JPH07202402A - Solder bump carrying/feeding apparatus - Google Patents

Abstract

PURPOSE:To feed solder bumps onto a cream solder pattern formed on the surface of a semiconductor device without missing. CONSTITUTION:A carrying stage 31 is provided with a carrying head 22 having a plurality of ball suction holes 27 on the ball holding face thereof. A vacuum drive chamber communicating with the ball suction holes is formed in the carrying head 22 and evacuated by means of a vacuum pump. The solder ball 20 is then sucked to each suction hole 27 and carried above a semiconductor device 1. Subsequently, the carrying head 22 is lowered and the solder ball 20 is pressed slightly against a cream solder pattern 19 printed on the surface of the semiconductor device 1. Under that state, the vacuum pump is stopped and the solder ball 20 is separated from the suction hole 27 thus feeding a plurality of solder balls 20 simultaneously onto the printed pattern of cream solder.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to, for example, ICs and LSIs.
The present invention relates to a device for feeding and supplying solder balls onto cream solder for pads printed on the surface of a plurality of semiconductor devices such as.

[0002]

2. Description of the Related Art FIG. 9 shows a semiconductor device in which semiconductor elements such as IC and LSI are contained in a general semiconductor element housing package. A plurality of lead pins 2 are formed on the side of the semiconductor device 1, and the semiconductor device 1 is mounted on the circuit board by connecting the lead pins 2 to a circuit pattern of a circuit board (not shown).

However, in the structure in which the plurality of lead pins 2 are formed in the semiconductor device 1, there is a problem that the semiconductor device 1 becomes large in size because the lead pins 2 are formed so as to project from the main body of the semiconductor device 1. The work of connecting the plurality of lead pins 2 to the semiconductor device is complicated and the mounting density is low.

In order to solve such a problem, the applicant has previously proposed a semiconductor device 1 as shown in FIG. In the semiconductor device 1 of this proposal, cream solder is printed and formed at a plurality of predetermined positions on the surface of the semiconductor device, solder balls are placed on the cream solder printing portion, and the solder balls are passed through a heating furnace to be reflowed. The spherical pads 3 for connection are formed by fixing the arrangement on the surface of the. When the semiconductor device 1 is mounted on the circuit board, the pads 3 of the semiconductor device 1 are mounted on the circuit board with the formation surface of the pads 3 of the semiconductor device 1 on the circuit board side, and reflowed in this state, so that the pads 3 of the semiconductor device 1 are connected to the circuit. The semiconductor devices 1 are collectively connected and fixed to a predetermined connection position on the board, and the semiconductor device 1 is surface-mounted on the circuit board.

According to the semiconductor device 1 of this proposed example, the lead pin 2 of the conventional example is not required, and the semiconductor device 1 can be significantly downsized and mounted on a circuit board at a high density.

[0006]

When the cream solder for forming the pad 3 is printed on the surface of the semiconductor device 1 of the above-mentioned proposed example, as shown in FIG. 7, the work table 4 of the cream solder printing machine is used. The semiconductor device 1 is positioned and mounted on the upper surface of the semiconductor device 1 and a printing mask 6 having a plurality of holes 5 corresponding to the positions of the pads 3 is applied to the upper side thereof, and the cream solder 7 supplied to the upper side of the printing mask 6 is applied. Squeegee 8
Is put into the hole 5 by the sliding movement of and the cream solder of the pattern shape of the hole 5 of the print mask 6 is transferred to the surface of the semiconductor device 1 to form the cream solder for forming the pad 3 on the surface of the semiconductor device 1. Can be printed.

However, it is very troublesome to mount the plurality of semiconductor devices 1 one by one on the work table 4 of the printing machine and print the cream solder for pads one by one, and it is difficult to improve work efficiency. is there. Therefore, in order to solve such a difficulty, the applicant has proposed a semiconductor device array plate capable of collectively printing cream solder on the surfaces of a plurality of semiconductor devices.

FIG. 4 shows the proposed semiconductor device array plate. In the figure, on the surface of the semiconductor device array plate 10 made of aluminum or the like, a plurality of quadrangular semiconductor device housing holes 11 are arrayed and formed in a two-dimensional matrix shape (6 columns in the vertical direction and 5 columns in the horizontal direction). . The semiconductor device accommodation hole 11 is a through hole, and each semiconductor device accommodation hole 11
The mounting reference surface 12 is formed on the bottom side of the
The depth from the surface side of the semiconductor device accommodating hole 11 to the mounting reference surface 12 corresponds to the height dimension of the semiconductor device to be accommodated, and the semiconductor device is mounted on the mounting reference surface 12 and the semiconductor The surface height of the device matches the surface height of the base plate 10. The vertical and horizontal dimensions of the rectangular semiconductor device accommodation hole 11 are larger than the corresponding dimensions of the same rectangular semiconductor device.

Two adjacent surfaces of the quadrangular semiconductor device accommodating hole 11 are positioning reference surfaces 13a and 13b. The positioning reference surface 13a is as shown in FIG.
The semiconductor device 1 accommodated in the semiconductor device accommodation hole 11 serves as a reference surface that regulates the position in the X-axis direction, and the positioning reference surface 13b serves as a reference surface that regulates the position of the semiconductor device 1 in the Y-axis direction. There is.

A spring accommodating recess 9 is formed in a diagonally opposite side of the positioning reference surfaces 13a and 13b, that is, in a linear region connecting a corner A and a corner B of the semiconductor device accommodating hole 11, and the spring accommodating recess 9 is formed. A U-shaped bifurcated leaf spring 14 is disposed therein as a semiconductor device holding means. The bifurcated leaf spring 14 has two (a pair) spring leaf-shaped foot springs 15a and 15b from the base end side.
Is extended into the semiconductor device accommodation hole 11 toward the diagonal position A side of the semiconductor device accommodation hole 11, and the foot springs 15a and 15b thereof are provided.
The front end side of is bent outward with a curved line.
The bifurcated leaf spring 14 is fixed by a mounting rod 16 inserted on the base end side.
The semiconductor device array plate 10 is fixed at 16 by implantation.
The height of the bifurcated leaf spring 14 and the mounting rod 16 matches the surface height of the semiconductor device array plate 10,
It is set so as not to project upward from the surface of the semiconductor device array plate 10.

When cream solder printing is collectively performed on the surfaces of a plurality of semiconductor devices 1 using this semiconductor device array plate, as shown in FIG. 5A, a bifurcated leaf spring is formed.
With 14 being free, as shown in FIG. 3B, a thick insertion pin 21 is inserted between the crotch portions of the bifurcated leaf spring 14 to open the leg springs 15a and 15b, and the semiconductor device accommodation hole 11 The semiconductor device 1 is inserted into the semiconductor device housing hole 11 with the foot springs 15a and 15b retracted from the path through which the semiconductor device 1 is inserted.
After this semiconductor device is inserted, the leg springs 15a and 15b are released from the open state, so that the semiconductor device 1 is positioned by the elastic restoring force of the foot springs 15a and 15b as shown in FIG. The semiconductor device 1 is held in pressure contact with the 13a and 13b to achieve the positioning of the semiconductor device 1 in the X and Y biaxial directions, and the semiconductor device 1 is mounted on the mounting reference surface 12 so that the positioning in the height direction is also achieved. The semiconductor device is accommodated in the semiconductor device accommodation hole 11 in this state.

In this way, the semiconductor device array plate
After the semiconductor device 1 is accommodated and held in all the semiconductor device accommodating holes 11 of 10 in a positioned state, the semiconductor device array plate 10 is shown in FIG.
The solder cream is attached to the work table 4 of the printing machine shown in FIG. 1 in a positioned state, and the cream solder 7 is pushed into the holes 5 of the print mask 6 by the squeegee 8 from the upper side of the print mask 6, thereby the surfaces of all the semiconductor devices 1 are covered. A cream solder print for the pad is formed without misalignment.

After printing the cream solder, the semiconductor device array plate 10 is removed from the work table 4, and the solder balls are placed on the pattern of the cream solder printed and formed. In this step, as shown in FIG. 6, each semiconductor device 1 housed in the semiconductor device array plate
A ball hole slightly larger than the cream solder print pattern on the cream solder print portion of the semiconductor device 1 on the upper side of the
The solder mask 20 is applied to the upper side of the ball mask 18 with the balls 17 facing each other, and the solder balls 20 are put into the ball holes 17 by using a brush or the like. The solder ball 20 is placed on the solder printing pattern.

After the step of mounting the solder balls, the ball mask 18 is separated, and the semiconductor devices 1 are accommodated in the semiconductor device array plate 10 and reflowed through a heating furnace, as shown in FIG. A pad 3 having a spherical shape of a solder ball is formed on the surface of the semiconductor device 1.

However, in the step of mounting the solder balls 20, a large number of small ball holes 17 in the ball mask 18 are formed.
In addition, since it is a method of dropping a minute solder ball 20 having a diameter of about 0.7 mm by using a brush or the like, it is possible to visually check whether or not the solder ball 20 has been dropped into all the ball holes 17 of the ball mask 18. It is extremely difficult to confirm by the method described above, and it may happen that the solder balls 20 are not dropped into the ball holes 17 and the solder balls 20 are moved to the next reflow step. ball
If 20 pad missing portions occur, the semiconductor device 1 becomes a defective product, and there is a problem that the yield of non-defective products decreases.

The present invention has been made in order to solve the above problems, and an object thereof is to convey a solder ball capable of supplying and mounting the solder ball 20 on the cream solder printing pattern of the semiconductor device 1 without omission. It is to provide a supply device.

[0017]

In order to achieve the above object, the present invention is constructed as follows. That is, the present invention is a solder ball transfer / supply device that collectively transfers and supplies solder balls to a plurality of cream solder application areas printed on the surface, and the surface of a transfer head that holds and transfers the solder balls. A ball holding surface is formed on the ball holding surface, and a plurality of ball suction holes corresponding to the positions of the cream solder printing areas are formed on the ball holding surface. It is communicated with the drive chamber, and the vacuum suction on the vacuum drive chamber side sucks and holds the solder balls in each ball suction hole,
It is characterized in that the solder balls sucked and held in the suction holes are separated by stopping the vacuum suction.

It is also a feature of the present invention that the ball holding surface is provided with a pinching prevention means for preventing an unnecessary solder ball from being pinched between the solder balls sucked in the ball suction holes. By the way.

[0019]

In the present invention having the above-mentioned structure, after the solder paste is printed and formed on the surface of the semiconductor device, when the solder ball is placed on the print formation pattern, the solder ball transfer head is put in the container. The air in the vacuum drive chamber of the transfer head is evacuated using a vacuum pump or the like. Then, the vacuum drive chamber is brought into a vacuum state, and the vacuum suction force acts on the ball suction holes formed on the ball holding surface on the front surface side of the transfer head, and the solder balls in the container are suction-held in the respective ball suction holes. After the solder balls are sucked and held in all the ball suction holes, the transport head is moved to the upper side of the semiconductor device, and in this state, each solder ball descends to the position where it abuts the cream solder on the surface of the corresponding semiconductor device, Release the vacuum in the vacuum drive chamber.
As a result, the solder balls that have been conveyed are supplied and placed at the correct positions in the corresponding cream solder application areas of the semiconductor device.

[0020]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows the configuration of essential parts of an embodiment of a solder ball transfer device according to the present invention. In the figure, the transfer stage 31 is provided with a solder ball transfer head 22, and the transfer control device 23 of the transfer stage 31 controls the transfer movement operation of the transfer head 22. Transport head 22
Is for moving between the inside of a container (not shown) in which the solder balls are housed and the semiconductor devices 1 positioned and housed in the semiconductor device housing holes 11 of the semiconductor device array plate 10. Then, the transport head 22 moves up and down in the Z direction, and moves in the X and Y biaxial directions orthogonal to the Z axis.
Rotational movement is possible within the X and Y planes, and each movement of these is controlled by the conveyance control device 23, and the conveyance movement of the conveyance head 22 is performed as described above. As shown in FIG. 2, the transfer head has a concave portion with a front end face opening formed inside the head body 24, and the concave portion space serves as a vacuum drive chamber 25.

The tip surface of the concave portion of the head body 24 is covered with a ball holding plate 26, and the ball holding plate 26 is fixed to the head body 24 by an appropriate means such as bonding or screwing. A plurality of ball suction holes 27 are formed in an array on the ball holding plate 26 so as to correspond to the printing positions (printing patterns) 19 of the pad cream solder of the semiconductor device 1, and the solder balls 20 are sucked into the ball suction holes 27. As possible, the size of the ball suction holes 27 is smaller than that of the solder balls 20.

A boss portion is provided at the center of the transport head 22 on the base end side.
28 is protrudingly provided on the rear side, and one end side of the pipe rod 30 is airtightly attached to the boss portion 28. In this embodiment, the transport head 22 is connected to the pipe rod 30 so that it can slide in the longitudinal direction of the pipe rod 30 to some extent.

The other end of the pipe rod 30 has a transfer stage 31.
The pipe hole of the pipe rod 30 is connected to a vacuum pump (not shown) via a conduit 32 such as a hose. In the figure, reference numeral 33 denotes a transport head in which one end side is locked to the transport head 22 and the other end side is locked to the transport stage 31.
It is a spring that constantly urges 22 downward.

In this embodiment, a vacuum sensor 34 for detecting the vacuum pressure of the vacuum drive chamber 25 is provided.
The vacuum detection signal 34 is applied to the suction determination circuit 35.
The suction determination circuit 35 is provided with a vacuum pressure value for determining whether or not the solder balls 20 are vacuum-sucked in all the ball suction holes 27, that is, a determination reference value (determination reference pressure value) in advance. There is. The suction determination circuit 35 compares the vacuum detection value of the vacuum sensor 34 with the determination reference value, and when the vacuum detection value is smaller than the determination reference value, that is, when the vacuum detection pressure is small, one of the ball suction holes 27 is detected. Solder balls 20
It is judged that there is a leak part where
Outputs a suction failure signal. On the other hand, when the vacuum detection value is equal to or more than the judgment reference value, all the ball suction holes are
It is determined that the solder ball 20 has been adsorbed on 27, and a normal adsorption signal is supplied to the display unit 36.

The display unit 36 distinguishes and displays the suction failure signal and the suction normal signal applied from the suction determination circuit 35.

This embodiment is constructed as described above,
Next, the solder ball feeding and supplying operation will be described. First,
After the printing of the cream solder on the surface of the semiconductor device 1 is completed, each semiconductor device 1 is set in a predetermined work position while being positioned and accommodated in the semiconductor device array plate 10. In this state, when an ON command is applied to the transfer control device 23, the transfer control device 23 drives and controls the transfer stage 31,
The carrier head 22 is put into a container for containing solder balls, and the vacuum pump is turned on. By turning on the vacuum pump, the vacuum drive chamber 25 in the transfer head 22 is evacuated, and a vacuum suction force is applied from the vacuum drive chamber 25 to each ball suction hole 27. The vacuum pressure at this time is constantly monitored and detected by the vacuum sensor 34.

The vacuum suction force from the vacuum drive chamber 25 acts on the ball suction holes 27, so that the solder balls 20 in the container are sucked into the ball suction holes 27. Due to the suction of the solder balls, the vacuum pressure in the vacuum drive chamber 25 is further increased, and the vacuum detection value and the determination reference value for determining the quality of the vacuum suction are compared by the suction determination circuit 35, and the information of the comparison result is displayed. It is added to the section 36 and the transfer control device 23.

When the suction determination circuit 35 determines that there is a suction failure, a message to that effect is displayed on the display unit 36, and the transport head
22 Move the solder ball 20 into the ball suction hole 27
To be easily absorbed. When the suction determination circuit 35 determines that the suction is good, the fact is displayed on the display unit 36. On the other hand, the transfer control device 23 receives the suction normal signal and drives the transfer stage 31 to transfer the transfer head 22 onto the semiconductor device 1 of the corresponding semiconductor device array plate 10. Next, the transport head 22 is lowered, and the solder balls 20 sucked and held in the ball suction holes 27 are slightly pressed against the solder cream print pattern 19 on the surface of the semiconductor device 1 by using the spring pressure of the spring 33. , Stop the vacuum pump, vacuum drive chamber
The vacuum pressure in 25 is released to atmospheric pressure. By this vacuum release, the vacuum suction action on the ball suction holes 27 is stopped, and the solder balls 20 held in the ball suction holes 27 are separated from the ball suction holes 27 by their own weight and the adhesive force of the cream solder 7. As a result, the solder balls 20 are collectively placed on all the cream solder printing application areas of the semiconductor device 1.

In this way, the semiconductor device array plate
After the solder balls 20 are placed on the cream solder printing pattern of the semiconductor device 1 which is positioned and accommodated in each of the semiconductor device accommodating holes 11 of 10, the reflow process is performed, and the solder balls 20 are transferred to the surface of each semiconductor device 1 as described above. As a result, a substantially spherical pad 3 as shown in 3 is formed.

According to this embodiment, a vacuum suction force is applied from the side of the vacuum drive chamber 25 to the ball suction holes 27 formed on the ball holding surface of the transfer head 22 to suck the solder balls 20, and each semiconductor device 1 When the solder ball 20 is not sucked even in one of the plurality of ball suction holes 27, a vacuum leak in that portion causes all the balls to be supplied. The vacuum suction force acting on the suction holes 27 is weakened, and the solder balls 20 are not sucked into all the ball suction holes 27. This state is determined by the suction determination circuit 35, and the solder ball 20 is transported. Not all ball suction holes
Only when the solder ball 20 is sucked and held by the 27, the suction determination circuit 35 determines that the solder ball 20 is in a good suction state, and the solder ball 20
Are collectively conveyed and supplied to the semiconductor device 1 side. Therefore, the solder cream printing pattern on the semiconductor device 1
No missing portion of the solder ball 20 is generated in 19 and, accordingly, a pad of the solder ball having no missing portion is formed on the package surface of the semiconductor device 1, and a defect due to the missing portion of the solder ball 20 is generated. No occurrence,
The reliability of the work for forming the connection pad 3 can be significantly improved.

The present invention is not limited to the above-mentioned embodiment, and various embodiments can be adopted. For example, in the above-described embodiment, the spring 33 is provided between the transfer head 22 and the transfer stage 31, and the solder ball 20 is pressed against the cream solder side when the transfer of the solder ball 20 to the semiconductor device 1 is completed. The pressing force does not necessarily have to be caused by the coiled spring 33, and other types of spring pressure such as a leaf spring may be used.
A bellows-shaped pipe (hose) that is elastically expandable and contractible is used, and the solder ball is produced by the elastic restoring force of this pipe itself.
20 may be pushed into the cream solder printing side.

Further, as another configuration example, a spring
Solder balls that have been transported while omitting 33 and fixing the transport head 22 to the pipe rod 30 so that it cannot slide vertically.
After bringing 20 into contact with the solder cream printing application area on the surface of the semiconductor device 1, the vacuum suction is stopped and the solder ball is applied.
When the ball 20 is separated from the ball suction hole 27, a compression pressure is applied to the ball suction hole 27, and the solder ball 20 is blown to the solder cream side by this compression pressure to give a pushing force to the solder ball 20. May be.

Further, in the above embodiment, the suction determination circuit 35
When the ball suction failure state is determined by the display unit 36, the fact is displayed on the display unit 36. However, in accordance with this display, a buzzer may be sounded to notify the operator of the suction failure state.

Furthermore, in the description of the above embodiment, after the cream solder for pads is printed on the surface of the semiconductor device 1, the semiconductor device array plate 10 is removed from the work table 4 of the cream solder printer and the solder balls are conveyed. Although the supply operation is performed, the solder ball transfer and supply operation may be performed on the work table 4 of the printing machine without removing the semiconductor device array plate 10 from the work table 4 of the printing machine.

Further, in the above-mentioned embodiment, the semiconductor device array plate 10 is used to position and hold the semiconductor device 1 and the solder balls are conveyed and supplied in this state. Of course, the semiconductor device array plate 10 is not used. The solder balls may be conveyed and supplied onto one solder cream pattern.

Further, a pinching prevention means for blocking the pinching of unnecessary solder balls may be provided on the ball holding surface of the transfer head. As shown in FIG. 10, when the solder balls 20 are sucked into the ball suction holes, the distance between the sucked solder balls may be almost equal to the diameter of one solder ball. In this case, there is a risk that unnecessary solder balls 20A will be sandwiched between the sucked solder balls 20 and conveyed.

In order to avoid this, as shown in FIG. 11, it is desirable to provide pinching prevention means on the ball holding surface. In FIG. 11A, the protrusion 37 is formed at the center between the ball suction holes 27.
Is provided to shift the positions of the suction solder balls 20 and the unnecessary solder balls 20A in the height direction so that the unnecessary solder balls 20A are not sandwiched between the suction solder balls 20. FIG. A stepped recess 38 is provided on the suction surface side of the suction hole 27 to similarly cause a height shift between the suction solder ball 20 and the unnecessary solder ball 20A so that the unnecessary solder ball 20A is not sandwiched between the suction solder balls 20. It is the one. By providing these pinch prevention means, the problem of erroneous conveyance of the unnecessary solder balls 20A can be reliably prevented.

Further, in the above embodiment, the same number of ball suction holes 27 as the number of cream solder application patterns on the surface of the semiconductor device are formed on the ball holding surface, and the solder ball for one semiconductor device is carried by one carrying operation. Although the balls 20 are collectively transported, the area of the ball holding surface is increased to form the ball suction holes 27 for a plurality of semiconductor devices, and the solder balls 20 for a plurality of semiconductor devices can be transported by one transportation operation. You may make it carry in batch. By doing so, the transport efficiency can be significantly improved.

Further, the solder ball carrying / supplying device of the present invention is not limited to the use for carrying and supplying the solder ball onto the cream solder pattern provided on the surface of the semiconductor device 1, and can be applied to a normal circuit board. It goes without saying that it can be applied as a device for feeding and supplying the solder balls 20 onto the provided cream solder printing pattern.

[0040]

According to the present invention, the solder balls are vacuum-sucked into a plurality of ball suction holes formed on the ball holding surface of the transfer head, and the solder balls are collectively supplied to the cream solder print forming area. Therefore, when even one solder ball is not adsorbed in the plurality of ball adsorption holes, a vacuum leak in that portion causes
When the solder balls are not adsorbed in all the ball adsorption holes and the solder balls are conveyed and supplied, the solder balls are adsorbed and held in all the ball adsorption holes and are conveyed and supplied. It is possible to prevent defective solder balls from being generated due to the missing parts of the solder balls, and it is possible to dramatically improve the reliability of the solder ball transfer and supply work. It will be possible.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a main part configuration showing an embodiment of a solder ball feeding / supplying device according to the present invention.

FIG. 2 is a detailed explanatory view of a transport head that constitutes the apparatus of FIG.

FIG. 3 is an explanatory diagram of a pad formation mode on the surface of a semiconductor device formed by using the device of the present embodiment.

FIG. 4 is an explanatory diagram of a semiconductor device array plate proposed by the applicant.

5 is an operation explanatory diagram when the semiconductor device is attached to and detached from each semiconductor device accommodation hole of the semiconductor device array plate shown in FIG. 4;

FIG. 6 is an explanatory diagram of an example of supplying solder balls to a cream solder application region of a semiconductor device using a ball mask.

FIG. 7 is an explanatory diagram of a printing operation of cream solder.

FIG. 8 is a configuration explanatory diagram of a semiconductor device previously proposed by the applicant.

FIG. 9 is an explanatory diagram of a generally known semiconductor device.

FIG. 10 is an explanatory diagram showing a state in which unnecessary solder balls are sandwiched between suction solder balls.

FIG. 11 is an explanatory diagram of a pinching prevention unit that prevents erroneous conveyance of unnecessary solder balls.

[Explanation of symbols]

 1 Semiconductor device 20 Solder ball 22 Transfer head 23 Transfer control device 25 Vacuum drive chamber 27 Ball suction hole

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Taro Matsuoka 2-6-1, Marunouchi, Chiyoda-ku, Tokyo Furukawa Electric Co., Ltd. (72) Inventor Tsuneaki Komazawa 2-6-1, Marunouchi, Chiyoda-ku, Tokyo Furukawa Electric Co., Ltd. (72) Inventor Yoshinari Umeya 1-1 Kokubun Factory, Kokubun, Kokubun City, Kagoshima Prefecture (72) Inventor Takeshi Torikoshi 1-1, Yamashita Town, Kokubun City, Kagoshima Prefecture Kokubun Factory, Kyocera Co., Ltd. (72) Inventor Shingo Sato 1-1 Yamashita Town, Kokubun City, Kagoshima Prefecture Kyocera Co., Ltd. Kokubun Plant

Claims (2)

[Claims] 1. A solder ball transport / supply device for collectively transporting and supplying solder balls to a plurality of cream solder application regions formed by printing on a surface thereof, wherein a solder head is held and transported on the surface of a transport head. Is formed with a ball holding surface, and a plurality of ball suction holes corresponding to the positions of the cream solder printing areas are formed on the ball holding surface. Each of these ball suction holes is vacuum driven formed inside the transfer head. The solder balls are connected to the chamber, and the solder balls are sucked and held in the ball suction holes by vacuum suction on the side of the vacuum drive chamber, and the solder balls sucked and held in the suction holes are released by stopping the vacuum suction. apparatus. 2. The solder ball transport according to claim 1, wherein the ball holding surface is provided with pinching prevention means for preventing an unnecessary solder ball from being pinched between the solder balls sucked in the ball suction holes. Supply device.