MY170590A - Sputtering target for magnetic recording medium - Google Patents

Sputtering target for magnetic recording medium

Info

Publication number
MY170590A
MY170590A MYPI2015702785A MYPI2015702785A MY170590A MY 170590 A MY170590 A MY 170590A MY PI2015702785 A MYPI2015702785 A MY PI2015702785A MY PI2015702785 A MYPI2015702785 A MY PI2015702785A MY 170590 A MY170590 A MY 170590A
Authority
MY
Malaysia
Prior art keywords
sputtering target
recording medium
magnetic recording
amount
nonmagnetic material
Prior art date
Application number
MYPI2015702785A
Other languages
English (en)
Inventor
Atsushi Sato
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY170590A publication Critical patent/MY170590A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/04Making non-ferrous alloys by powder metallurgy
    • C22C1/0466Alloys based on noble metals
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C33/00Making ferrous alloys
    • C22C33/02Making ferrous alloys by powder metallurgy
    • C22C33/0257Making ferrous alloys by powder metallurgy characterised by the range of the alloying elements
    • C22C33/0278Making ferrous alloys by powder metallurgy characterised by the range of the alloying elements with at least one alloying element having a minimum content above 5%

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Magnetic Record Carriers (AREA)
MYPI2015702785A 2013-05-20 2014-05-14 Sputtering target for magnetic recording medium MY170590A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013106170 2013-05-20

Publications (1)

Publication Number Publication Date
MY170590A true MY170590A (en) 2019-08-19

Family

ID=51933477

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015702785A MY170590A (en) 2013-05-20 2014-05-14 Sputtering target for magnetic recording medium

Country Status (5)

Country Link
JP (1) JP5826945B2 (ja)
MY (1) MY170590A (ja)
SG (1) SG11201506142YA (ja)
TW (1) TWI593808B (ja)
WO (1) WO2014188916A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6692724B2 (ja) * 2016-09-02 2020-05-13 Jx金属株式会社 非磁性材料分散型Fe−Pt系スパッタリングターゲット
CN109985623B (zh) * 2019-04-28 2022-02-08 中国烟草总公司郑州烟草研究院 一种用于乙酰丙酸加氢制γ-戊内酯的催化剂及其制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04366441A (ja) * 1991-06-13 1992-12-18 Mitsui Petrochem Ind Ltd 光磁気記録媒体の製造方法
JP2006161082A (ja) * 2004-12-03 2006-06-22 Ishifuku Metal Ind Co Ltd スパッタリングターゲットの製造方法
JP4810360B2 (ja) * 2006-08-31 2011-11-09 石福金属興業株式会社 磁性薄膜
JP2008252037A (ja) * 2007-03-30 2008-10-16 Toshiba Corp 磁気抵抗素子及び磁気メモリ
JP4903277B2 (ja) * 2010-01-26 2012-03-28 株式会社日立製作所 磁気抵抗効果素子、それを用いた磁気メモリセル及びランダムアクセスメモリ
US9683284B2 (en) * 2011-03-30 2017-06-20 Jx Nippon Mining & Metals Corporation Sputtering target for magnetic recording film
JP5912559B2 (ja) * 2011-03-30 2016-04-27 田中貴金属工業株式会社 FePt−C系スパッタリングターゲットの製造方法
US20140083847A1 (en) * 2011-09-26 2014-03-27 Jx Nippon Mining & Metals Corporation Fe-Pt-C Based Sputtering Target

Also Published As

Publication number Publication date
JPWO2014188916A1 (ja) 2017-02-23
TW201510238A (zh) 2015-03-16
WO2014188916A1 (ja) 2014-11-27
JP5826945B2 (ja) 2015-12-02
SG11201506142YA (en) 2015-09-29
TWI593808B (zh) 2017-08-01

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