MY161696A - Polishing apparatus - Google Patents

Polishing apparatus

Info

Publication number
MY161696A
MY161696A MYPI2011003734A MYPI2011003734A MY161696A MY 161696 A MY161696 A MY 161696A MY PI2011003734 A MYPI2011003734 A MY PI2011003734A MY PI2011003734 A MYPI2011003734 A MY PI2011003734A MY 161696 A MY161696 A MY 161696A
Authority
MY
Malaysia
Prior art keywords
polishing
plate
sheet member
elastic sheet
holding
Prior art date
Application number
MYPI2011003734A
Inventor
Moriya Norihiko
Original Assignee
Fujikoshi Machinery Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Machinery Corp filed Critical Fujikoshi Machinery Corp
Publication of MY161696A publication Critical patent/MY161696A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces

Abstract

THE POLISHING APPARATUS (10) COMPRISES: A POLISHING HEAD (14) FOR HOLDING A WORK (30); A POLISHING PLATE (12) HAVING A POLISHING FACE; AND A DRIVING MECHANISM FOR RELATIVELY MOVING THE POLISHING HEAD (14) WITH RESPECT TO THE POLISHING PLATE (12).THE POLISHING HEAD (14) INCLUDES: A HOLDING PLATE (22); AN ELASTIC SHEET MEMBER (28) BEING FIXED TO THE HOLDING PLATE (22), THE ELASTIC SHEET MEMBER (28) HAVING A LOWER FACE FOR PRESSING THE WORK (30) ONTO THE POLISHING PLATE (12); A PRESSURE CHAMBER,TO WHICH A PRESSURE FLUID IS SUPPLIED, BEING FORMED BETWEEN THE HOLDING PLATE (22) AND THE ELASTIC SHEET MEMBER (28); A SEAL RING (36) CONCENTRICALLY DIVIDING THE PRESSURE CHAMBER INTO CHAMBERS (40, 42),THE SEAL RING (36) HAVING A SEAL LIP (38); AND A FLUID SUPPLY SECTION (29, ETC.) FOR INDIVIDUALLY SUPPLYING THE FLUID TO THE DIVIDED CHAMBERS (40,42).
MYPI2011003734A 2010-08-31 2011-08-10 Polishing apparatus MY161696A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010193124A JP5648954B2 (en) 2010-08-31 2010-08-31 Polishing equipment

Publications (1)

Publication Number Publication Date
MY161696A true MY161696A (en) 2017-05-15

Family

ID=44509077

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011003734A MY161696A (en) 2010-08-31 2011-08-10 Polishing apparatus

Country Status (7)

Country Link
US (1) US8888563B2 (en)
EP (1) EP2422930B1 (en)
JP (1) JP5648954B2 (en)
KR (1) KR101767272B1 (en)
CN (1) CN102380820B (en)
MY (1) MY161696A (en)
TW (1) TWI505909B (en)

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US20180264621A1 (en) * 2014-12-08 2018-09-20 Hyun Jeong Yoo Retainer ring for carrier head for chemical polishing apparatus and carrier head comprising same
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US20190061098A1 (en) * 2016-04-01 2019-02-28 Joon Mo Kang Carrier head for chemical mechanical polishing apparatus comprising substrate receiving member
KR101942628B1 (en) * 2016-12-19 2019-01-25 강준모 Substrate receiving member for carrier head in chemical mechanical polishing system
JP6927560B2 (en) * 2017-01-10 2021-09-01 不二越機械工業株式会社 Work polishing head
CN108723977B (en) * 2018-06-12 2020-06-12 江苏矽智半导体科技有限公司 Semiconductor chip production process
US11484987B2 (en) 2020-03-09 2022-11-01 Applied Materials, Inc. Maintenance methods for polishing systems and articles related thereto
JP2022191609A (en) * 2021-06-16 2022-12-28 株式会社Sumco Polishing head, polishing apparatus, and method of manufacturing semiconductor wafer
CN113681440B (en) * 2021-09-24 2022-11-08 义乌工商职业技术学院 Hydraulic polishing equipment for processing cylindrical workpiece
US20230264319A1 (en) * 2022-02-21 2023-08-24 Applied Materials, Inc. Pad carrier assembly for horizontal pre-clean module

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Also Published As

Publication number Publication date
JP2012051037A (en) 2012-03-15
EP2422930A2 (en) 2012-02-29
US8888563B2 (en) 2014-11-18
TWI505909B (en) 2015-11-01
EP2422930B1 (en) 2015-02-25
JP5648954B2 (en) 2015-01-07
TW201210741A (en) 2012-03-16
KR101767272B1 (en) 2017-08-10
CN102380820B (en) 2015-07-15
KR20120021190A (en) 2012-03-08
EP2422930A3 (en) 2014-01-15
US20120052774A1 (en) 2012-03-01
CN102380820A (en) 2012-03-21

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