MY156374A - Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device - Google Patents

Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device

Info

Publication number
MY156374A
MY156374A MYPI2011001892A MYPI20111892A MY156374A MY 156374 A MY156374 A MY 156374A MY PI2011001892 A MYPI2011001892 A MY PI2011001892A MY PI20111892 A MYPI20111892 A MY PI20111892A MY 156374 A MY156374 A MY 156374A
Authority
MY
Malaysia
Prior art keywords
optical semiconductor
semiconductor element
element sealant
curable organopolysiloxane
organopolysiloxane composition
Prior art date
Application number
MYPI2011001892A
Other languages
English (en)
Inventor
Yoshitake Makoto
Sagawa Takashi
Terada Masayoshi
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Publication of MY156374A publication Critical patent/MY156374A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

Landscapes

  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
MYPI2011001892A 2008-10-31 2009-10-30 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device MY156374A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008281243 2008-10-31

Publications (1)

Publication Number Publication Date
MY156374A true MY156374A (en) 2016-02-15

Family

ID=41503594

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011001892A MY156374A (en) 2008-10-31 2009-10-30 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device

Country Status (8)

Country Link
US (1) US8946353B2 (cg-RX-API-DMAC7.html)
EP (1) EP2352794A1 (cg-RX-API-DMAC7.html)
JP (1) JP5769622B2 (cg-RX-API-DMAC7.html)
KR (1) KR101632593B1 (cg-RX-API-DMAC7.html)
CN (1) CN102197092A (cg-RX-API-DMAC7.html)
MY (1) MY156374A (cg-RX-API-DMAC7.html)
TW (1) TWI480337B (cg-RX-API-DMAC7.html)
WO (1) WO2010050625A1 (cg-RX-API-DMAC7.html)

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EP2784126B1 (en) 2011-11-25 2019-03-13 LG Chem, Ltd. Curable composition
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KR101667839B1 (ko) * 2013-04-04 2016-10-19 주식회사 엘지화학 경화성 조성물
CN103232707B (zh) * 2013-04-19 2015-12-09 深圳新宙邦科技股份有限公司 可固化硅橡胶组合物及其固化产品与涂覆固化方法
EP2994290B1 (en) 2013-05-10 2023-10-04 ABL IP Holding LLC Silicone optics
KR20140140836A (ko) * 2013-05-30 2014-12-10 엘지이노텍 주식회사 발광소자 패키지
JP2015113348A (ja) * 2013-12-06 2015-06-22 信越化学工業株式会社 硬化性組成物および光半導体装置
WO2015098072A1 (en) * 2013-12-27 2015-07-02 Dow Corning Toray Co., Ltd. Curable organopolysiloxane composition, member for transducers
CN106062080A (zh) * 2014-03-12 2016-10-26 横滨橡胶株式会社 固化性树脂组合物
CN106459102B (zh) * 2014-06-04 2019-07-23 陶氏东丽株式会社 有机硅氧烷、固化性有机硅组合物及半导体装置
CN105199397B (zh) * 2014-06-17 2018-05-08 广州慧谷化学有限公司 一种可固化的有机聚硅氧烷组合物及半导体器件
JP6678388B2 (ja) * 2014-12-25 2020-04-08 信越化学工業株式会社 硬化性シリコーン樹脂組成物
CN105694047B (zh) * 2016-04-26 2018-09-25 烟台德邦先进硅材料有限公司 主链含环状结构改性有机硅聚合物及其制备方法
US9893250B1 (en) * 2016-12-16 2018-02-13 Nichia Corporation Light emitting device having silicone resin-based sealing member
JP6924834B2 (ja) * 2016-12-27 2021-08-25 モメンティブ・パフォーマンス・マテリアルズ・コリア・カンパニー・リミテッドＭｏｍｅｎｔｉｖｅ Ｐｅｒｆｏｒｍａｎｃｅ Ｍａｔｅｒｉａｌｓ Ｋｏｒｅａ Ｃｏ．，Ｌｔｄ 有機電子素子封止材用組成物及びこれを用いて形成された封止材
JP6764390B2 (ja) * 2017-11-02 2020-09-30 信越化学工業株式会社 ダイボンディング用シリコーン組成物、その硬化物、及び発光ダイオード素子
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JP7673941B2 (ja) 2020-07-20 2025-05-09 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物、封止材、及び光半導体装置
KR102467690B1 (ko) * 2020-08-19 2022-11-17 주식회사 케이씨씨실리콘 광학용 폴리실록산 조성물 및 이를 포함하는 광학 반도체용 반사 재료
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Also Published As

Publication number Publication date
US8946353B2 (en) 2015-02-03
JP2012507582A (ja) 2012-03-29
EP2352794A1 (en) 2011-08-10
TWI480337B (zh) 2015-04-11
TW201033288A (en) 2010-09-16
JP5769622B2 (ja) 2015-08-26
CN102197092A (zh) 2011-09-21
US20110254047A1 (en) 2011-10-20
KR20110089164A (ko) 2011-08-04
KR101632593B1 (ko) 2016-06-22
WO2010050625A1 (en) 2010-05-06

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