MY168210A - Dissolved nitrogen concentration monitoring method, substrate cleaning method, and substrate cleaning apparatus - Google Patents

Dissolved nitrogen concentration monitoring method, substrate cleaning method, and substrate cleaning apparatus

Info

Publication number
MY168210A
MY168210A MYPI2013001645A MYPI2013001645A MY168210A MY 168210 A MY168210 A MY 168210A MY PI2013001645 A MYPI2013001645 A MY PI2013001645A MY PI2013001645 A MYPI2013001645 A MY PI2013001645A MY 168210 A MY168210 A MY 168210A
Authority
MY
Malaysia
Prior art keywords
oxygen concentration
dissolved oxygen
substrate cleaning
dissolved
nitrogen concentration
Prior art date
Application number
MYPI2013001645A
Other languages
English (en)
Inventor
Teruo Haibara
Etsuko Tanabe
Yoshihiro Mori
Masashi Uchibe
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of MY168210A publication Critical patent/MY168210A/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/02Analysing fluids
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/18Water
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/10Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02043Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052Wet cleaning only
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67253Process monitoring, e.g. flow or thickness monitoring
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T436/00Chemistry: analytical and immunological testing
    • Y10T436/17Nitrogen containing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T436/00Chemistry: analytical and immunological testing
    • Y10T436/17Nitrogen containing
    • Y10T436/176152Total nitrogen determined
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T436/00Chemistry: analytical and immunological testing
    • Y10T436/20Oxygen containing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T436/00Chemistry: analytical and immunological testing
    • Y10T436/20Oxygen containing
    • Y10T436/207497Molecular oxygen
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T436/00Chemistry: analytical and immunological testing
    • Y10T436/20Oxygen containing
    • Y10T436/207497Molecular oxygen
    • Y10T436/209163Dissolved or trace oxygen or oxygen content of a sealed environment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Acoustics & Sound (AREA)
  • Food Science & Technology (AREA)
  • Medicinal Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Investigating Or Analyzing Non-Biological Materials By The Use Of Chemical Means (AREA)
MYPI2013001645A 2010-12-20 2011-12-13 Dissolved nitrogen concentration monitoring method, substrate cleaning method, and substrate cleaning apparatus MY168210A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010283078A JP5298112B2 (ja) 2010-12-20 2010-12-20 溶存窒素濃度のモニタリング方法

Publications (1)

Publication Number Publication Date
MY168210A true MY168210A (en) 2018-10-15

Family

ID=45464511

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013001645A MY168210A (en) 2010-12-20 2011-12-13 Dissolved nitrogen concentration monitoring method, substrate cleaning method, and substrate cleaning apparatus

Country Status (8)

Country Link
US (1) US8778085B2 (enExample)
EP (1) EP2656064B1 (enExample)
JP (1) JP5298112B2 (enExample)
KR (1) KR101516905B1 (enExample)
CN (1) CN103261885B (enExample)
MY (1) MY168210A (enExample)
SG (1) SG189963A1 (enExample)
WO (1) WO2012084610A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3858501B1 (en) * 2018-09-26 2024-04-03 Nippon Steel Corporation Metal pipe cleaning method and cleaning device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH679890A5 (enExample) 1989-11-17 1992-04-30 Orbisphere Lab
JP3742451B2 (ja) * 1996-01-17 2006-02-01 昌之 都田 洗浄方法
US6058945A (en) * 1996-05-28 2000-05-09 Canon Kabushiki Kaisha Cleaning methods of porous surface and semiconductor surface
US5800626A (en) * 1997-02-18 1998-09-01 International Business Machines Corporation Control of gas content in process liquids for improved megasonic cleaning of semiconductor wafers and microelectronics substrates
JPH10335294A (ja) * 1997-06-05 1998-12-18 Toshiba Corp 基板洗浄装置、洗浄方法およびその方法を用いて製造した半導体装置
JP4232186B2 (ja) * 1998-10-23 2009-03-04 栗田工業株式会社 超純水中の溶存窒素濃度測定装置及び測定方法
JP2003234320A (ja) 2002-02-06 2003-08-22 Nec Electronics Corp 基板の洗浄方法、洗浄薬液、洗浄装置及び半導体装置
US6848455B1 (en) * 2002-04-22 2005-02-01 Novellus Systems, Inc. Method and apparatus for removing photoresist and post-etch residue from semiconductor substrates by in-situ generation of oxidizing species
JP2006310456A (ja) * 2005-04-27 2006-11-09 Dainippon Screen Mfg Co Ltd パーティクル除去方法および基板処理装置
JP2009054919A (ja) * 2007-08-29 2009-03-12 Dainippon Screen Mfg Co Ltd 基板処理装置

Also Published As

Publication number Publication date
EP2656064B1 (en) 2014-10-22
CN103261885A (zh) 2013-08-21
JP5298112B2 (ja) 2013-09-25
SG189963A1 (en) 2013-06-28
KR101516905B1 (ko) 2015-05-04
US20130263887A1 (en) 2013-10-10
US8778085B2 (en) 2014-07-15
WO2012084610A1 (en) 2012-06-28
KR20130106423A (ko) 2013-09-27
CN103261885B (zh) 2016-07-13
EP2656064A1 (en) 2013-10-30
JP2012132708A (ja) 2012-07-12

Similar Documents

Publication Publication Date Title
WO2009117425A3 (en) Electrochemical probe and method for in situ treatment of a tissue
MX2013012306A (es) Sistemas y metodos de tratamiento de agua.
GB201010728D0 (en) Monitoring of power consumption
EP1800355A4 (en) METHOD AND DEVICE FOR CAVITY THRESHARK CHARACTERIZATION AND CONTROL
ATE495584T1 (de) Gerät und damit verbundenes verfahren zur auswahl von betriebsraten eines sprachkodiergerätes
GB2548418A (en) Apparatus and method using ultrasounds for gas conversion
EP2540673A4 (en) DEVICE FOR ULTRAVIOLET OXIDATION, DEVICE FOR PRODUCING ULTRAREINIC WATER, TREATMENT FOR ULTRAVIOLET OXIDATION AND METHOD FOR PRODUCING ULTRAREINEM WATER
EA201200327A1 (ru) Способ очистки твердых поверхностей
WO2009076491A3 (en) Remineralizing compositions and methods
IN2014CN00534A (enExample)
MY158969A (en) Technical system, method and uses for dosing of at least one liquid treatment means into injection water to an injection well
PL391811A1 (pl) Sposób i urządzenie do programowalnego uzdatniani wody w chłodziarce wody
GB2466733B (en) Method and apparatus fo determining volume fractions in a multiphase flow
SI2257499T1 (sl) Vsebnik ter naprava in postopek za izdelovanje dezinfekcijske raztopine
FR2978352B3 (fr) Dispositif pour la generation in-situ d'eau d'humidification en vue de l'utilisation dans des humidificateurs de gaz respiratoires
MX352085B (es) Método a base de euglobulina para determinar la actividad biológica de defibrótido.
FI20105919L (fi) Menetelmä veden puhdistamiseksi
MY168210A (en) Dissolved nitrogen concentration monitoring method, substrate cleaning method, and substrate cleaning apparatus
EP2345991A4 (en) DEVICE FOR CALCULATING REQUIRED ROOM FOR IMPROVEMENT, CONTROL PROCESS AND CALCULATION OF NECESSARY ROOM FOR IMPROVEMENT
PH12014502442A1 (en) Apparatus, system, and method for raising water using a container with membrane
MY157689A (en) Gluconic acid containing photoresist cleaning composition for multi-metal device processing
MY173673A (en) Apparatus for purifying water in an aquarium
WO2012044071A3 (en) Device for injecting ozone into ballast water for a ship
SG165201A1 (en) Power generation
MX2013010434A (es) Metodo y sistema para medir el nivel de una fosa de combustible usado sin energia electrica.