MY175198A - Copper foil excellent in adherence with resin, method for manufacturing the copper foil, and printed wiring board or battery negative electrode material using the electrolytic copper foil - Google Patents

Copper foil excellent in adherence with resin, method for manufacturing the copper foil, and printed wiring board or battery negative electrode material using the electrolytic copper foil

Info

Publication number
MY175198A
MY175198A MYPI2014700775A MYPI2014700775A MY175198A MY 175198 A MY175198 A MY 175198A MY PI2014700775 A MYPI2014700775 A MY PI2014700775A MY PI2014700775 A MYPI2014700775 A MY PI2014700775A MY 175198 A MY175198 A MY 175198A
Authority
MY
Malaysia
Prior art keywords
copper foil
electrolytic copper
resin
negative electrode
printed wiring
Prior art date
Application number
MYPI2014700775A
Inventor
Michiya Kohiki
Terumasa Moriyama
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY175198A publication Critical patent/MY175198A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/66—Selection of materials
    • H01M4/661—Metal or alloys, e.g. alloy coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/70—Carriers or collectors characterised by shape or form
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/05—Accumulators with non-aqueous electrolyte
    • H01M10/052—Li-accumulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M2004/026—Electrodes composed of, or comprising, active material characterised by the polarity
    • H01M2004/027—Negative electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

An electrolytic copper foil is prepared by forming roughening particles on the mat surface (M surface) of an electrolytic copper foil, and the ?average particle size of the roughening particles is 0.1 to 1.0 ?m. An electrolytic copper foil in which the adhesive strength of the copper foil with a resin base material can be raised by improving a roughening..:treated layer on the copper foil without deteriorating various properties of the electrolytic copper foil, and a higher peel strength can be provided particularly when the copper foil is used in combination with semiconductor package base materials and liquid crystal polymer base materials, which usually have a low adhesive force with copper foils as compared to general-purpose epoxy resin-based base materials (FR-4 and and the like), and a method for manufacturing the electrolytic copper foil are provided. An object of the present invention is to provide an electrolytic copper foil which is useful as an electrolytic copper foil used for printed wiring boards or battery (LiB and the like) negative electrode materials. Figure 1
MYPI2014700775A 2011-09-30 2012-09-18 Copper foil excellent in adherence with resin, method for manufacturing the copper foil, and printed wiring board or battery negative electrode material using the electrolytic copper foil MY175198A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011216623 2011-09-30

Publications (1)

Publication Number Publication Date
MY175198A true MY175198A (en) 2020-06-15

Family

ID=47995304

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014700775A MY175198A (en) 2011-09-30 2012-09-18 Copper foil excellent in adherence with resin, method for manufacturing the copper foil, and printed wiring board or battery negative electrode material using the electrolytic copper foil

Country Status (7)

Country Link
JP (1) JP6029590B2 (en)
KR (3) KR102059280B1 (en)
CN (1) CN103857833B (en)
MY (1) MY175198A (en)
PH (1) PH12014500716A1 (en)
TW (1) TWI605735B (en)
WO (1) WO2013047272A1 (en)

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TWI515342B (en) * 2013-09-05 2016-01-01 三井金屬鑛業股份有限公司 Surface-treated copper foil, and copper clad laminate and printed wiring board obtained by using the same
TWI616122B (en) * 2014-05-28 2018-02-21 Jx Nippon Mining & Metals Corp Surface-treated copper foil, copper foil with carrier, laminated body, printed wiring board, electronic device, method for producing surface-treated copper foil, and method for producing printed wiring board
JP6323261B2 (en) * 2014-08-29 2018-05-16 住友金属鉱山株式会社 Manufacturing method of flexible copper wiring board and flexible copper-clad laminate with support film used therefor
JP5972486B1 (en) * 2014-09-05 2016-08-17 古河電気工業株式会社 Copper foil, copper clad laminate, and substrate
KR101852671B1 (en) 2015-01-21 2018-06-04 제이엑스금속주식회사 Copper foil with carrier, laminate, printed circuit board and method of manufacturing printed circuit board
MY186266A (en) * 2015-03-31 2021-07-01 Mitsui Mining & Smelting Co Ltd Roughened copper foil, copper foil provided with carrier, copper-clad laminated sheet, and printed wiring board
JP6083619B2 (en) * 2015-07-29 2017-02-22 福田金属箔粉工業株式会社 Processed copper foil for low dielectric resin substrate, copper-clad laminate and printed wiring board using the treated copper foil
JPWO2017051897A1 (en) * 2015-09-24 2018-08-30 Ｊｘ金属株式会社 Metal foil, metal foil with release layer, laminate, printed wiring board, semiconductor package, electronic device and method for manufacturing printed wiring board
KR20170038969A (en) * 2015-09-30 2017-04-10 일진머티리얼즈 주식회사 Surface-treated Copper Foil for PCB having fine-circuit pattern and Method of manufacturing of the same
US12302504B2 (en) * 2016-10-06 2025-05-13 Mitsui Mining & Smelting Co., Ltd. Production method for multilayer wiring board
JP7492807B2 (en) * 2016-12-06 2024-05-30 Ｊｘ金属株式会社 Surface-treated copper foil, carrier-attached copper foil, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
JP7193915B2 (en) * 2017-02-03 2022-12-21 Ｊｘ金属株式会社 Surface-treated copper foil and current collector, electrode and battery using the same
JP6550196B2 (en) * 2017-07-24 2019-07-24 古河電気工業株式会社 Surface-treated copper foil, and copper-clad laminate and printed wiring board using the same
US11781236B2 (en) * 2017-11-10 2023-10-10 Namics Corporation Composite copper foil
JP7056167B2 (en) * 2018-01-23 2022-04-19 株式会社豊田自動織機 Power storage module and manufacturing method of power storage module
TWI679314B (en) 2018-06-07 2019-12-11 國立中興大學 Method for manufacturing copper foil with rough surface in single plating tank and its product
JP6845382B1 (en) * 2019-06-07 2021-03-17 古河電気工業株式会社 Surface-treated copper foil, copper-clad laminate, and printed wiring board
TWM593711U (en) * 2019-06-12 2020-04-11 金居開發股份有限公司 Advanced reverse electrolytic copper foil and copper foil substrate thereof
TWI776168B (en) * 2019-06-19 2022-09-01 金居開發股份有限公司 Advanced reverse-treated electrodeposited copper foil and copper clad laminate using the same
JP7392996B2 (en) * 2019-06-19 2023-12-06 金居開發股▲分▼有限公司 Advanced electrolytic copper foil and copper-clad laminates using it
JP7421208B2 (en) * 2019-12-24 2024-01-24 日本電解株式会社 Surface treated copper foil and its manufacturing method
CN112469194B (en) * 2020-11-27 2022-08-05 广东嘉元科技股份有限公司 Low-profile electrolytic copper foil for high-density interconnected circuit board
WO2022153580A1 (en) * 2021-01-15 2022-07-21 Ｊｘ金属株式会社 Surface-treated copper foil, copper-clad laminate, and printed wiring board
WO2023281759A1 (en) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 Surface-treated copper foil, copper-clad laminate, and printed wiring board
CN115044947B (en) * 2022-06-17 2023-09-29 山东金宝电子有限公司 Surface treatment method for improving adhesion of copper foil and resin
CN116180174B (en) * 2023-02-23 2026-03-17 九江德福科技股份有限公司 A method for micro-roughening surface treatment of electrolytic copper foil
CN117661046A (en) * 2023-11-30 2024-03-08 九江德福科技股份有限公司 An electrolytic copper foil with double-sided loose structure and its production method and use

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Also Published As

Publication number Publication date
TW201330719A (en) 2013-07-16
CN103857833B (en) 2018-09-07
KR20160119875A (en) 2016-10-14
JP6029590B2 (en) 2016-11-24
TWI605735B (en) 2017-11-11
KR20140054435A (en) 2014-05-08
KR20180026584A (en) 2018-03-12
WO2013047272A1 (en) 2013-04-04
KR102059280B1 (en) 2019-12-24
PH12014500716A1 (en) 2014-05-12
JPWO2013047272A1 (en) 2015-03-26
CN103857833A (en) 2014-06-11

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