MY168210A - Dissolved nitrogen concentration monitoring method, substrate cleaning method, and substrate cleaning apparatus - Google Patents
Dissolved nitrogen concentration monitoring method, substrate cleaning method, and substrate cleaning apparatusInfo
- Publication number
- MY168210A MY168210A MYPI2013001645A MYPI2013001645A MY168210A MY 168210 A MY168210 A MY 168210A MY PI2013001645 A MYPI2013001645 A MY PI2013001645A MY PI2013001645 A MYPI2013001645 A MY PI2013001645A MY 168210 A MY168210 A MY 168210A
- Authority
- MY
- Malaysia
- Prior art keywords
- oxygen concentration
- dissolved oxygen
- substrate cleaning
- dissolved
- nitrogen concentration
- Prior art date
Links
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 title abstract 8
- 229910052757 nitrogen Inorganic materials 0.000 title abstract 4
- 238000004140 cleaning Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 3
- 238000012544 monitoring process Methods 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 title 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 6
- 239000001301 oxygen Substances 0.000 abstract 6
- 229910052760 oxygen Inorganic materials 0.000 abstract 6
- 239000007788 liquid Substances 0.000 abstract 1
- 229910021642 ultra pure water Inorganic materials 0.000 abstract 1
- 239000012498 ultrapure water Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/02—Analysing fluids
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/18—Water
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T436/00—Chemistry: analytical and immunological testing
- Y10T436/17—Nitrogen containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T436/00—Chemistry: analytical and immunological testing
- Y10T436/17—Nitrogen containing
- Y10T436/176152—Total nitrogen determined
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T436/00—Chemistry: analytical and immunological testing
- Y10T436/20—Oxygen containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T436/00—Chemistry: analytical and immunological testing
- Y10T436/20—Oxygen containing
- Y10T436/207497—Molecular oxygen
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T436/00—Chemistry: analytical and immunological testing
- Y10T436/20—Oxygen containing
- Y10T436/207497—Molecular oxygen
- Y10T436/209163—Dissolved or trace oxygen or oxygen content of a sealed environment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Acoustics & Sound (AREA)
- Food Science & Technology (AREA)
- Medicinal Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Investigating Or Analyzing Non-Biological Materials By The Use Of Chemical Means (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010283078A JP5298112B2 (ja) | 2010-12-20 | 2010-12-20 | 溶存窒素濃度のモニタリング方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY168210A true MY168210A (en) | 2018-10-15 |
Family
ID=45464511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2013001645A MY168210A (en) | 2010-12-20 | 2011-12-13 | Dissolved nitrogen concentration monitoring method, substrate cleaning method, and substrate cleaning apparatus |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8778085B2 (enExample) |
| EP (1) | EP2656064B1 (enExample) |
| JP (1) | JP5298112B2 (enExample) |
| KR (1) | KR101516905B1 (enExample) |
| CN (1) | CN103261885B (enExample) |
| MY (1) | MY168210A (enExample) |
| SG (1) | SG189963A1 (enExample) |
| WO (1) | WO2012084610A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3858501B1 (en) * | 2018-09-26 | 2024-04-03 | Nippon Steel Corporation | Metal pipe cleaning method and cleaning device |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH679890A5 (enExample) | 1989-11-17 | 1992-04-30 | Orbisphere Lab | |
| JP3742451B2 (ja) * | 1996-01-17 | 2006-02-01 | 昌之 都田 | 洗浄方法 |
| US6058945A (en) * | 1996-05-28 | 2000-05-09 | Canon Kabushiki Kaisha | Cleaning methods of porous surface and semiconductor surface |
| US5800626A (en) * | 1997-02-18 | 1998-09-01 | International Business Machines Corporation | Control of gas content in process liquids for improved megasonic cleaning of semiconductor wafers and microelectronics substrates |
| JPH10335294A (ja) * | 1997-06-05 | 1998-12-18 | Toshiba Corp | 基板洗浄装置、洗浄方法およびその方法を用いて製造した半導体装置 |
| JP4232186B2 (ja) * | 1998-10-23 | 2009-03-04 | 栗田工業株式会社 | 超純水中の溶存窒素濃度測定装置及び測定方法 |
| JP2003234320A (ja) | 2002-02-06 | 2003-08-22 | Nec Electronics Corp | 基板の洗浄方法、洗浄薬液、洗浄装置及び半導体装置 |
| US6848455B1 (en) * | 2002-04-22 | 2005-02-01 | Novellus Systems, Inc. | Method and apparatus for removing photoresist and post-etch residue from semiconductor substrates by in-situ generation of oxidizing species |
| JP2006310456A (ja) * | 2005-04-27 | 2006-11-09 | Dainippon Screen Mfg Co Ltd | パーティクル除去方法および基板処理装置 |
| JP2009054919A (ja) * | 2007-08-29 | 2009-03-12 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
-
2010
- 2010-12-20 JP JP2010283078A patent/JP5298112B2/ja active Active
-
2011
- 2011-12-13 SG SG2013030630A patent/SG189963A1/en unknown
- 2011-12-13 US US13/995,568 patent/US8778085B2/en active Active
- 2011-12-13 EP EP11805808.0A patent/EP2656064B1/en active Active
- 2011-12-13 CN CN201180061112.2A patent/CN103261885B/zh active Active
- 2011-12-13 KR KR1020137018767A patent/KR101516905B1/ko active Active
- 2011-12-13 WO PCT/EP2011/072639 patent/WO2012084610A1/en not_active Ceased
- 2011-12-13 MY MYPI2013001645A patent/MY168210A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP2656064B1 (en) | 2014-10-22 |
| CN103261885A (zh) | 2013-08-21 |
| JP5298112B2 (ja) | 2013-09-25 |
| SG189963A1 (en) | 2013-06-28 |
| KR101516905B1 (ko) | 2015-05-04 |
| US20130263887A1 (en) | 2013-10-10 |
| US8778085B2 (en) | 2014-07-15 |
| WO2012084610A1 (en) | 2012-06-28 |
| KR20130106423A (ko) | 2013-09-27 |
| CN103261885B (zh) | 2016-07-13 |
| EP2656064A1 (en) | 2013-10-30 |
| JP2012132708A (ja) | 2012-07-12 |
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