JP2000033558A - Carrier and polishing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a carrier and a polishing device capable of making fluid pressures applied on a rear surface of a workpiece differ partially. SOLUTION: A carrier is provided with a separation body 3 separating a pressure chamber of a carrier main body part 2 into a central part chamber R1 and an outer peripheral part chamber R2 and an adjusting mechanism 4 capable of adjusting a size of an air port 31 communicating the central part chamber R1 with the outer peripheral part chamber R2. When air is supplied into the central part chamber R1 by an air hose 50, the air flows into the outer peripheral part chamber R2 from the air port 31, then passes through an air hose 51, and flows out to the outside of the carrier. Air pressure in the outer peripheral part chamber R2 can be adjusted by changing the size of the air port 31 in this condition. Moreover, when air is supplied into the outer peripheral part chamber R2 by the air hose 51, the air flows into the central part chamber R1 from the air port 31, then passes through the air hose 50, and flows out to the outside of the carrier. Air pressure in the central part chamber R1 can be adjusted by changing the size of the air port 31 in this condition.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier and a polishing apparatus for uniformly pressing the back surface of a wafer with a fluid such as air and polishing the wafer surface flat.

[0002]

2. Description of the Related Art FIG. 12 is a sectional view showing an example of a conventional air pressurized carrier. A concave portion 101 is formed on the lower surface of the carrier 100, and the concave portion 101 is covered with a sheet 102 to define a pressure chamber R. An air supply passage 103 communicating with the pressure chamber R is provided at the center of the carrier 100, and a retainer ring 104 for holding the wafer W is attached to the outer periphery of the lower surface of the carrier 100. With this configuration, the wafer W is housed inside the retainer ring 104 and the carrier 100 is brought into contact with the wafer W on the rotating lower platen 200.
Can be rotated. At this time, the air supply path 10
By supplying air into the pressure chamber R from 3, the back surface of the wafer W is uniformly pressed by the air, and the surface of the wafer W is polished flat by the lower platen 200. However, in this carrier 100, as shown in FIG.
During the polishing operation of the wafer W, the outer peripheral portion of the sheet 102 is pulled downward, so that the vertical component T1 of the tension T is applied to the outer peripheral portion of the wafer W in addition to the air pressure. For this reason, the polishing rate of the outer peripheral portion of the wafer W is higher than the polishing rates of other portions. Therefore, a carrier as shown in FIG. 14 has been devised. In this carrier, a sheet 105 reduced only in the outer peripheral portion of the wafer W is attached to the lower side of the sheet 102 so that the tension of the sheet 102 does not reach the outer peripheral portion of the wafer W.

[0003]

However, the above-mentioned prior art has the following problems. The wafer W has a thermal oxide film coated on the entire substrate or P-TEOS
In some cases, a film is coated on the entire substrate. In the manufacturing process, the thermal oxide film is coated with a uniform thickness and a uniform hardness on the substrate. Therefore, by using the carrier shown in FIG. 14, the entire wafer W can be polished at a uniform polishing rate. However, the P-TEOS film is rarely coated with a uniform thickness and hardness. In particular, the thickness and hardness of the P-TEOS film at the outer peripheral portion and the central portion of the wafer W are significantly different from those of other portions. Therefore, even if the carrier shown in FIG. 14 is used, the entire wafer W cannot be polished at a uniform polishing rate.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and has as its object to provide a carrier and a polishing apparatus which can partially vary a fluid pressure applied to the back surface of a workpiece. is there.

[0005]

According to a first aspect of the present invention, a pressure chamber is defined by a concave portion formed on a lower surface of a carrier body and a sheet covering the concave portion from below. Then, the fluid supplied into the pressure chamber separates the central part and the outer peripheral part of the pressure chamber in the carrier capable of uniformly pressing the workpiece held under the sheet. An annular separating body defining the outer chamber and an outer peripheral chamber; an adjusting mechanism capable of adjusting the size of a fluid port formed between the central chamber and the outer peripheral chamber; a first flow passage communicating with the central chamber; And a second flow passage communicating with the outer peripheral chamber. With such a configuration, the fluid is
When the fluid supplied to the central chamber is supplied to the central chamber through the flow passage, the fluid supplied to the central chamber flows into the outer peripheral chamber through the fluid port, and then flows out to the outside through the second flow path. In this case, the fluid pressure in the outer peripheral chamber becomes smaller than the fluid pressure in the central chamber. By adjusting the size of the fluid port by the adjusting mechanism, the fluid pressure in the outer peripheral chamber can be controlled. Conversely, when the fluid is supplied to the outer peripheral chamber through the second flow passage, the fluid supplied to the outer peripheral chamber flows into the central chamber through the fluid port, and then flows out through the first flow passage. In this case, the fluid pressure in the center chamber becomes smaller than the fluid pressure in the outer chamber. The fluid pressure in the central chamber can be controlled by adjusting the size of the fluid port by the adjusting mechanism.

As a good example of the adjusting mechanism, the invention according to claim 2 is the carrier according to claim 1, wherein the adjusting mechanism is engraved on at least one of the outer peripheral surface and the inner peripheral surface of the separator. A first screw groove portion, and a second screw groove portion which is engraved on at least one of an outer peripheral surface and an inner peripheral surface of an annular hole provided in the carrier main body portion and can be screwed with the first screw groove portion. And the fluid port was formed by the gap between the separator and the sheet. With this configuration, the first thread groove of the separator is screwed into the second thread groove of the annular hole of the carrier body, the amount of screwing of the separator is adjusted, and the size of the gap between the separator and the sheet is increased. By adjusting the height, the fluid pressure in the central chamber or the fluid pressure in the outer peripheral chamber can be controlled. Further, as another example, the invention according to claim 3 is the carrier according to claim 1, wherein the fluid inlet / outlet is formed with a flow passage having one or more predetermined diameters formed in the separator and communicating the central chamber and the outer peripheral chamber. The adjustment mechanism was formed by a hole, and the adjusting mechanism was constituted by a throttle unit mounted in the flow hole. With such a configuration, the fluid pressure in the central chamber or the fluid pressure in the outer peripheral chamber can be controlled by adjusting the opening degree of the throttle attached to the inside of the flow hole.

[0007] The polishing apparatus using the carrier according to any one of the first to third aspects of the present invention is also realized as a product invention.
Therefore, according to the invention of claim 4, a pressure chamber is defined by a rotatable lower surface plate, a concave portion formed on the lower surface of the carrier body, and a sheet covering the concave portion from below, and the pressure chamber is supplied to the pressure chamber. In a polishing apparatus having a carrier capable of uniformly pressing a workpiece on a lower platen held on the lower side of a sheet by a fluid, and a rotation driving unit for rotating the carrier while pressing the carrier, An annular separator that separates the central part and the outer peripheral part of the pressure chamber to define the central part and the outer peripheral part, and the size of the fluid port formed between the central part and the outer peripheral part. An adjustable adjustment mechanism,
A configuration in which a first flow passage communicating with the central chamber and a second flow passage communicating with the outer peripheral chamber are provided, and fluid supply means for supplying a fluid to either the first or second flow passage is provided. is there. According to a fifth aspect of the present invention, in the polishing apparatus according to the fourth aspect, the carrier adjusting mechanism is provided with a first screw groove portion engraved on at least one of an outer peripheral surface and an inner peripheral surface of the separator. A second screw groove portion that is engraved on at least one of the outer peripheral surface and the inner peripheral surface of the annular hole portion provided in the carrier main body portion and can be screwed with the first screw groove portion,
The fluid port of the carrier was formed by the gap between the separator and the sheet. Further, the invention according to claim 6 is the polishing apparatus according to claim 4, wherein the fluid inlet / outlet of the carrier is formed by a flow hole having a diameter of at least one formed in the separator and communicating the central chamber and the outer peripheral chamber. The formed and adjusted mechanism of the carrier was constituted by a throttle unit mounted in the flow hole.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. (First Embodiment) FIG. 1 is a partially cutaway front view showing a polishing apparatus according to a first embodiment of the present invention. FIG.
As shown in FIG. 1, in this polishing apparatus, a lower platen 200 on which a polishing pad 201 is stuck on the surface, a carrier 1,
The apparatus includes a rotation drive mechanism 8 as rotation drive means and an air pump 5 as fluid supply means.

The lower platen 200 is driven to rotate by a main motor 210 inside the apparatus housing.
That is, the belt 215 is wound around the pulley 211 attached to the main motor 210 and the pulley 214 attached to the input rotation shaft 213 of the transmission 212, and the lower platen 200 is attached to the output rotation shaft 119 of the transmission 212. I have. As a result, the rotation of the main motor 210 is transmitted to the pulley 214, the rotation of the pulley 214 is transmitted through the transmission 212 to the output rotary shaft 216, and the lower platen 200 rotates at a predetermined speed.

The rotation drive mechanism 8 is a mechanism for rotating the carrier 1 while pressing it, and includes a cylinder 80 and a motor 84. FIG. 2 is a sectional view showing the rotation drive mechanism 8. As shown in FIG. 2, the cylinder 80 includes a piston rod 82 that penetrates the cylinder body 81, and a cylinder body 8 fixed to the outside of the piston rod 82.
1 and a piston 83 fitted airtightly. Thus, by adjusting the air pressure in the cylinder body 81, the piston rod 82 can be moved up and down integrally with the piston 83, and the pressing force on the carrier 1 can be adjusted. On the other hand, the motor 84 is mounted on the piston rod 82 of the cylinder 80. That is, the gear 85 of the rotating shaft of the motor 84 is meshed with the gear 87 attached to the upper part of the piston rod 82 via the bearing 86. The upper end of a cylindrical inner rod 89 is fixed to a support member 88 fixed on the upper surface of the gear 87. Thus, when the motor 84 is driven, the rotation is transmitted to the inner rod 89 via the gears 85 and 87 and the support member 88, and the inner rod 89 rotates within the piston rod 82 at a predetermined speed.

The carrier 1 has a structure capable of rotating while holding the wafer W on the polishing pad 201 (see FIG. 1) of the lower platen 200. The carrier 1 is attached to the lower end of the piston rod 82. I have. FIG. 3 is a sectional view showing the structure of the carrier 1, and FIG. 4 is an exploded perspective view thereof. As shown in FIGS. 3 and 4, the carrier 1 is:
A carrier main body 2 having a concave portion R on the lower surface, a separator 3 assembled to the carrier main body 2, and an adjusting mechanism 4 are provided.

The carrier body 2 has a recess R formed by the housing 10, the carrier base 11, and the side ring 12, and the recess R is covered with a sheet 18 from below.
8 has a structure in which a backing sheet 19 is adhered to the lower surface. Specifically, as shown in FIG. 3, the housing 10 has a rotatable connection member 10a at the center, and the lower end of the piston rod 82 is connected to the connection member 10a. The housing 10 is connected to a connecting member 10.
An internal gear 10b is provided below the inner gear a. The internal gear 10b meshes with an external gear 89a formed at the lower end of an inner rod 89 that passes through the center hole of the connecting member 10a. Thus, when the inner rod 89 is rotated by the drive of the motor 84, the internal gear 10b and the external gear 8 are rotated.
9a and the motor 84
Rotation force is applied. The carrier base 11 is fixed to the lower surface of the housing 10 with screws 1a, and the side ring 12 is attached to the lower side of the outer periphery of the carrier base 11. That is, carrier base 1
1, a recess 11c having the same width as the side ring 12 on the lower surface of the outer peripheral portion
Are formed in a notch, and are fixed by screws 1b in a state where the upper portion of the side ring 12 is fitted into the concave portion 11c. An O-ring 11d is mounted between the side ring 12 and the carrier base 11 to maintain the airtightness in the recess R. Then, the outer peripheral portion of the upper surface of the sheet 18 is air-tightly bonded to the lower surface of the side ring 12,
A pressure chamber is defined by the sheet 18 and the concave portion R.
The outer diameter of the backing sheet 19 attached to the lower surface of the sheet 18 is set equal to the size of the outer diameter of the wafer W excluding its outer peripheral portion. Accordingly, when the wafer W is brought into contact with the backing sheet 19, the outer peripheral portion of the wafer W protrudes from the backing sheet 19, so that the tension generated on the outer peripheral portion of the sheet 18 when the wafer W is pressed does not reach the outer peripheral portion of the wafer W. It has become. A retainer ring 13 that holds the wafer W from outside is attached to the outside of the backing sheet 19, that is, to the outer peripheral portion of the lower surface of the sheet 18 attached to the side ring 12.

The separating body 3 is a ring body which separates the center side and the outer peripheral side of the pressure chamber to define a central chamber R1 and an outer peripheral chamber R2. Specifically, Carrier Base 1
1, a ring-shaped hole 30 having substantially the same shape as the separator 3 is recessed, and the separator 3 is attached to the ring-shaped hole 30 so that the lower end 3 a protrudes toward the sheet 18 so as to be able to advance and retreat. Have been. A gap is provided between the lower end 3a of the separator 3 and the sheet 18, and the gap forms an air inlet / outlet 31 as a fluid inlet / outlet communicating the central chamber R1 and the outer peripheral chamber R2.

The adjusting mechanism 4 is a mechanism for adjusting the size of the air inlet / outlet 31 and includes a first screw groove 40 and a second screw groove 41. As shown in FIG. 4, the first screw groove 40 is formed on the outer peripheral surface of the separator 3, and the second screw groove 41 is formed on the ring-shaped hole 30 facing the outer peripheral surface of the separator 3. It is engraved on the outer peripheral surface. The first and second screw groove portions 40 and 41 are screwed together, and the lower end portion 3 a moves forward and backward with respect to the sheet 18 by rotating the separator 3 in the ring-shaped hole portion 30. ing. As shown in FIG. 5, in order to enable the rotation of the separating body 3, the upper surface of the carrier base 11 and the position corresponding to the ring-shaped hole 30 are located along the ring-shaped hole 30. Thus, three arc-shaped long holes 42 are bored, and engaging surfaces 43 are respectively recessed on the upper surface of the separator 3 located in these long holes 42. As a result, as shown in FIG. 6, the separation body 3 is rotated by rotating the driver 44 with the tips 44 a of the three-pronged driver 44 engaged with the three engagement holes 43. Can be.

The air pump 5 shown in FIG.
Is a pump for supplying air to one of the central chamber R1 and the outer peripheral chamber R2 separated by a predetermined pressure, and supplies air to one air hose 50 or supplies air to four air hoses 51. . As shown in FIGS. 3 and 4, the air hose 50 extends to a ventilation hole 60 as a first flow passage communicating with the central chamber R1, and the four air hoses 51 communicate with the outer peripheral chamber R2. Each of them extends to four ventilation holes 61 as second flow passages. Specifically, the air hose 50 is connected to the inner rod 89.
As shown in FIG. 3, the distal end of the seal member 53 is inserted into a vent hole 60 formed in the center of the carrier base 11, and the seal member 53 is pressed into the vent hole 60.
Is held by Thus, the air from the air pump 5 can be supplied into the central chamber R1 through the air hose 50, and the air in the central chamber R1 can be discharged to the outside of the carrier 1 through the air hose 50. on the other hand,
The four air hoses 51 are separated after being inserted into the inner rod 89. Then, after each air hose 51 is passed through four straight grooves 62 (see FIG. 4) formed in a cross shape on the lower surface of the housing 10, each of the straight grooves 6 is formed.
2 are inserted into four ventilation holes 61 formed in the carrier base 11 so as to communicate with the distal end side of the carrier base 2, and are held by a seal member 54 pressed into the ventilation holes 61.
Thereby, the air from the air pump 5 is supplied to the air hose 51.
The air in the outer peripheral chamber R2 can be supplied to the outside of the carrier 1 through the air hose 51.

Next, the operation of the polishing apparatus according to this embodiment will be described. At the time of polishing the wafer W, as shown in FIG. 3, the main motor 210 shown in FIG. 1 is driven while the backing sheet 19 of the carrier 1 is in contact with the back surface of the wafer W to rotate the lower platen 200 at a predetermined speed. Rotate with. In parallel with this operation, the rotation drive mechanism 8
The carrier 1 holding the wafer W is rotated while being pressed against the lower platen 200 side.

At this time, only the air hose 50 is connected to the air pump 5 as shown in FIG. Then, as shown in FIG. 8, air A from the air pump 5 is supplied to the air hose 50.
Is supplied into the center chamber R1 of the carrier 1 via the air inlet / outlet 31 and flows into the outer peripheral chamber R2 via the air inlet / outlet 31. Thereafter, the air A flows out of the carrier 1 from the end opening of the air hose 51 through the air hose 51 as shown in FIG. In this state, as shown in FIG. 8, assuming that the air pressure in the central chamber R1 is P1 and the air pressure in the outer peripheral chamber R2 is P2, the center of the rear surface of the wafer W is the sheet 18 and the backing sheet 19. Is pressed at a uniform pressure P1 through the sheet 18 so that the outer peripheral portion of the rear surface of the wafer W
And it is pressed by the uniform pressure P2 via the backing sheet 19. By the way, air A is
1, the pressure P2 in the outer peripheral chamber R2 is lower than the pressure P1 in the central chamber R1. That is, when the size of the air inlet / outlet 31, that is, the size Δa (see FIG. 3) of the gap between the lower end 3a of the separator 3 and the sheet 18 is equal to or larger than a predetermined value,
The pressure P2 becomes substantially equal to the pressure P1, but the size of the gap Δ
When a is made smaller than a predetermined value, the pressure P2 becomes the pressure P1.
From the value of. Therefore, such an air circulation path configuration is a wafer W in which the P-TEOS film is coated on the entire substrate, and the thickness and hardness of the central portion of the P-TEOS film are larger than those of other portions. It is suitable for polishing a wafer W having a small polishing rate in the central portion. That is, after adjusting the air supply pressure of the air pump 5 and setting the pressure P1 value of the central chamber R1 so that the polishing rate at the central portion of the wafer W becomes a desired value, the separator 3 is rotated to set the gap between the air ports 31. By adjusting Δa and reducing the pressure P2 of the outer peripheral portion chamber R2 so that the polishing rate of the outer peripheral portion of the wafer W becomes equal to the polishing rate of the central portion, the polishing rate of the entire wafer W can be made equal. it can.

Conversely, as shown in FIG.
Is disconnected from the air pump 5 and the four air hoses 51 are connected to the air pump 5, and the air A from the air pump 5 flows through the carrier 1 through the air hose 51 as shown in FIG.
Is supplied into the outer peripheral chamber R2, flows into the central chamber R1 via the air inlet / outlet 31, passes through the air hose 50, and flows out of the carrier 1 from the end opening of the air hose 50 as shown in FIG. . In this state, the outer peripheral chamber R
2 is P2 and the air pressure in the central chamber R1 is P1, the outer peripheral portion of the back surface of the wafer W is pressed by the uniform pressure P2 via the sheet 18 and the backing sheet 19, and the wafer W Is pressed at a uniform pressure P1 via the sheet 18 and the backing sheet 19. In this state, the pressure P1 in the central chamber R1 is equal to or less than the pressure P2 in the outer peripheral chamber R2. Therefore, the gap Δa between the lower end 3a of the separator 3 and the sheet 18
Is greater than or equal to a predetermined value, the pressure P1 becomes substantially equal to the pressure P2. However, as the gap Δa becomes smaller than the predetermined value, the pressure P1 gradually decreases from the value of the pressure P2. For this reason, in this air flow path configuration, since the thickness and hardness of the outer peripheral portion of the P-TEOS film are larger than those of other portions, it is suitable for polishing a wafer W having a lower polishing rate in the outer peripheral portion. . That is, after adjusting the air supply pressure of the air pump 5 and setting the pressure P2 value of the outer peripheral chamber R2 so that the polishing rate of the outer peripheral part of the wafer W becomes a desired value, the separator 3 is rotated to set the gap between the air inlet and outlet 31. By adjusting Δa to reduce the pressure P1 of the central chamber R1 so that the polishing rate of the central portion of the wafer W is equal to the polishing rate of the outer peripheral portion, the polishing rate of the entire wafer W is equalized. Can be.

As described above, according to the polishing apparatus of this embodiment, the air pressure applied to the back surface of the wafer W can be partially varied. That is, the air pressure applied to the central portion and the outer peripheral portion of the wafer W can be adjusted according to the film quality of the P-TEOS film, so that the polishing rate of the entire wafer W can be equalized, and as a result, high precision A polished wafer W can be provided.

(Second Embodiment) FIG. 11 is a sectional view of a carrier which is a main part of a polishing apparatus according to a second embodiment of the present invention. The carrier of this embodiment differs from the carrier adjusting mechanism 4 of the first embodiment in the structure of the adjusting mechanism for adjusting the air inlet / outlet. In FIG. 8, reference numeral 3 'denotes a separator, and the separator 3' is fixed to the carrier base 11 with its lower end 3a 'in airtight contact with the sheet 18. A plurality of flow holes 31 'are formed in the separator 3' as air inlets and outlets.
A throttle section 45 as an adjustment mechanism is mounted in 1 '. Each of the diaphragm portions 45 is the same as a diaphragm mechanism used in a camera or the like, and changes the magnitude of the pressure P1 in the central chamber R1 or the pressure P2 in the outer peripheral chamber R2 by adjusting the degree of opening. be able to. The other configuration, operation, and effect are the same as those of the first embodiment, and thus description thereof is omitted.

The present invention is not limited to the above embodiment, and various modifications and changes can be made within the scope of the present invention. For example, in the first embodiment, the first screw groove 40 and the second screw groove 41 of the adjusting mechanism 4 are engraved on the outer peripheral surface of the separator 3 and the outer peripheral surface of the ring-shaped hole 30, respectively. The first screw groove 40 and the second
And the inner peripheral surface of the separator 3 and the ring-shaped hole 3
0 may be engraved on both the outer peripheral surface and the inner peripheral surface of the separator 3 and the second thread groove 41 may be formed on the ring. Hole 30
May be engraved on both the outer peripheral surface and the inner peripheral surface. In the above-described embodiment, four straight grooves 62 are formed in the lower surface of the housing 10 in a cross shape, and four ventilation holes 61 communicating with the front end of the straight grooves 62 are formed in the carrier base 11. And the four air hoses 51 are passed through these. However, the straight grooves 62 and the ventilation holes 6 communicating with the straight grooves 62 are formed.
The number of 1 is arbitrary. Accordingly, for example, one to three straight grooves 62 are radially engraved on the lower surface of the housing 10 and one to three ventilation holes 61 communicating with the straight grooves 62.
Can be formed in the carrier base 11 so that one to three air hoses 51 are passed through them. Further, in the above embodiment, the central chamber R1 and the outer peripheral chamber R2
The fluid to be supplied to the air was air, but a fluid such as an oil solution was supplied to the central chamber R1 and the outer peripheral chamber R2. The back surface of the wafer W may be uniformly pressed by the hydraulic pressure.

[0022]

As described above in detail, according to the present invention, the fluid is supplied to the central chamber through the first flow passage, flows into the outer peripheral chamber through the fluid port, and then flows to the second chamber.
To the outside through the flow passage of
Since the fluid can be supplied to the outer peripheral chamber through the flow passage, and flow into the central chamber through the fluid inlet / outlet, and then flow out to the outside through the first flow passage, the size of the fluid inlet / outlet is adjusted by the adjusting mechanism. Thereby, the fluid pressure in the outer peripheral chamber or the fluid pressure in the central chamber can be controlled. That is, since the fluid pressure applied to the outer peripheral portion or the central portion of the workpiece can be adjusted, the polishing rate of the entire workpiece can be made uniform, and as a result, a highly polished workpiece can be provided. There is an excellent effect that you can.

[Brief description of the drawings]

FIG. 1 is a partially cutaway front view of a polishing apparatus according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing a rotation drive mechanism.

FIG. 3 is a cross-sectional view illustrating a structure of a carrier.

FIG. 4 is an exploded perspective view of the carrier.

FIG. 5 is a plan view of a carrier base for showing three arc-shaped long holes and an engaging hole of a separating body.

FIG. 6 is a perspective view showing a state in which a separating body is rotated using a driver.

FIG. 7 is a connection state diagram of an air hose and an air pump communicating with a central chamber.

FIG. 8 is a schematic diagram of the carrier showing a state in which air flows from the central chamber to the outer peripheral chamber via the air inlet / outlet.

FIG. 9 is a connection state diagram of four air hoses communicating with the outer peripheral chamber and an air pump.

FIG. 10 is a schematic diagram of a carrier showing a state in which air flows from an outer peripheral chamber to a central chamber via an air inlet / outlet;

FIG. 11 is a sectional view of a carrier, which is a main part of a polishing apparatus according to a second embodiment of the present invention.

FIG. 12 is a sectional view showing an example of a conventional air pressurized carrier.

FIG. 13 is a partially enlarged cross-sectional view showing a state where an outer peripheral portion of a sheet is pulled downward.

FIG. 14 is a cross-sectional view showing another example of a conventional air pressurized carrier.

[Explanation of symbols]

1 ... Carrier 2 ... Carrier main body 3 ... Separator
4 ... adjustment mechanism, 5 ... air pump, 8 ... rotation drive mechanism, 10 ... housing, 11 ... carrier base,
12 ... side ring, 13 ... retainer ring, 18
... Sheet, 19 ... Backing sheet, 31 ... Air inlet / outlet, 40 ... First screw groove, 41 ... Second screw groove, 50,51 ... Air hose, 60,61 ... Vent hole, 200 ... Lower platen, R1 ... Center Part room, R2: outer peripheral part room, W: wafer.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kazuchi Hatano 2647 Hayakawa Hayakawa, Ayase City, Kanagawa Prefecture Inside (72) Inventor Hideo Tanaka 2647 Hayakawa, Ayase City, Kanagawa Prefecture Speed Fam Corporation F Term (reference) 3C058 AA07 AB01 AB04 AB06 CB01 DA06 DA17

Claims (6)

[Claims] A pressure chamber defined by a concave portion formed on a lower surface of the carrier body and a sheet covering the concave portion from below;
In a carrier capable of uniformly pressurizing a work piece held under the sheet by the fluid supplied to the pressure chamber, a center portion and an outer peripheral portion of the pressure chamber are separated from each other to form a central chamber. An annular separating body defining an outer peripheral chamber; an adjusting mechanism capable of adjusting a size of a fluid port formed between the central chamber and the outer peripheral chamber; and a first circulation communicating with the central chamber. A carrier, comprising: a passage; and a second flow passage communicating with the outer peripheral chamber. 2. The carrier according to claim 1, wherein the adjusting mechanism includes a first thread groove formed on at least one of an outer peripheral surface and an inner peripheral surface of the separator, and the carrier main body. A second screw groove formed in the outer peripheral surface or the inner peripheral surface of the annular hole provided on the at least one of the first and second screw grooves and capable of screwing with the first screw groove portion; A carrier formed by a gap between the separator and the sheet. 3. The carrier according to claim 1, wherein the fluid port is formed by one or more flow holes formed in the separator and communicating the central chamber and the outer peripheral chamber. A carrier characterized in that the adjusting mechanism is constituted by a throttle portion attached in the flow hole. 4. A pressure chamber is defined by a rotatable lower platen, a concave portion formed on the lower surface of the carrier body, and a sheet covering the concave portion from below, and a fluid supplied into the pressure chamber defines A polishing apparatus comprising: a carrier capable of uniformly pressing a workpiece on a lower platen held under the sheet; and a rotation driving unit configured to rotate the carrier while pressing the carrier. An annular separator that separates the central part and the outer peripheral part of the pressure chamber to define the central part and the outer peripheral part, and the size of the fluid port formed between the central part and the outer peripheral part An adjustable adjustment mechanism, a first flow passage communicating with the central chamber, and a second flow passage communicating with the outer peripheral chamber.
And a fluid supply means for supplying a fluid to either the first or second flow path. 5. The polishing apparatus according to claim 4, wherein the adjusting mechanism of the carrier includes a first thread groove formed in at least one of an outer peripheral surface and an inner peripheral surface of the separation body; A second screw groove that is engraved on at least one of an outer peripheral surface and an inner peripheral surface of an annular hole provided in the carrier main body and that can be screwed with the first screw groove; A polishing apparatus, wherein a fluid inlet / outlet of the carrier is formed by a gap between the separator and the sheet. 6. The polishing apparatus according to claim 4, wherein the fluid inlet / outlet of the carrier is formed with one or more flow holes having a predetermined diameter formed in the separator and communicating the central chamber and the outer peripheral chamber. A polishing apparatus, wherein the adjusting mechanism of the carrier is constituted by a throttle unit mounted in the flow hole.