MY133099A - Solder ball loading mechanism - Google Patents
Solder ball loading mechanismInfo
- Publication number
- MY133099A MY133099A MYPI98002503A MYPI9802503A MY133099A MY 133099 A MY133099 A MY 133099A MY PI98002503 A MYPI98002503 A MY PI98002503A MY PI9802503 A MYPI9802503 A MY PI9802503A MY 133099 A MY133099 A MY 133099A
- Authority
- MY
- Malaysia
- Prior art keywords
- ball
- templates
- detector
- container
- plate
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
THE PRESENT BALL LOADING MECHANISM (1) INCLUDES A MOVABLE PLATE (5). RESTING ON TOP OF THE PLATE IS A BALL CONTAINER (15) ADAPTED FOR HOLDING RELATIVELY LARGE QUANTITIES OF SOLDER BALLS (20). PRESSURIZED AIR IS PROVIDED FROM TWO SIDES OF THE CONTAINER (15) VIA AN AIR SUPPLY TUBE (25) IN AN ALTERNATING FASHION WHERE ONLY ONE OF THE TUBES IS PROVIDING AIR AT ANY GIVEN TIME SUCH THAT THE AIR PRESSURE CAUSES THE SOLDER BALLS (20) TO MOVE FROM SIDE TO SIDE INSIDE THE CONTAINER (15). THE PLATE (5) HAS AT LEAST ONE ARRAY. THE TEMPLATE (10) BASICALLY COMPRISES STEP HOLES (39) WHICH ARE ARRANGED IN AN ARRAY FORMATION IDENTICAL TO THAT OF THE PATTERN FORMED BY THE BALLS (20) ON THE EVENTUAL BGA DEVICE. A PAIR OF SENSOR DEVICES, A DETECTOR (30) AND AN EMITTER (35), IS PROVIDED FOR DETECTING A MISSING BALL IN THE TEMPLATES (10) . THE EMITTER (35) SHINES A LIGHT THROUGH THE TEMPLATES (10) SO THAT ANY HOLE WHICH IS NOT OCCUPIED BY A SOLDER BALL WILL ALLOW THE LIGHT TO BE SHINED ONTO THE DETECTOR (30) WHEN THE TEMPLATES ARE POSITIONED BELOW THE DETECTOR(30).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG1997001173A SG66361A1 (en) | 1997-04-11 | 1997-04-11 | Solder ball loading mechanism |
PCT/SG1998/000025 WO1998047330A1 (en) | 1997-04-11 | 1998-04-09 | Solder ball loading mechanism |
Publications (1)
Publication Number | Publication Date |
---|---|
MY133099A true MY133099A (en) | 2007-10-31 |
Family
ID=20429621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI98002503A MY133099A (en) | 1997-04-11 | 1998-06-04 | Solder ball loading mechanism |
Country Status (4)
Country | Link |
---|---|
MY (1) | MY133099A (en) |
SG (1) | SG66361A1 (en) |
TW (1) | TW405194B (en) |
WO (1) | WO1998047330A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6641030B1 (en) | 1997-02-06 | 2003-11-04 | Speedline Technologies, Inc. | Method and apparatus for placing solder balls on a substrate |
US6769596B1 (en) * | 2002-11-15 | 2004-08-03 | Qlogic Corporation | Method and system for reworking ball grid arrays |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5431332A (en) * | 1994-02-07 | 1995-07-11 | Motorola, Inc. | Method and apparatus for solder sphere placement using an air knife |
US5540377A (en) * | 1994-07-15 | 1996-07-30 | Ito; Carl T. | Solder ball placement machine |
US5551216A (en) * | 1994-09-14 | 1996-09-03 | Vanguard Automation, Inc. | Method and apparatus for filling a ball grid array |
US5620129A (en) * | 1995-02-17 | 1997-04-15 | Rogren; Philip E. | Device and method for forming and attaching an array of conductive balls |
-
1997
- 1997-04-11 SG SG1997001173A patent/SG66361A1/en unknown
-
1998
- 1998-04-02 TW TW087104988A patent/TW405194B/en not_active IP Right Cessation
- 1998-04-09 WO PCT/SG1998/000025 patent/WO1998047330A1/en active Application Filing
- 1998-06-04 MY MYPI98002503A patent/MY133099A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO1998047330A1 (en) | 1998-10-22 |
TW405194B (en) | 2000-09-11 |
SG66361A1 (en) | 1999-07-20 |
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