT BEEP SOUND OR THE LIKE. 1
MYPI2014001174A 2012-01-25 2013-01-16 Jet solder level checking jig and method of handing the same MY167525A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012013020A JP5288012B2 (en) 2012-01-25 2012-01-25 Jet solder height confirmation jig and its handling method

Publications (1)

Publication Number Publication Date
MY167525A true MY167525A (en) 2018-09-05

Family

ID=48873372

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014001174A MY167525A (en) 2012-01-25 2013-01-16 Jet solder level checking jig and method of handing the same

Country Status (4)

Country Link
JP (1) JP5288012B2 (en)
CN (1) CN103958105B (en)
MY (1) MY167525A (en)
WO (1) WO2013111651A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2507719A (en) 2012-09-25 2014-05-14 Pillarhouse Int Ltd Method and apparatus for improving selective soldering
JP6197942B1 (en) * 2016-12-28 2017-09-20 千住金属工業株式会社 Jet solder height confirmation jig and its handling method
CN110167706B (en) * 2017-01-12 2021-05-25 三菱电机株式会社 Solder jet inspection device and solder jet inspection method
JP6844021B2 (en) * 2017-10-18 2021-03-17 三菱電機株式会社 Soldering equipment, soldering method and manufacturing method of wiring board with parts
JP6508299B1 (en) 2017-11-29 2019-05-08 千住金属工業株式会社 Jet solder height confirmation jig and its handling method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58100966A (en) * 1981-12-12 1983-06-15 Fujitec Co Ltd Adjusting method for ejecting height of solder of automatic soldering device
JPS6195768A (en) * 1984-10-17 1986-05-14 Kojima Press Co Ltd Method for adjusting ejection height of solder in solder tank
JPH026163U (en) * 1988-06-24 1990-01-16
JPH04100673A (en) * 1990-08-10 1992-04-02 Olympus Optical Co Ltd Solder height measuring instrument for jet solder tank
MY111173A (en) * 1991-11-05 1999-09-30 Matsushita Electric Ind Co Ltd Jig for detecting height of wavy solder surface, method of controlling height of solder surface, soldering apparatus, jig for detecting warp of printed circuit board, and method of producing circuit board
JP2914810B2 (en) * 1992-03-09 1999-07-05 ダイハツ工業株式会社 Molten metal jet wave height measuring device
JPH07131143A (en) * 1993-10-29 1995-05-19 Matsushita Electric Ind Co Ltd Wave soldering vessel
JP2001251048A (en) * 2000-03-07 2001-09-14 Sony Corp Method of detecting height of secondary jet solder in jet soldering and printed wiring board having detection means
JP2003290915A (en) * 2002-04-05 2003-10-14 Canon Inc Method and apparatus for measuring parallelism between jet wave height and substrate to be soldered
CN201009029Y (en) * 2006-12-08 2008-01-23 张淑美 Automatic stannum applying device of wave top welding machine
CN202041855U (en) * 2011-01-12 2011-11-16 东莞市石碣益诚自动化设备厂 Automatic detection device of soldering machine tin surface

Also Published As

Publication number Publication date
JP2013151004A (en) 2013-08-08
JP5288012B2 (en) 2013-09-11
CN103958105A (en) 2014-07-30
WO2013111651A1 (en) 2013-08-01
CN103958105B (en) 2016-01-06

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