MY161594A - Mold conditioning rubber composition - Google Patents

Mold conditioning rubber composition

Info

Publication number
MY161594A
MY161594A MYPI2010003310A MYPI2010003310A MY161594A MY 161594 A MY161594 A MY 161594A MY PI2010003310 A MYPI2010003310 A MY PI2010003310A MY PI2010003310 A MYPI2010003310 A MY PI2010003310A MY 161594 A MY161594 A MY 161594A
Authority
MY
Malaysia
Prior art keywords
rubber
mold
cure
rubber composition
seconds
Prior art date
Application number
MYPI2010003310A
Other languages
English (en)
Inventor
Kiyohito Hiromitsu
Hiroaki Nomura
Osamu Sunago
Original Assignee
Nippon Carbide Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Carbide Kogyo Kk filed Critical Nippon Carbide Kogyo Kk
Publication of MY161594A publication Critical patent/MY161594A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/60—Releasing, lubricating or separating agents
    • B29C33/62—Releasing, lubricating or separating agents based on polymers or oligomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/20—Carboxylic acid amides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
MYPI2010003310A 2008-03-31 2009-03-24 Mold conditioning rubber composition MY161594A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008091359 2008-03-31
JP2008091360 2008-03-31
JP2009007239 2009-01-16

Publications (1)

Publication Number Publication Date
MY161594A true MY161594A (en) 2017-04-28

Family

ID=41135335

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010003310A MY161594A (en) 2008-03-31 2009-03-24 Mold conditioning rubber composition

Country Status (7)

Country Link
JP (1) JP5726517B2 (ko)
KR (1) KR101591894B1 (ko)
CN (1) CN101945746B (ko)
MY (1) MY161594A (ko)
SG (1) SG194416A1 (ko)
TW (1) TWI449615B (ko)
WO (1) WO2009122955A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013035965A (ja) * 2011-08-09 2013-02-21 Fujikura Ltd 絶縁組成物及び成形品
WO2014042199A1 (ja) * 2012-09-14 2014-03-20 日本カーバイド工業株式会社 金型離型回復用樹脂組成物及び金型離型回復方法
CN104955627B (zh) * 2013-01-31 2018-02-13 日本电石工业株式会社 模具清扫用树脂组合物和模具清扫方法
CN103171065A (zh) * 2013-03-14 2013-06-26 西北工业大学 一种模具用的脱模胶及其制备方法
WO2016167415A1 (ko) * 2015-04-17 2016-10-20 주식회사 나라켐 충진성이 우수한 고무 조성물
CN106800785B (zh) * 2017-01-17 2019-07-12 华南理工大学 一种环保橡胶流动分散剂及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY102412A (en) 1986-12-11 1992-06-17 Nitto Electric Ind Co Mold cleaning composition, sheet for cleaning mold, and method for cleaning mold using said cleaning sheet.
JPS63159019A (ja) * 1986-12-23 1988-07-01 Kyushu Nitto Denko Kk 離型用シ−ト
CN87104240A (zh) * 1987-06-17 1988-12-28 中国原子能科学研究院 橡胶脱模剂
JP2633101B2 (ja) 1991-04-12 1997-07-23 日東電工株式会社 金型再生用組成物
JP2974267B2 (ja) * 1991-09-30 1999-11-10 日本カーバイド工業株式会社 金型清掃用ゴム系組成物
JP3764239B2 (ja) * 1996-12-10 2006-04-05 日東電工株式会社 半導体装置成形用金型洗浄剤組成物およびそれを用いた金型クリーニング方法
KR100300063B1 (ko) * 1998-12-31 2001-09-22 김영환 반도체 메모리 제조방법
CN100473686C (zh) * 2004-07-28 2009-04-01 纳拉化学株式会社 模具洗净及脱模用橡胶组合物
CN101821075B (zh) * 2007-10-29 2013-11-20 日本碳化物工业株式会社 模具清洁用橡胶系组合物

Also Published As

Publication number Publication date
JP5726517B2 (ja) 2015-06-03
CN101945746B (zh) 2013-09-18
TWI449615B (zh) 2014-08-21
KR101591894B1 (ko) 2016-02-18
TW201000289A (en) 2010-01-01
CN101945746A (zh) 2011-01-12
JPWO2009122955A1 (ja) 2011-07-28
WO2009122955A1 (ja) 2009-10-08
KR20100138878A (ko) 2010-12-31
SG194416A1 (en) 2013-11-29

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