MY176791A - Cleaning device and roll cleaning member - Google Patents

Cleaning device and roll cleaning member

Info

Publication number
MY176791A
MY176791A MYPI2016704827A MYPI2016704827A MY176791A MY 176791 A MY176791 A MY 176791A MY PI2016704827 A MYPI2016704827 A MY PI2016704827A MY PI2016704827 A MYPI2016704827 A MY PI2016704827A MY 176791 A MY176791 A MY 176791A
Authority
MY
Malaysia
Prior art keywords
substrate
cleaning
roll cleaning
roll
protruding members
Prior art date
Application number
MYPI2016704827A
Other languages
English (en)
Inventor
Tomoatsu Ishibashi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of MY176791A publication Critical patent/MY176791A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B13/00—Brushes with driven brush bodies or carriers
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B13/00—Brushes with driven brush bodies or carriers
    • A46B13/001—Cylindrical or annular brush bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P52/00—
    • H10P52/402—
    • H10P70/20—
    • H10P72/0412—
    • H10P72/0414—
    • H10P72/7618—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02096—Cleaning only mechanical cleaning
    • H10P70/277—
    • H10P70/60—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Rolls And Other Rotary Bodies (AREA)
  • Cleaning In General (AREA)
MYPI2016704827A 2014-07-04 2015-07-01 Cleaning device and roll cleaning member MY176791A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014138685 2014-07-04
JP2015129639A JP6366544B2 (ja) 2014-07-04 2015-06-29 洗浄装置及びロール洗浄部材
PCT/JP2015/003314 WO2016002219A1 (ja) 2014-07-04 2015-07-01 洗浄装置及びロール洗浄部材

Publications (1)

Publication Number Publication Date
MY176791A true MY176791A (en) 2020-08-21

Family

ID=55018792

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016704827A MY176791A (en) 2014-07-04 2015-07-01 Cleaning device and roll cleaning member

Country Status (8)

Country Link
US (1) US10453708B2 (enExample)
JP (1) JP6366544B2 (enExample)
KR (1) KR102282899B1 (enExample)
CN (1) CN106663620B (enExample)
MY (1) MY176791A (enExample)
SG (1) SG11201700026XA (enExample)
TW (1) TWI686868B (enExample)
WO (1) WO2016002219A1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10269555B2 (en) 2015-09-30 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Post-CMP cleaning and apparatus
CN111566784B (zh) * 2018-01-09 2024-03-26 东京毅力科创株式会社 清洗装置、清洗方法以及计算机存储介质
USD923890S1 (en) * 2018-09-07 2021-06-29 Maradyne Corporation Mattress surface cleaning agitator
CN109007900B (zh) * 2018-09-20 2023-09-12 安徽科技学院 一种海带无损伤清洗装置及其清洗方法
US11745227B2 (en) * 2019-01-31 2023-09-05 Applied Materials, Inc. Substrate cleaning devices and methods thereof
USD906681S1 (en) * 2019-03-11 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD906682S1 (en) * 2019-03-11 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD906683S1 (en) * 2019-03-11 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD897111S1 (en) * 2019-03-11 2020-09-29 Ali Ebrahimi Afrouzi Side brush
USD906680S1 (en) * 2019-03-11 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD897112S1 (en) * 2019-03-25 2020-09-29 Ali Ebrahimi Afrouzi Side brush
USD906684S1 (en) * 2019-03-28 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD906685S1 (en) * 2019-04-02 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD907370S1 (en) * 2019-04-05 2021-01-12 Ali Ebrahimi Afrouzi Side brush
USD907925S1 (en) * 2019-04-23 2021-01-19 Ali Ebrahimi Afrouzi Side brush
USD897113S1 (en) * 2019-04-25 2020-09-29 Ali Ebrahimi Afrouzi Side brush
USD906686S1 (en) * 2019-04-30 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD907371S1 (en) * 2019-05-03 2021-01-12 Ali Ebrahimi Afrouzi Side brush
USD907926S1 (en) * 2019-06-10 2021-01-19 Ali Ebrahimi Afrouzi Side brush
USD907372S1 (en) * 2019-06-10 2021-01-12 Ali Ebrahimi Afrouzi Side brush
CN111790682B (zh) * 2020-06-30 2022-06-28 鹰潭拓新机电股份有限公司 一种模具零件清洗装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3403108B2 (ja) 1999-02-26 2003-05-06 アイオン株式会社 洗浄用スポンジローラ
US6502273B1 (en) 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
US6299698B1 (en) 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
JP2000270929A (ja) * 1999-03-26 2000-10-03 Shibaura Mechatronics Corp 洗浄用ブラシ
CN1863645B (zh) * 2003-08-08 2011-11-30 安格斯公司 用于制作浇注在可旋转基体上的整体式多孔垫的方法和材料
US20050109371A1 (en) * 2003-10-27 2005-05-26 Applied Materials, Inc. Post CMP scrubbing of substrates
JP2006075718A (ja) * 2004-09-09 2006-03-23 Aion Kk 弾性ローラ
JP2008311481A (ja) * 2007-06-15 2008-12-25 Sony Corp 基板洗浄方法、基板洗浄装置及び半導体製造方法
JP2009066527A (ja) * 2007-09-13 2009-04-02 Nec Electronics Corp 洗浄用ローラおよび洗浄装置
US20100043160A1 (en) * 2008-08-20 2010-02-25 United Microelectronics Corp. Wafer cleaning roller
JP5977175B2 (ja) 2010-02-22 2016-08-24 インテグリス・インコーポレーテッド Ｃｍｐ後の洗浄ブラシ
JP5535687B2 (ja) 2010-03-01 2014-07-02 株式会社荏原製作所 基板洗浄方法及び基板洗浄装置
JP2011233646A (ja) * 2010-04-26 2011-11-17 Sumitomo Metal Mining Co Ltd 半導体用基板の洗浄方法

Also Published As

Publication number Publication date
TWI686868B (zh) 2020-03-01
KR20170029536A (ko) 2017-03-15
KR102282899B1 (ko) 2021-07-27
TW201604962A (zh) 2016-02-01
SG11201700026XA (en) 2017-02-27
CN106663620A (zh) 2017-05-10
US20170170034A1 (en) 2017-06-15
JP6366544B2 (ja) 2018-08-01
US10453708B2 (en) 2019-10-22
CN106663620B (zh) 2020-03-27
JP2016027641A (ja) 2016-02-18
WO2016002219A1 (ja) 2016-01-07

Similar Documents

Publication Publication Date Title
MY176791A (en) Cleaning device and roll cleaning member
GB202105197D0 (en) Rotating plate structure, mopping device, and robot
GB2567023B (en) Surface cleaning apparatus
EP3364844A4 (en) SURFACE CLEANING HEAD WITH TWO ROTATING STIRRERS
GB2548010B (en) Surface cleaning apparatus
SG10201700888YA (en) Elastic membrane, substrate holding apparatus, and polishing apparatus
DK3227297T3 (da) 4,6-substitueret-pyrazolo[1,5-a]pyraziner som janus kinase-inhibitorer
GB2587127B (en) Gas-liquid contact apparatus
SG10201912088UA (en) Substrate cleaning device
MY178652A (en) Roll-type processing member, pencil-type processing member, and substrate processing apparatus including any one of these
WO2017097988A8 (de) Vorrichtung und verfahren zur reinigung von espressomaschinen
EP3285285A4 (en) Cleaning liquid for material comprising carbon-containing silicon oxide for wafer recycling, and cleaning method
SG11201703375WA (en) Substrate cleaning roll, substrate cleaning apparatus, and substrate cleaning method
SG10201502914YA (en) Method For Drying Wafer Substrates And Wafer Holder For Conduction Of The Method
GB2566833B (en) Surface Cleaning Apparatus
EP3400266A4 (en) POLISHING METHOD FOR A SUBSTRATE WITH LOW ELECTRICITY CONSTANT
EP3482415A4 (en) Substrate carrier
GB201617518D0 (en) Surface cleaning apparatus
SG11201706200UA (en) A fall-proof apparatus for cleaning semiconductor devices and a chamber with the apparatus
EP3186351C0 (de) Vollwaschmitteltuch mit waschaktivem substrat
SG11201708086UA (en) Cleaning member and substrate cleaning apparatus
GB2554934B (en) Surface cleaning apparatus
KR102646598B9 (ko) 기판세정장치
HK1198096A2 (en) Improved surface cleaning device
GB2568179B (en) Surface cleaning apparatus