MY135561A - Adhesive-coated copper foil - Google Patents

Adhesive-coated copper foil

Info

Publication number
MY135561A
MY135561A MYPI9400142A MY135561A MY 135561 A MY135561 A MY 135561A MY PI9400142 A MYPI9400142 A MY PI9400142A MY 135561 A MY135561 A MY 135561A
Authority
MY
Malaysia
Prior art keywords
adhesive
copper foil
resin
weight
parts
Prior art date
Application number
Other languages
English (en)
Inventor
Tetsuro Sato
Yoshinori Kanao
Yuji Tejima
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of MY135561A publication Critical patent/MY135561A/en

Links

Landscapes

  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
MYPI9400142 1993-09-30 1994-01-19 Adhesive-coated copper foil MY135561A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26826993A JP3326448B2 (ja) 1993-09-30 1993-09-30 接着剤層を有する銅箔

Publications (1)

Publication Number Publication Date
MY135561A true MY135561A (en) 2008-05-30

Family

ID=17456225

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI9400142 MY135561A (en) 1993-09-30 1994-01-19 Adhesive-coated copper foil

Country Status (3)

Country Link
JP (1) JP3326448B2 (ja)
CN (1) CN1089791C (ja)
MY (1) MY135561A (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3362804B2 (ja) * 1993-10-25 2003-01-07 日立化成工業株式会社 接着剤付き銅はく及びこの接着剤付き銅はくを用いた多層プリント配線板用銅張り積層板の製造方法
DE69531633D1 (de) * 1995-07-04 2003-10-02 Mitsui Mining & Smelting Co Harzbeschichtete kupferfolie für mehrschichtige gedruckte leiterplatte und mit dieser kupferfolie versehene mehrschichtige gedruckte leiterplatte
JP5265844B2 (ja) * 2004-11-16 2013-08-14 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、積層板及びプリント配線板
CN101980862A (zh) * 2008-03-26 2011-02-23 住友电木株式会社 具有铜箔的树脂板、多层印制线路板、多层印制线路板的制造方法和半导体装置
CN102786664B (zh) * 2012-07-17 2014-07-23 常州大学 一种低介电高耐热环氧树脂组合物及其制备方法
CN110437402A (zh) * 2019-08-09 2019-11-12 中国科学院兰州化学物理研究所 一种具有形状记忆性能的互穿网络聚合物的制备方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6270473A (ja) * 1985-09-24 1987-03-31 Denki Kagaku Kogyo Kk フレキシブルプリント基板
DE4036802A1 (de) * 1990-11-19 1992-05-21 Huels Troisdorf Verfahren zur herstellung von kupferkaschierten basismaterialtafeln

Also Published As

Publication number Publication date
JPH07106752A (ja) 1995-04-21
JP3326448B2 (ja) 2002-09-24
CN1104669A (zh) 1995-07-05
CN1089791C (zh) 2002-08-28

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