JP2003290915A - Method and apparatus for measuring parallelism between jet wave height and substrate to be soldered - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a measurement method and an apparatus for enhancing parallelism between the jet wave height of a flow soldering apparatus and a substrate to be soldered. <P>SOLUTION: A measuring apparatus includes arms 4a and 4b freely movable in the width direction of the substrate to be soldered. Measuring terminals 6a, 6b, 6c and 6d which can indicate energization arranged at the tip parts of the arms are provided at both sides of the movable arms. The height of the movable arms is freely adjusted by using a vertically moving slider 2 provided separately, and the jet wave height and the parallelism relative to the substrate to be soldered can be confirmed. Since the measuring terminals are made to indicate energization, the jet wave height and the tilt of a solder tank can be automatically adjusted by a controller part provided separately. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for identifying the height of a jet wave of a flow soldering device for soldering a substrate to be soldered and the parallelism between the substrate to be soldered and the jet wave.

[0002]

2. Description of the Related Art Conventionally, there is a flow (jet type) soldering device as an automatic soldering device for soldering various electronic components such as radial and axial type lead components to a wiring board.

FIG. 3 shows an example of the above flow soldering device. In the flow soldering device main body 31, a flux coating device 32 is installed on the inlet side below the transport rail 11 and a wiring board. A flux is applied to the soldering surface side of the soldering substrate 12 into which the electronic component (not shown) is inserted.

Since the flux applied to the substrate 12 to be soldered contains a solvent, the preheating heater 33
It is heated and dried at. In this state, the molten solder contained in the solder bath 14 is pressure-fed by a pump provided in a chamber (not shown) and blown out from an ejection port 35 provided above the ejection pipes 34a and 34b. A land surface (not shown) on the soldering surface side of the attachment substrate 12,
It is to solder the leads of parts, and at the end,
A cooling fan 36 for cooling is installed.

[0005]

However, in the above-mentioned conventional example, when soldering is performed, the soldering quality greatly changes due to the difference in the blowing height of the solder jet wave blown from the jet port 35 of FIG.

That is, when soldering the substrate 12 to be soldered by the flow soldering apparatus, if the height of the jet wave due to jetting is too high, the upper surface of the substrate 12 to be soldered will be covered with solder, and Solder adheres to necessary parts, causing various troubles.

On the other hand, if the jet wave is too low, the solder does not reach the soldered portion, causing defects in the unsoldered portion.

For this reason, there is an increasing demand for adjusting the height of the jet wave, and it is disclosed in JP-A-5-245626 and JP-A-1.
Various methods have been considered and proposed, as can be seen in Japanese Patent Publication No. 0-153473. According to these, the height control of the jet wave has improved considerably, but in both cases,
This is only an idea from the viewpoint of the jet wave, and in the actual flow soldering apparatus, the transfer rail 11 shown in FIG. It is important how parallel the jet waves are, and if this parallelism is not controlled, considering the recent miniaturization of electronic parts, etc.
High quality soldering is not available.

However, in the former case of the above-mentioned proposal, the jet paper is originally measured according to the width dimension of the substrate 12 to be soldered by a method of locally measuring the height of the jet wave, and the jet paper is provided in this width direction. Depending on how dirty the ejection port 35 is, the ejection height of the solder may vary. Adjustment for this is difficult.

On the other hand, in the latter case, considering the installation location of the sensor and the like, as in the former case, only the height of the jet wave at the extreme part is adjusted, and the adjustment is similarly difficult.

[0011]

[Means for Solving the Problems] To achieve the above object,
The present application shows the simplified measuring device shown in FIG. 1 in FIG. It is characterized in that it can be installed right above the jet wave 13 of the flow soldering device.

The first invention according to the present application is a substrate to be soldered 12 carried by a carrier rail 11 of FIG.
However, it is possible to confirm the height position when it comes directly above the jet wave 13, and the second aspect of the present invention is that the measuring terminals 6 have 6a and 6b and 6c and 6d in contact with the jet wave 13. For confirmation, it is possible to display an energization (not shown).

The third aspect of the present invention is a substrate to be soldered 12
On the other hand, the difference in the height of the jet wave 13 in the width direction can be measured.

That is, the measuring terminals 6a and 6b, 6c and 6d.
The confirmation can be easily performed by confirming the display state of the energization display (not shown) on the side.

Further, in the fourth invention, an electric linear scale is installed in place of the scale 8 provided on the vertical movement slider 2, and a height adjusting drive motor (not shown) is provided under the solder bath 14 as a carrier rail. 11a and 11b are provided on both sides with respect to 11 and are provided on the measuring terminals 6a and 6b and 6c and 6d.
By connecting a signal indicating whether or not to contact the jet wave 13 of the jet wave 13 to the control unit provided with a control mechanism inside the energization display unit (not shown) by the wiring 9, the height of the jet wave 13 and The purpose is to always keep the parallel to the soldering substrate 12.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION (First Embodiment) An embodiment of the present invention will be described below with reference to the accompanying drawings. FIG. 1 shows a jet wave 13 of a flow soldering apparatus according to the embodiment.
FIG. 3 is an external view showing a height (of FIG. 2) and a parallelism measuring device with a substrate 11 to be soldered.

This apparatus comprises a width direction adjusting arm 4a, a height direction adjusting arm 4b6, and a vertical movement slider 2 which are attached to a movable portion 3 of a vertical movement slider 2 which is fixed to a central portion of an attachment body arm. A vertical drive motor 4 for moving the movable part 3 is basically configured, and a measuring terminal 6 which can be electrically sensed is attached to the tip of the height direction adjusting arm 4b.

The mounting surfaces A and A'of the mounting main body arm of the measuring device shown in FIG. 1 were placed on B and B'of the flow soldering device shown in FIG. 2 and aligned with the jet wave 13. Fix it later.

After fixing, the measuring terminal 6 is lifted above the vertical slider 2 by the vertical drive motor 4.

In this state, the substrate 11 to be soldered is conveyed to the position below the measuring terminal 6 by the conveying rail 10 and stopped, and the measuring terminal 6 is moved to the substrate 1 to be soldered 1 by the vertical drive motor 4.
1 and then loosening the fixing bolts 7b and 7c to bring all the measuring terminals 6a, b, c and d into contact with the soldered substrate 11, and then fixing bolts 7b and 7c.
After tightening and fixing e, the vertical drive motor 4 moves it again to the upper part of the vertical movement slider 2.

Next, after the substrate 11 to be soldered is discharged by the transport rail 10, the measuring terminal 6 is moved up and down by the motor 4 for driving.
Then, the scale 8 is adjusted by the vertical drive motor 4 so that the solder jet wave 13 reaches the set value. While confirming the contact state of each R of the measurement terminals 6a and 6b and 6c and 6d with the jet wave 13, the height of jet of the jet wave 13 and the solder bath 12 are checked while confirming the wiring 9 on the not-shown energization display section. The setting can be surely made by adjusting the inclination (parallelism) adjustment of (1) by an adjusting unit (not shown).

Further, the height irregularity or inclination of the jet wave 13 caused by the decrease in the amount of solder or the contamination of the jet outlet 38 (in FIG. 3) due to the oxide due to the continuous work is taken into the soldered substrate 11 (not shown). In addition, it is possible to check periodically using a sensor that can detect the discharge signal, it is possible to accurately grasp the difference from the initial setting value, easy adjustment, and high quality soldering becomes possible. .

Table 1 below shows the situation when the soldered substrate 11 is a double-sided mounting type controller board that is flow soldered.

[0024]

[Table 1]

The fact that the number of bridges is drastically reduced from the above Table 1 is because the solder breakage is performed uniformly, and this indicates that the waves to be soldered and the jet wave 13 are parallel. This is because the effect of the present invention is greatly obtained.

[0026]

As described above, according to the present invention,
By providing both measuring terminals in the width direction of the soldered board, the contact state with good parallelism with the jet wave of the solder of the flow soldering device can be accurately set and output based on the soldered board. It was

Further, the generation of jet waves due to the generation of dross in the ejection port and the solder bath due to continuous use can be accurately grasped, and correction is easy.

[Brief description of drawings]

FIG. 1 is an external view of a device for measuring the height of a jet wave and the parallelism with a soldering substrate.

FIG. 2 is a perspective view showing a part of the flow soldering device and a pedestal part of the measuring device.

FIG. 3 is an external view showing the structure of a conventional flow soldering device.

[Explanation of symbols]

1 Body arm for mounting 2 Vertical slider 3 moving parts 4a Width adjustment arm 4b Height adjustment arm 5 Vertical drive motor 6a, 6b, 6c Measuring terminal 7a, 7b, 7c Fixing bolt 8 scale 9 wiring 10a, 10b Delivery rail fixing frame 11 Transport rail 12 Soldered substrate 13 Jet Wave 14 Solder bath A, A'mounting surface B, B'mounting base 31 Flow soldering machine body 32 Flux coating device 33 Preheating heater 34a, 34b Ejection pipe 35 spout 36 Cooling fan

Claims (5)

[Claims] 1. A flow soldering apparatus is provided with measurement terminals in contact with a jet wave on both sides of an arm capable of moving within a predetermined range. Measuring device. 2. The measuring device according to claim 1, wherein the height condition directly above the jet wave of the substrate to be soldered can be confirmed by the measuring terminals provided on both sides of the movable arm. 3. A measuring terminal provided at the tip of the movable arm,
2. The measuring device according to claim 1, wherein two pieces are paired with each other so that electricity can be displayed on the pair to confirm contact with the jet wave. 4. A measuring terminal provided at the tip of the movable arm
The measuring device according to claim 1, wherein a pair of books are provided on both sides of the movable arm, and the height and the inclination of the jet wave can be confirmed by displaying electricity. 5. The amount of movement in the height direction is provided with an electric linear scale and also with a control mechanism, and the height and inclination of the jet wave can be automatically adjusted by performing control in combination with a measurement terminal that can be energized. The measuring device according to claim 1, which is configured as described above.