MY143678A - Polishing composition for noble metals - Google Patents

Polishing composition for noble metals

Info

Publication number
MY143678A
MY143678A MYPI20053434A MYPI20053434A MY143678A MY 143678 A MY143678 A MY 143678A MY PI20053434 A MYPI20053434 A MY PI20053434A MY PI20053434 A MYPI20053434 A MY PI20053434A MY 143678 A MY143678 A MY 143678A
Authority
MY
Malaysia
Prior art keywords
polishing composition
polishing
ruthenium
metal
chemically
Prior art date
Application number
MYPI20053434A
Other languages
English (en)
Inventor
Francesco De Rage Thesauro
Vlasta Brusic
Christopher C Thompson
Benjamin P Bayer
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of MY143678A publication Critical patent/MY143678A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
MYPI20053434A 2004-07-28 2005-07-26 Polishing composition for noble metals MY143678A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/901,420 US7161247B2 (en) 2004-07-28 2004-07-28 Polishing composition for noble metals

Publications (1)

Publication Number Publication Date
MY143678A true MY143678A (en) 2011-06-30

Family

ID=34973040

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20053434A MY143678A (en) 2004-07-28 2005-07-26 Polishing composition for noble metals

Country Status (9)

Country Link
US (1) US7161247B2 (enExample)
EP (2) EP2431434B1 (enExample)
JP (2) JP4516119B2 (enExample)
KR (1) KR101201063B1 (enExample)
CN (1) CN1993437B (enExample)
IL (1) IL179941A (enExample)
MY (1) MY143678A (enExample)
TW (1) TWI302163B (enExample)
WO (1) WO2006023105A1 (enExample)

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JP2017178972A (ja) * 2014-08-07 2017-10-05 日立化成株式会社 Ｃｍｐ用研磨液及びこれを用いた研磨方法
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JP6874231B1 (ja) * 2019-09-27 2021-05-19 株式会社トクヤマ ＲｕＯ４ガスの発生抑制剤及びＲｕＯ４ガスの発生抑制方法
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Also Published As

Publication number Publication date
CN1993437A (zh) 2007-07-04
EP2431434B1 (en) 2017-11-01
EP1797152A1 (en) 2007-06-20
WO2006023105A1 (en) 2006-03-02
IL179941A (en) 2011-04-28
KR101201063B1 (ko) 2012-11-14
CN1993437B (zh) 2013-07-31
JP4516119B2 (ja) 2010-08-04
IL179941A0 (en) 2007-05-15
JP2008518427A (ja) 2008-05-29
US7161247B2 (en) 2007-01-09
US20060024967A1 (en) 2006-02-02
TWI302163B (en) 2008-10-21
JP2009006469A (ja) 2009-01-15
TW200613534A (en) 2006-05-01
EP2431434A1 (en) 2012-03-21
KR20070049185A (ko) 2007-05-10
EP1797152B1 (en) 2015-09-16

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