MY135561A - Adhesive-coated copper foil - Google Patents
Adhesive-coated copper foilInfo
- Publication number
- MY135561A MY135561A MYPI9400142A MY135561A MY 135561 A MY135561 A MY 135561A MY PI9400142 A MYPI9400142 A MY PI9400142A MY 135561 A MY135561 A MY 135561A
- Authority
- MY
- Malaysia
- Prior art keywords
- adhesive
- copper foil
- resin
- weight
- parts
- Prior art date
Links
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26826993A JP3326448B2 (ja) | 1993-09-30 | 1993-09-30 | 接着剤層を有する銅箔 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY135561A true MY135561A (en) | 2008-05-30 |
Family
ID=17456225
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI9400142 MY135561A (en) | 1993-09-30 | 1994-01-19 | Adhesive-coated copper foil |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3326448B2 (ja) |
CN (1) | CN1089791C (ja) |
MY (1) | MY135561A (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3362804B2 (ja) * | 1993-10-25 | 2003-01-07 | 日立化成工業株式会社 | 接着剤付き銅はく及びこの接着剤付き銅はくを用いた多層プリント配線板用銅張り積層板の製造方法 |
DE69531633D1 (de) * | 1995-07-04 | 2003-10-02 | Mitsui Mining & Smelting Co | Harzbeschichtete kupferfolie für mehrschichtige gedruckte leiterplatte und mit dieser kupferfolie versehene mehrschichtige gedruckte leiterplatte |
JP5265844B2 (ja) * | 2004-11-16 | 2013-08-14 | 日立化成株式会社 | 熱硬化性樹脂組成物、プリプレグ、積層板及びプリント配線板 |
CN101980862A (zh) * | 2008-03-26 | 2011-02-23 | 住友电木株式会社 | 具有铜箔的树脂板、多层印制线路板、多层印制线路板的制造方法和半导体装置 |
CN102786664B (zh) * | 2012-07-17 | 2014-07-23 | 常州大学 | 一种低介电高耐热环氧树脂组合物及其制备方法 |
CN110437402A (zh) * | 2019-08-09 | 2019-11-12 | 中国科学院兰州化学物理研究所 | 一种具有形状记忆性能的互穿网络聚合物的制备方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6270473A (ja) * | 1985-09-24 | 1987-03-31 | Denki Kagaku Kogyo Kk | フレキシブルプリント基板 |
DE4036802A1 (de) * | 1990-11-19 | 1992-05-21 | Huels Troisdorf | Verfahren zur herstellung von kupferkaschierten basismaterialtafeln |
-
1993
- 1993-09-30 JP JP26826993A patent/JP3326448B2/ja not_active Expired - Fee Related
-
1994
- 1994-01-19 MY MYPI9400142 patent/MY135561A/en unknown
- 1994-09-29 CN CN94115385A patent/CN1089791C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH07106752A (ja) | 1995-04-21 |
JP3326448B2 (ja) | 2002-09-24 |
CN1104669A (zh) | 1995-07-05 |
CN1089791C (zh) | 2002-08-28 |
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