KR920001431Y1 - Semiconductor detector selector - Google Patents
Semiconductor detector selector Download PDFInfo
- Publication number
- KR920001431Y1 KR920001431Y1 KR2019890019288U KR890019288U KR920001431Y1 KR 920001431 Y1 KR920001431 Y1 KR 920001431Y1 KR 2019890019288 U KR2019890019288 U KR 2019890019288U KR 890019288 U KR890019288 U KR 890019288U KR 920001431 Y1 KR920001431 Y1 KR 920001431Y1
- Authority
- KR
- South Korea
- Prior art keywords
- sleeve
- rod
- vacuum tube
- semiconductor detector
- inspection
- Prior art date
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
Abstract
내용 없음.No content.
Description
제1도는 본고안의 요부사시도.Figure 1 is a Yobusa city view in this paper.
제2도는 본고안 장치의 작동상태 종단면도로서, (a)는 최초의 상태로 슬리브가 하강된 상태도, (b)는 슬리브에 소자가 흡착되어 슬리브가 상승된 상태도.2 is a longitudinal cross-sectional view of the operating state of the present device, (a) is a state in which the sleeve is lowered to the initial state, (b) is a state in which the sleeve is raised by the element is adsorbed to the sleeve.
제3도는 종래장치의 일부를 단면으로 도시한 정면도.3 is a front view showing a part of the conventional apparatus in cross section.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 로드 2 : 진공튜브1: rod 2: vacuum tube
3 : 슬리브 3a : 장공3: sleeve 3a: long hole
3b : 흡입공 4 : 맞춤핀3b: suction hole 4: dowel pin
5 : 소자5 element
본고안은 IC등의 반도체 소자(이하 “소자”라 약칭함)중 QEP(QUAD FLAT PACK)나 PLCC(PLASTIC LEADED CHIP CARRIER)의 소자를 하나 또는 다수개씩 검사장치의 블럭에 정확히 위치 결정을 시킬수 있도록 한 반도체 선별, 검사기의 소자 흡착 이송장치에 관한 것이다.In this study, one or more devices of QEP (QUAD FLAT PACK) or PLCC (PLASTIC LEADED CHIP CARRIER) among semiconductor devices (hereinafter referred to as "devices") such as ICs can be accurately positioned on the block of the inspection device. The present invention relates to a device for adsorption and transport of a semiconductor screening and inspection device.
종래에는 소자를 자동으로 검사, 선별하기 위해 소자를 검사장치의 하방으로 이송시키기 위한 장치, 예를들어 제3도에 도시한 바와같은 장치는 승강 가능한 로드(11)의 하방에 연질의 흡착고무(12)가 스프링(13)으로 탄력 설치되어 있어 이송장치가 소자(14)가 정렬된 케이스(도시는 생략함)의 하방으로 이송되면 로드(11)가 하강하여 압축공기에 의해 소자(14)를 흡착고무(12)에 흡착시키게 되는데, 이때 소자(14)는 케이스에 형성된 요입홈과 일정간격의 여유(공차)를 갖고 있어 흡착시에 변형을 하게 되어 소자(14)의 흡착 위치에 변형이 발생하게 된다.Conventionally, an apparatus for transferring an element under the inspection apparatus for automatically inspecting and sorting the element, for example, an apparatus as shown in FIG. 3, has a soft adsorption rubber (below the elevating rod 11). 12 is elastically installed by the spring 13 so that when the conveying device is transported under the case (not shown) in which the element 14 is aligned, the rod 11 is lowered and the element 14 is moved by compressed air. The adsorption rubber 12 is adsorbed, but the element 14 has a recess (groove) formed in the case and a clearance (tolerance) of a predetermined interval, so that the element is deformed at the time of adsorption so that deformation occurs at the adsorption position of the element 14. Done.
이에따라 소자(14)를 검사장치의 블럭(도시는 생략함)에 위치결정을 할 경우, 소자(14)의 위치결정을 정확히 할수 없게 됨은 물론 소자(14)가 흡착된 흡착고무(12)가 이송장치에에 의해 검사장치의 하방으로 이송되어 소자(14)를 블럭에 자유 낙하시키게 되므로 소자(14)의 위치결정이 정확히 이루어지지 않을 경우, 소자(14)의 핀이 검사장치의 누름편(도시는 생략함)에 의해 변형되어 불량품이 발생하게 되는 결점이 있었다.Accordingly, when the element 14 is positioned on a block (not shown) of the inspection apparatus, the positioning of the element 14 may not be accurately performed, and the adsorption rubber 12 on which the element 14 is adsorbed may be transferred. Since the device 14 is moved downward by the device to freely drop the element 14 into the block, if the positioning of the element 14 is not carried out correctly, the pin of the element 14 is pushed by the pressing device (not shown). (Omitted to omit), thereby deforming the defective product.
본고안은 종래의 이와같은 결점을 감안하여 안출한 것으로 진공 튜브의 외측으로 슬리브를 승강 가능하게 스프링으로 탄력 설치하여 검사장치의 블럭에 소자를 정확히 위치결정시킬 수 있도록 한것인바, 이를 첨부된 도면 제1도 내지 제2도에 의해 더욱 상세히 설명하면 다음과 같다.The present proposal was made in view of the above-mentioned drawbacks of the related art, and the spring is elastically installed to enable the sleeve to be lifted to the outside of the vacuum tube so that the device can be accurately positioned on the block of the inspection device. More specifically described with reference to FIGS. 1 to 2 are as follows.
흡착장치의 로드(1)가 승강함에 따라 압축공기에 의해 소자(5)를 흡착하는 것에 있어서, 로드(1)에 진공튜브(2)를 나사끼우기로 고정하고 진공튜브(2)의 외측에는 장공(3a)과 흡입공(3b)을 가진 합성수지제의 슬리브(3)를 맞춤핀(4)으로 승강 가능하게 결합하여서 된것으로, 도면중 미설명 부호 6은 슬리브(3)를 복원시키기 위한 스프링, 7은 이송장치를 고정시키기 위한 베이스이다.In adsorbing the element 5 by compressed air as the rod 1 of the adsorption device moves up and down, the vacuum tube 2 is fixed to the rod 1 by screwing and a long hole is provided outside the vacuum tube 2. (3a) and the sleeve (3) made of synthetic resin having a suction hole (3b) is to be combined by lifting and lowering with the dowel pin (4), reference numeral 6 in the figure is a spring for restoring the sleeve (3), 7 is a base for fixing the transfer device.
이와같이 구성된 본고안의 작용효과를 설명하면 다음과 같다.The operational effects of the proposed paper thus constructed are as follows.
먼저 이송장치에 의해 소자(5)가 정렬된 케이스의 하방으로 흡착장치가 이송되어 로드(1)가 하강, 슬리브(3)가 소자(5)와 접속하면 압축공기에 의해 소자(5)가 제2a도와 같이 슬리브(3)의 하방에 흡착된다.First, the adsorption device is transferred to the lower side of the case in which the elements 5 are aligned by the transfer device so that the rod 1 is lowered and the sleeve 3 is connected to the element 5. It is adsorb | sucked under the sleeve 3 like FIG. 2a.
슬리브(3)의 하방에 소자(5)가 흡착되면 진공튜브(2)의 내부에 진공압이 발생하게 되므로 진공튜브(2)에 맞춤핀(4)으로 결합된 슬리브(3)는 장공(3a)에 의해 스프링(6)을 압축하면서 제2b도와 같이 상승하게 된다.When the element 5 is adsorbed under the sleeve 3, a vacuum pressure is generated inside the vacuum tube 2, so that the sleeve 3 coupled to the vacuum tube 2 with the dowel pin 4 is provided with a long hole 3a. ), The spring 6 is raised as shown in FIG.
이와같이 소자(5)가 흡착된 슬리브 (3)에 츱착되었으므로 소자(5)가 블럭에 정확히 위치결정을 할수 없게 되는 경우가 발생하게 되는데, 이때에는 슬리브(3)가 상승한 상태로 이송장치에 의해 검사장치의 하방으로 이송하면 로드(1)가 하강하여 소자(5)를 검사장치의 블럭(도시는 생략함)에 위치결정을 시키게 되는데, 이때에는 전술한 바와같은 역순으로 압축공기의 흡입이 중단되고, 따라서 압축공기의 흡입력에 의해 슬리브(3)의 하방에 흡착된 소자(5)가 검사장치의 블럭에 낙하된다.Since the element 5 is attached to the sleeve 3 to which the element 5 is adsorbed as described above, there is a case that the element 5 cannot be accurately positioned in the block. In this case, the sleeve 3 is raised to be inspected by the transfer device. Transferring downward of the device causes the rod 1 to descend to position the element 5 in the block of the inspection device (not shown), in which case suction of compressed air is stopped in the reverse order as described above. Therefore, the element 5 sucked under the sleeve 3 by the suction force of the compressed air falls to the block of the inspection apparatus.
그러나 이때 케이스의 요입홈에 소자(5)가 일정간격의 여유를 갖고 정렬된 상태에서 슬리브(3)가 스프링(6)의 복원력에 의해 맞춤핀(4)을 따라 하강하여 슬리브(3)의 저면이 소자(5)와 접속되면서 소지(5)의 위치결정을 조절시키게 되므로 소자(5)의 검사시에 누름편(도시는 생략함)에 의해 소자(5)의 핀이 변형되는 것을 미연에 방지시킬 수 있게 되는 효과가 있다.However, at this time, the sleeve 3 is lowered along the dowel pin 4 by the restoring force of the spring 6 in a state in which the element 5 is aligned with the recess groove of the case at a predetermined interval. Since the positioning of the base 5 is controlled while being connected to the device 5, the pin of the device 5 is prevented from being deformed by the pressing piece (not shown) during the inspection of the device 5. It has the effect of being able to.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019890019288U KR920001431Y1 (en) | 1989-12-19 | 1989-12-19 | Semiconductor detector selector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019890019288U KR920001431Y1 (en) | 1989-12-19 | 1989-12-19 | Semiconductor detector selector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR910012305U KR910012305U (en) | 1991-07-30 |
| KR920001431Y1 true KR920001431Y1 (en) | 1992-02-24 |
Family
ID=19293446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019890019288U KR920001431Y1 (en) | 1989-12-19 | 1989-12-19 | Semiconductor detector selector |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR920001431Y1 (en) |
-
1989
- 1989-12-19 KR KR2019890019288U patent/KR920001431Y1/en not_active IP Right Cessation
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| Publication number | Publication date |
|---|---|
| KR910012305U (en) | 1991-07-30 |
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