MY154171A - In-situ cleaning of an imprint lithography tool - Google Patents

In-situ cleaning of an imprint lithography tool

Info

Publication number
MY154171A
MY154171A MYPI2011001463A MYPI20111463A MY154171A MY 154171 A MY154171 A MY 154171A MY PI2011001463 A MYPI2011001463 A MY PI2011001463A MY PI20111463 A MYPI20111463 A MY PI20111463A MY 154171 A MY154171 A MY 154171A
Authority
MY
Malaysia
Prior art keywords
imprint lithography
lithography tool
situ cleaning
energy source
template
Prior art date
Application number
MYPI2011001463A
Other languages
English (en)
Inventor
Schmid Gerard
Ian M Mcmackin
Choi Byung-Jin
Douglas J Resnick
Original Assignee
Molecular Imprints Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Publication of MY154171A publication Critical patent/MY154171A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • General Physics & Mathematics (AREA)
  • Public Health (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Environmental & Geological Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
MYPI2011001463A 2008-10-02 2009-09-23 In-situ cleaning of an imprint lithography tool MY154171A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10208208P 2008-10-02 2008-10-02
US18291209P 2009-06-01 2009-06-01
US12/563,356 US8394203B2 (en) 2008-10-02 2009-09-21 In-situ cleaning of an imprint lithography tool

Publications (1)

Publication Number Publication Date
MY154171A true MY154171A (en) 2015-05-15

Family

ID=41264255

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011001463A MY154171A (en) 2008-10-02 2009-09-23 In-situ cleaning of an imprint lithography tool

Country Status (6)

Country Link
US (1) US8394203B2 (enExample)
JP (1) JP5421378B2 (enExample)
KR (1) KR101659461B1 (enExample)
CN (1) CN102171611B (enExample)
MY (1) MY154171A (enExample)
WO (1) WO2010039196A1 (enExample)

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* Cited by examiner, † Cited by third party
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JP5244566B2 (ja) * 2008-12-02 2013-07-24 株式会社東芝 テンプレート洗浄方法、洗浄システム、及び洗浄装置
JP5443070B2 (ja) * 2009-06-19 2014-03-19 東京エレクトロン株式会社 インプリントシステム
JP5060517B2 (ja) * 2009-06-24 2012-10-31 東京エレクトロン株式会社 インプリントシステム
US20110048518A1 (en) * 2009-08-26 2011-03-03 Molecular Imprints, Inc. Nanostructured thin film inorganic solar cells
US8980751B2 (en) 2010-01-27 2015-03-17 Canon Nanotechnologies, Inc. Methods and systems of material removal and pattern transfer
JP5471514B2 (ja) * 2010-01-28 2014-04-16 ウシオ電機株式会社 光処理装置
RU2606453C2 (ru) 2011-12-03 2017-01-10 Конинклейке Филипс Н.В. Автоматическое изменение глубины и корректирование ориентации при полуавтоматическом планировании пути
JP6304965B2 (ja) * 2012-08-24 2018-04-04 キヤノン株式会社 インプリント装置およびインプリント方法、それを用いた物品の製造方法
JP6193615B2 (ja) * 2013-05-16 2017-09-06 キヤノン株式会社 インプリント装置および物品の製造方法
JP2015149390A (ja) * 2014-02-06 2015-08-20 キヤノン株式会社 インプリント装置、型、および物品の製造方法
JP2016082045A (ja) * 2014-10-16 2016-05-16 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP6525567B2 (ja) * 2014-12-02 2019-06-05 キヤノン株式会社 インプリント装置及び物品の製造方法
JP6525572B2 (ja) * 2014-12-05 2019-06-05 キヤノン株式会社 インプリント装置、および物品の製造方法
JP6702672B2 (ja) * 2015-09-03 2020-06-03 キヤノン株式会社 インプリント装置、物品の製造方法及び供給装置
US10204780B2 (en) * 2015-09-08 2019-02-12 Canon Kabushiki Kaisha Imprint apparatus, and article manufacturing method
CN109414848A (zh) * 2016-07-12 2019-03-01 硬化铬工业股份有限公司 辊表面的附着物去除方法和热塑性树脂片状物的制造方法
JP6659607B2 (ja) * 2017-03-17 2020-03-04 キオクシア株式会社 テンプレート洗浄方法、及びテンプレート洗浄装置
JP7071200B2 (ja) * 2018-04-24 2022-05-18 キヤノン株式会社 成形装置及び物品の製造方法
US10921706B2 (en) 2018-06-07 2021-02-16 Canon Kabushiki Kaisha Systems and methods for modifying mesa sidewalls
US10990004B2 (en) 2018-07-18 2021-04-27 Canon Kabushiki Kaisha Photodissociation frame window, systems including a photodissociation frame window, and methods of using a photodissociation frame window
US11373861B2 (en) 2019-07-05 2022-06-28 Canon Kabushiki Kaisha System and method of cleaning mesa sidewalls of a template
KR102598565B1 (ko) * 2021-03-30 2023-11-07 주식회사 고영테크놀러지 임프린팅 장치 및 임프린팅 방법
JP2024042329A (ja) * 2022-09-15 2024-03-28 キヤノン株式会社 クリーニング装置、クリーニング方法、インプリント装置、及び物品の製造方法
CN117884412A (zh) * 2024-02-08 2024-04-16 北京华卓精科科技股份有限公司 清洁工装及光栅在线清洁方法

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JPH0612766B2 (ja) * 1983-03-04 1994-02-16 株式会社精密エンタプライズ 光照射装置
JPH09123206A (ja) 1995-10-30 1997-05-13 Towa Kk 電子部品の樹脂封止成形装置
JP3683461B2 (ja) * 2000-02-16 2005-08-17 Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 キセノンエキシマランプの光強度測定装置
JP3468215B2 (ja) * 2000-08-08 2003-11-17 ウシオ電機株式会社 誘電体バリア放電ランプを使った処理装置
JP2002075839A (ja) * 2000-08-30 2002-03-15 Canon Inc 露光装置、該露光装置に用いるマスク構造体、露光方法、該露光装置を用いて作製された半導体デバイス、および半導体デバイス製造方法
US6828569B2 (en) * 2001-11-19 2004-12-07 Asml Netherlands B.V. Lithographic projection apparatus, device manufacturing method and device manufactured thereby
DE10211611A1 (de) * 2002-03-12 2003-09-25 Zeiss Carl Smt Ag Verfahren und Vorrichtung zur Dekontamination optischer Oberflächen
JP2004101868A (ja) * 2002-09-10 2004-04-02 Hitachi Ltd フォトマスクの製造方法
JP3749950B2 (ja) * 2003-08-14 2006-03-01 国立大学法人名古屋大学 マイクロパターンの形成方法、マイクロパターン、マイクロパターン転写形成用モールドの作製方法、及びマイクロパターン転写形成用モールド
DE10343323A1 (de) 2003-09-11 2005-04-07 Carl Zeiss Smt Ag Stempellithografieverfahren sowie Vorrichtung und Stempel für die Stempellithografie
JP2005327788A (ja) * 2004-05-12 2005-11-24 Hitachi Cable Ltd 微細パターン形成用モールド及びその製造方法
US7385670B2 (en) * 2004-10-05 2008-06-10 Asml Netherlands B.V. Lithographic apparatus, cleaning system and cleaning method for in situ removing contamination from a component in a lithographic apparatus
JP2007088116A (ja) * 2005-09-21 2007-04-05 Harison Toshiba Lighting Corp 紫外光照射装置および光洗浄装置
JP2007324504A (ja) 2006-06-05 2007-12-13 Ibaraki Univ 転写印刷方法、転写印刷装置およびそれを用いて製造した転写印刷製品
US7832416B2 (en) 2006-10-10 2010-11-16 Hewlett-Packard Development Company, L.P. Imprint lithography apparatus and methods
US8337959B2 (en) * 2006-11-28 2012-12-25 Nanonex Corporation Method and apparatus to apply surface release coating for imprint mold
JP2008193035A (ja) * 2007-02-08 2008-08-21 Matsushita Electric Ind Co Ltd 微細形状転写方法および微細形状転写装置

Also Published As

Publication number Publication date
CN102171611A (zh) 2011-08-31
KR101659461B1 (ko) 2016-09-23
CN102171611B (zh) 2014-11-12
KR20110063639A (ko) 2011-06-13
WO2010039196A1 (en) 2010-04-08
US20100085555A1 (en) 2010-04-08
JP2012504865A (ja) 2012-02-23
JP5421378B2 (ja) 2014-02-19
US8394203B2 (en) 2013-03-12

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