JP4100670B2 - Circuit board support device - Google Patents

Circuit board support device Download PDF

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JP4100670B2
JP4100670B2 JP2002262997A JP2002262997A JP4100670B2 JP 4100670 B2 JP4100670 B2 JP 4100670B2 JP 2002262997 A JP2002262997 A JP 2002262997A JP 2002262997 A JP2002262997 A JP 2002262997A JP 4100670 B2 JP4100670 B2 JP 4100670B2
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support
circuit board
state
printed circuit
restraint
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JP2004098448A (en
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信介 須原
誠吾 児玉
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Fuji Corp
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Fuji Machine Manufacturing Co Ltd
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Description

【０００１】
【発明の属する技術分野】
本発明は、回路基板を裏面側から支持する装置に関するものであり、特に、既に電子回路部品が装着されるなどして裏面に凹凸を有する回路基板の支持に関するものである。
【０００２】
【従来の技術】
回路基板支持装置には、複数の支持部材が支持台により長手方向に移動可能に保持され、回路基板の裏面の凹凸にならって回路基板を裏面側から支持する装置がある。この支持装置においては、例えば、支持部材の一種である複数の支持ピンが支持台に長手方向に移動可能に嵌合されるとともに、スプリングにより支持台から突出する向きに付勢されている。スプリングの付勢による支持ピンの移動限度は、支持ピンに設けられたストッパが支持台に設けられた下向きの面に当接することにより規制され、複数の支持ピンの各上端に形成された支持面が水平な一平面内に位置する状態に保たれ、各支持ピンに支持台に向かって押し戻す向きの力が加えられた場合には、スプリングの圧縮により、支持ピンの支持台側への後退が許容される。これら複数の支持ピンの支持台に対する長手方向の移動は、移動阻止装置により阻止される。移動阻止装置は、クランププレートおよびクランププレート移動装置を備えている。クランププレートは、その板面が、支持ピンの長手方向と直交する平面内において移動可能に配設され、厚さ方向に貫通して複数の大径穴が形成されるとともに、各大径穴内にそれぞれ高摩擦係数の環状ゴムが配設されている。環状ゴムの内径は支持ピンの外径より大きくされており、複数の支持ピンはそれぞれ、環状ゴム内に半径方向に隙間を有して嵌合されている。
【０００３】
複数の支持ピンは、その長手方向の移動が許容され、各々の支持面が水平な一平面内に位置する状態で回路基板に裏面側から接近させられる。回路基板の裏面に電子回路部品が既に装着されていれば、複数の支持ピンのうち、回路基板の裏面の電子回路部品に対応する支持ピンが電子回路部品に当接し、回路基板を支持して上昇させられ、基板押さえ板に当接させる。その状態から更に支持台が回路基板に接近させられるのであるが、その際、電子回路部品に当接した支持ピンは、スプリングの付勢力に抗して支持台内に後退させられ、回路基板の電子回路部品が装着されていない部分に対応する支持ピンが回路基板の裏面に当接することを許容する。このように電子回路部品に対応する支持ピンがスプリングの付勢力に抗して支持台内に後退することにより、複数の支持ピンが回路基板の裏面に、その凹凸にならって下方から接触する状態となる。この状態でクランププレートが移動させられて支持ピンの移動が阻止される。クランププレートの移動により環状ゴムを介して支持ピンが押されて、支持台の支持ピンが嵌合された貫通穴の内周面に押し付けられ、その内周面との間に生ずる摩擦力および環状ゴムとの間に生ずる摩擦力によって支持ピンの移動が阻止されて、プリント配線板を強固に支持するようにされるのである。このように支持台に対して長手方向に移動可能な支持ピンを用いれば、回路基板の種類が変わり、裏面の凹凸の状態が変わっても、それに合わせて支持ピンを付け替えることなく、プリント配線板を支持させることができ、段取替えに要する時間が短縮される。また、環状ゴムを用いれば、その弾性変形により、支持ピンや支持台の貫通穴，クランププレートの大径穴の寸法誤差等が吸収されるため、これらの加工精度を高める必要がなく、安価でしかも安定して支持ピンの移動を強固に阻止することができる（例えば、特許文献１参照）。
【０００４】
【特許文献１】
特許第２８８９０１２号公報
【０００５】
【発明が解決しようとする課題，課題解決手段および効果】
しかしながら、クランププレートによる支持ピンの移動の阻止が繰り返し行われ、環状ゴムが繰り返し支持ピンに接触，離間させられれば、環状ゴムが劣化しあるいは摩耗し、支持ピンの貫通穴の内周面への押付けが不足して移動が良好に阻止されなくなる。また、支持ピンの移動を阻止するために、複数の大径穴および環状ゴムを備えたクランププレートおよびクランププレート移動装置が必要であり、移動阻止装置の構造が複雑になる問題もあった。
【０００６】
本発明は、以上の事情を背景とし、複数の支持部材が支持台に対して長手方向に移動して回路基板を裏面側から支持する回路基板支持装置において、移動阻止装置の寿命を向上させるとともに、構造を簡易にすることを課題としてなされたものであり、本発明によって、下記各態様の回路基板支持装置が得られる。各態様は請求項と同様に、項に区分し、各項に番号を付し、必要に応じて他の項の番号を引用する形式で記載する。これは、あくまでも本発明の理解を容易にするためであり、本明細書に記載の技術的特徴およびそれらの組合わせが以下の各項に記載のものに限定されると解釈されるべきではない。また、一つの項に複数の事項が記載されている場合、それら複数の事項を常に一緒に採用しなければならないわけではない。一部の事項のみを選択して採用することも可能なのである。
【０００７】
なお、以下の各項において、(1)項，(2)項および(4)項を合わせたものが請求項１に相当し、その請求項１に(3)項の特徴を追加したものが請求項２に、(5)項の特徴を追加したものが請求項３に、それぞれ相当する。そして、請求項３に段落〔００５３〕に記載の事項を追加したものが請求項４であり、請求項１または２に(5)項の説明部分に記載の特徴を追加したものが請求項５である。
【０００８】
（１）支持台と、
その支持台から上方へ突出し、かつ、支持台により長手方向に移動可能に保持された複数の支持部材と、
それら支持部材を、各支持部材の上端に形成された支持面が予め定められた面内に位置する状態に保つとともに、各支持部材に前記支持台に向かって押し戻す向きの力が加えられた場合には支持部材の支持台側への後退を許容する保持装置と、
前記支持部材の各々の前記支持台に対する長手方向の相対移動を阻止する移動阻止装置と
を含み、回路基板を裏面側から支持する回路基板支持装置において、
前記移動阻止装置を、
前記支持台に、前記複数の支持部材の各々にそれぞれ接触可能に保持された複数の拘束体と、
それら拘束体が前記複数の支持部材の各々に強く接触し、各支持部材の前記長手方向の移動を拘束する拘束状態と、各支持部材に接触しないか弱い力で接触し、支持部材の前記長手方向の移動を許容する非拘束状態とを選択的に実現する拘束・非拘束状態実現装置と
を含むものとした回路基板支持装置。
回路基板には、例えば、絶縁基板に設けられたプリント配線の全部に電子回路部品が搭載されていないプリント配線板、プリント配線の一部に既に電子回路部品が搭載されたプリント配線板、両面の一方のプリント配線に電子回路部品が搭載されるとともに、半田付け接合が行われているプリント回路板等が該当する。電子回路部品は回路基板に装着されて電子回路を構成する。
支持部材は、回路基板を負圧により吸着しない非吸着型支持部材としてもよく、回路基板を負圧により吸着して保持する吸着型支持部材である保持部材としてもよい。
拘束体としては種々の形状のものが採用可能である。例えば、球形でもよく、正多面体でもよく、形状が一定しない不定形でもよい。また、横断面形状が円形である支持部材を取り囲むように、中空円筒体や中空テーパ筒体が軸方向に複数に分割された形状の拘束体が配設されてもよい。複数の拘束体は、全部が形状，寸法が同じでもよく、少なくとも一部について、形状，寸法の少なくとも一方が２種類以上に異なっていてもよい。
「移動阻止」は、支持部材に普通に作用する力、例えば、装着装置による回路基板への電子回路部品の装着時や、高粘性流体塗布装置によるクリーム状半田，接着剤等の高粘性流体の回路基板への塗布時に回路基板を介して支持部材に加えられる力や、保持装置が支持部材に加える力であって、支持部材を支持台から押し出す向きに作用する力によっては支持部材が長手方向に移動しないようにすることを意味し、支持部材の移動を絶対的に阻止するという意味ではない。
「予め定められた面」とは、一平面、２段以上の段付面あるいは曲面等である。回路基板の被支持面たる裏面が段付面や曲面である場合には、支持部材が位置する面を、それら段付面の高さの差に等しい差を有する２段以上の平面や、回路基板の曲面に対応する曲面にすれば、支持部材の支持台内への後退量が、裏面の高さの差に関係なく、電子回路部品の突出量等によって決まるようにすることができるのである。ただし、支持部材が位置する面を回路基板の裏面と同じ形状の面とすることは不可欠ではない。
【０００９】
回路基板支持装置が回路基板を支持する際には、回路基板と複数の支持部材とが互いに接近させられる。この際、拘束・非拘束状態実現装置は、非拘束状態を実現し、支持部材は支持台に対して長手方向に移動可能とされる。そのため、回路基板の裏面に、例えば、既に電子回路部品が装着されていて凹凸があれば、複数の支持部材のうち電子回路部品に対応するものが電子回路部品に当接し、その状態から更に支持部材と回路基板とが互いに接近させられるとき、電子回路部品に対応する支持部材に、支持台に向かって押し戻す向きの力が加えられる。その結果、その支持部材が支持台側へ後退し、電子回路部品に対応しない支持部材が回路基板の裏面に接触することを許容する。そして、複数の支持部材が回路基板の裏面の凹凸にならって接触した状態において拘束・非拘束状態実現装置が拘束状態を実現し、それにより支持部材の長手方向の移動が阻止され、支持部材が回路基板を裏面側から強固に支持する状態となり、回路基板への電子回路部品の装着等の作業時等に回路基板が撓むことがなく、作業が良好に行われる。
このように本項の回路基板支持装置によれば、ゴムを用いることなく、支持部材の移動を阻止することができ、移動阻止装置の寿命の長い回路基板支持装置が得られる。また、複数の拘束体の支持部材への接触強度を変えることにより、支持部材の移動を阻止し、あるいは移動を許容することができ、移動阻止装置の構成が簡易な回路基板支持装置が得られる。
【００１０】
（２）前記支持台が内部に拘束体収容室を備え、前記複数の支持部材の各々がその拘束体収容室を貫通する状態で支持台に嵌合され、かつ、前記複数の拘束体が、前記拘束体収容室内に、前記支持部材に接触するとともに互いにも接触する状態で収容され、前記拘束状態では、互いに相対移動不能に拘束し合うとともに前記支持部材の長手方向の移動も拘束する (1)項に記載の回路基板支持装置。
拘束・非拘束状態実現装置が拘束状態を実現すれば、複数の拘束体は、互いに拘束し合うとともに、支持部材に強く接触してその長手方向の移動を阻止する。
【００１１】
（３）前記複数の拘束体の各々が球形である (2)項に記載の回路基板支持装置。
（４）前記球形の拘束体が前記拘束体収容室に、２層以上に重なり合った状態で収容された (3)項に記載の回路基板支持装置。
本項の回路基板支持装置によれば、複数の拘束体が、支持部材の長手方向において並び、重なった状態で支持部材に接触することとなり、支持部材の拘束体との接触面積が大きく、その移動をより確実に阻止することができる。
（５）前記複数の拘束体が磁性材料により形成されるとともに、前記拘束・非拘束状態実現装置が前記拘束体を磁化する磁化装置を含む (2)項ないし (4)項のいずれかに記載の回路基板支持装置。
拘束体が磁化されれば、複数の拘束体が磁力によって互いに接触し、相対移動不能に拘束し合うとともに、支持部材に強く接触してその移動を阻止する。
支持部材は、少なくとも支持面近傍部が非磁性材料により作られ、磁力が直接電子回路部品に作用しないようにすることが望ましい。
拘束・非拘束状態実現装置は、拘束体を支持部材に押し付ける押付力を生じさせる装置であればよく、磁化装置の他、例えば、可撓性材料から成り、前記複数の拘束体を内包する気密な袋状体と、その袋状体の内部を負圧状態と負圧解除状態（大気圧状態または正圧状態）とに変更する圧力変更装置とを含むものとすることができる。
【００１２】
（６）前記支持部材の少なくとも前記支持面近傍部が静電防止材型柔軟物質製とされている (1)項ないし (5)項のいずれかに記載の回路基板支持装置。
本項によれば、支持部材が回路基板の裏面に装着された電子回路部品に当接する際、柔らかく、衝撃少なく当接し、電子回路部品を損傷したりする恐れがない。また、例えば、回路基板の裏面にクリーム状半田によって仮止めされた電子回路部品が静電気によって支持部材にくっついて回路基板から離れ、脱落することが回避される。また、静電気によって支持面に埃等が付着し、支持面が汚れることが防止される。さらに、支持部材の少なくとも支持面近傍部が帯電し、回路基板の裏面に装着された電子回路部品内の回路や、回路基板に設けられた回路や集積回路等に内部破損が生ずることが防止される。回路基板の表面に電子回路部品が装着される場合、その電子回路部品内の回路の内部破損も防止される。また、回路基板の表面に電子回路部品が装着される際に回路基板の振動が防止され、表面に既に搭載されている電子回路部品のずれが防止される。さらに、電子回路部品が回路基板に当接させられる際の衝撃が緩和され、装着される電子回路部品および回路基板の裏面に装着されて支持部材が当接している電子回路部品の割れが防止される。支持部材の少なくとも支持面近傍部がクッションおよび制振部材としても機能するのである。
【００１３】
（７）前記支持部材の前記支持面を前記回路基板の裏面に接触させる際に、回路基板を表面側から押さえる基板押さえ部材を含む (1)項ないし (6)項のいずれかに記載の回路基板支持装置。
基板押さえ部材は、回路基板の表面の大半に接触する平板状の部材でもよく、回路基板の一部を連続して押さえる枠状の部材でもよく、回路基板の複数箇所をそれぞれスポット状に押さえる部材でもよい。
基板押さえ部材により回路基板を押さえれば、例えば、回路基板が可撓性に富んだものであっても、支持部材が回路基板にその裏面側から接触して支持する際に回路基板が上方へ反ることが防止され、あるいは回路基板にもともと上方あるいは下方への反りがある場合にも、平らに矯正される。
【００１４】
【発明の実施の形態】
以下、本発明を回路基板の配線パターンにクリーム状半田（以下、半田と略称する）を塗布するスクリーン印刷機における回路基板の支持に適用した場合の一実施形態を図面に基づいて詳細に説明する。なお、スクリーン印刷機自体は、回路基板支持装置を除いて特公平２−１３４７５号公報等において既に知られたものであり、簡単に説明する。
【００１５】
本実施形態のスクリーン印刷機は、図１に概略的に示すように、本体たるベッド１０上に設けられた基板搬送装置としての基板コンベヤ１２（図２参照），基板支持装置１６，スクリーン位置決め支持装置（図示省略），スキージ装置１８を備えている。
【００１６】
基板コンベヤ１２は、図２に示すように、一対のレール２６（図２には一方のレールのみ図示されている）を備えている。これらレール２６の互いに対向する面にはそれぞれベルトコンベヤ２８が設けられ、回路基板としてのプリント回路板３０（図１，図３参照）を搬送するようにされている。ベルトコンベヤ２８は、巻掛部材たる無端のベルト３２およびベルト３２を周回させる巻掛部材駆動装置たるベルト駆動装置３４を備えており、プリント回路板３０はベルト３２上に載置され、裏面３６側からベルト３２により支持されて、ベルト３２の移動により搬送される。一対のレール２６の互いに対向する面にはそれぞれ、垂直な案内面がレール２６の長手方向に平行に設けられており、それら１対の案内面がプリント回路板３０の幅方向の両側から、プリント回路板３０の両側面の各々を案内し、プリント回路板３０をレール２６の長手方向に案内する。
【００１７】
スクリーン位置決め支持装置は、スクリーン４０（図１参照）を位置決めし、固定装置（図示省略）によりスクリーン支持台４２に固定する。スキージ装置１８は、図１に示すように、２個のスキージ４４，４６を備えており、これらスキージ４４，４６が昇降装置４８，５０によって択一的に下降させられ、スクリーン４０に接触させられた状態でスキージ移動装置５２によって移動させられることにより、プリント回路板３０の配線パターンにクリーム状半田が塗布される。本実施形態では、クリーム状半田の塗布時にスキージ４４，４６は、プリント回路板３０の搬送方向と平行な方向に移動させられる。
【００１８】
基板支持装置１６を説明する。
基板支持装置１６は、本実施形態においては、図２に示すように、基板昇降装置６０および支持ピン装置６２を備えている。基板昇降装置６０は、基板リフタ６８を有している。基板リフタ６８の下面からは一対のガイドロッド７０が延び出させられ、基台７２に固定の案内筒７４に昇降可能に嵌合されている。基板リフタ６８の下面にはまた、ねじ軸７６が固定され、基台７２に垂直軸線まわりに回転可能かつ軸方向に移動不能に取り付けられたナット７８に螺合されており、ナット７８が駆動源たる駆動モータ（図示省略）によって回転させられることによりねじ軸７６が上下方向に移動し、基板リフタ６８が昇降させられる。
【００１９】
支持ピン装置６２は、図２に示すように、基板リフタ６８上に設けられており、基板リフタ６８の昇降により昇降させられる。支持ピン装置６２は、図３に示すように、支持部材としての複数の支持ピン９０および支持台９２を備えている。支持台９２は、本実施形態においては、製造の都合上、複数の部材が互いに組み付けられ、固定されてなり、組付け後は一体の支持台９２として機能する。本実施形態において支持台９２は、ベース９６，正圧供給路形成部材９８，負圧供給路形成部材１００，スペーサ１０２および収容部材１０４を含み、基板リフタ６８に位置決めされて着脱可能に固定されている。これらベース９６等は板状を成し、互いに重ねられ、組み付けられた状態では、ベース９６を厚さ方向に貫通して形成された複数のシリンダボア１１０と、負圧供給路形成部材１００を厚さ方向に貫通して形成された複数の貫通穴１１２と、収容部材１０４に厚さ方向に形成された複数ずつの嵌合穴１１４，１１５とが互いに同心となる。
【００２０】
スペーサ１０２は、負圧供給路形成部材１００と収容部材１０４との間に挟まれている。スペーサ１０２には、貫通穴１１２に対応する部分に開口１１６が形成されており、その開口１１６が負圧供給路形成部材１００と収容部材１０４とに塞がれて負圧供給路１１８が形成されている。負圧供給路１１８は、負圧供給路形成部材１００等内に形成された通路（図示省略）および継手装置１２０等を介して図示しない負圧源に接続されている。
【００２１】
正圧供給路形成部材９８には凹部１２２が設けられており、この凹部１２２の開口がベース９６によって塞がれることにより、正圧供給路１２４が形成されており、ベース９６に設けられた複数のシリンダボア１１０は、正圧供給路１２４に開口させられている。正圧供給路１２４は、正圧供給路形成部材９８等内に形成された通路（図示省略）および継手装置１２６等を介して図示しない正圧源に接続されている。前記継手装置１２０，１２６と負圧源，正圧源との間にはそれぞれ、電磁制御弁たる電磁方向切換弁（図示省略）が設けられ、負圧供給路１１８，正圧供給路１２４への負圧，正圧の供給をそれぞれ許容，遮断するようにされている。
【００２２】
上記収容部材１０４の内部には、拘束体収容室としての球収容室１２８が形成され、前記複数ずつの嵌合穴１１４，１１５はそれぞれ、収容部材１０４の上面，下面に開口させられるとともに、球収容室１２８に開口させられている。前記複数の支持ピン９０の各々は、球収容室１２８を貫通する状態で嵌合穴１１４，１１５および貫通穴１１２に長手方向に移動可能に嵌合され、その上端部は支持台９２から上方へ突出し、かつ、支持台９２により長手方向に移動可能に保持されている。
【００２３】
支持ピン９０は、本実施形態においては中空ピンであり、全体が非磁性材料の一種であるアルミニウムにより形成されている。支持ピン９０の後端部ないし下端部には、支持ピン９０より大径のピストン１３０が同心に設けられるとともに、前記シリンダボア１１０に気密にかつ軸方向に移動可能に嵌合されている。それによりシリンダボア１１０内には、負圧供給路形成部材１００側に大気圧室１３２が形成され、正圧供給路形成部材９８側に正圧室１３４が形成されている。大気圧室１３２は通路１３６によって大気に解放され、正圧室１３４は前記正圧供給路１２４に連通させられている。ピストン１３０も、本実施形態では、非磁性材料の一種であるアルミニウムにより形成されている。
【００２４】
なお、負圧供給路形成部材１００に形成された貫通穴１１２は寸法精度良く形成され、支持ピン９０が精度良く嵌合されて、支持ピン９０と負圧供給路形成部材１００との間からの負圧の漏れが防止されるようにされている。
【００２５】
支持ピン９０の先端ないし上端には、支持ピン９０の中心線に直角で一平面状を成す支持面１４０が形成されている。前記正圧室１３４に圧縮エアが供給された状態では、支持ピン９０が上方へ移動する向きに付勢されるが、この付勢による支持ピン９０の移動限度は、ピストン１３０が負圧供給路形成部材１００の下面に当接することにより規定され、複数の支持ピン９０が上昇端位置に位置させられるとともに、各支持面１４０が予め定められた面であって、水平な一平面内に位置する状態に保たれる。支持ピン９０に支持台９２に向かって押し戻す向きの力が加えられた場合には、ピストン１３０は正圧室１３４内のエアを圧縮して支持ピン９０の支持台９２側への後退を許容する。本実施形態においては、ピストン１３０がストッパを構成し、付勢手段を構成する正圧室１３４と共に保持装置１３８を構成している。
【００２６】
支持ピン９０の先端部には、吸着部材１４２が取り付けられている。吸着部材１４２はリング状を成し、ゴムまたはその類似物により作られている。吸着部材１４２は、本実施形態においては、例えば、静電防止対策が講じられたブチルゴムにより作られており、支持ピン９０の支持面１４０の近傍部が静電防止型柔軟物質製とされている。支持ピン９０の先端部にはまた、その側壁を半径方向に貫通する複数の通路１４４が形成されている。この通路１４４は、ピストン１３０が負圧供給路形成部材１００の下面に当接する上昇端位置と、その上昇端位置より僅かに下方の位置との間に位置するとき、収容部材１０４と負圧供給路形成部材１００との間に形成された前記負圧供給路１１８に連通する状態となる位置に形成されている。通路１４４が負圧供給路１１８に連通する状態では、支持ピン９０内に負圧が供給され、支持ピン９０が吸着部材１４２において負圧によりプリント回路板３０を吸着する。本実施形態においては、支持ピン９０は吸着型支持部材であって、保持部材たる保持ピンなのである。
【００２７】
上記収容部材１０４は、本実施形態においては、磁性材料の一種である鋼により形成されており、その内部に形成された前記球収容室１２８内には、拘束体としての複数の球１５２が収容されている。拘束体は本実施形態においては球形を成すのであり、球１５２は、本実施形態においては、磁性材料の一種である鉄により形成されている。球１５２は鋼製としてもよい。これら球１５２は、球収容室１５２内に、支持ピン９２に接触するとともに互いにも接触する状態であって、２層以上に重なり合った状態で収容されている。
【００２８】
収容部材１０４は、一体の部材の内部に球収容室１２８および球収容室１２８を外部に開口させる入口（図示省略）を設け、支持ピン９０を支持台９２に嵌合した状態で、入口から球１５２を球収容室１２８に収容させ、収容後、入口を塞いでもよく、あるいは収容部材１０４を複数の部材が組み付けられて成るものとし、凹部が形成された部材と、凹部の開口を塞ぐ閉塞部材とを含み、凹部の開口を塞ぐことにより球収容室１２８が形成されるようにしてもよい。この場合、凹部を有する部材の底壁に支持ピン９０を長手方向に移動可能に嵌合し、凹部に球１５２を収容した後、閉塞部材により凹部の開口を塞ぐ。閉塞部材には、複数の支持ピン９０がそれぞれ長手方向に移動可能に嵌合される複数の貫通穴を設ける。なお、収容部材１０４の支持ピン９０が嵌合される一方の嵌合穴１１４は寸法精度良く形成され、他方の嵌合穴１１５は支持ピン９０が半径方向に僅かに隙間を有して嵌合される大きさとされており、支持ピン９０の長手方向の移動は、前記負圧供給路形成部材１００と、収容部材１０４の嵌合穴１１４が設けられた部分とによって案内される。
【００２９】
前記スペーサ１０２および負圧供給路形成部材１００は、磁性材料の一種である鋼により形成され、負圧供給路形成部材１００内には電磁石１５４が複数埋設されている。また、前記ベース９６および正圧供給路形成部材９８は、非磁性材料の一種であるアルミニウムにより形成されている。したがって、電磁石１５４への通電により、負圧供給路形成部材１００，スペーサ１０２および収容部材１０４が磁化されるとともに球１５２が磁化され、複数の球１５２が磁力により互いに強く引き付け合い、互いに相対移動不能に拘束し合うとともに、支持ピン９０に強く接触してその長手方向の移動を拘束する。拘束状態が実現されるのであるのであり、支持ピン９０の支持台９２に対する長手方向の移動が阻止される。また、電磁石１５４への通電が断たれれば、磁力が消滅し、複数の球１５２は支持ピン９０にも互いにも接触はするが力は弱く、支持ピン９０の長手方向の移動を許容する非拘束状態が実現される。本実施形態においては、磁性材料製の負圧供給路形成部材１００，スペーサ１０２，収容部材１０４および電磁石１５４等が磁化装置１５６を構成し、球１５２と共に移動阻止装置１５８を構成している。
【００３０】
上記のように構成された支持ピン装置６２の上方には、図３に示すように基板押さえ板１６０が設けられ、プリント回路板３０を表面１６２側から押さえるようにされている。基板押さえ板１６０は、板面が水平にかつ、本実施形態においては、基板コンベヤ１２によるプリント回路板３０の搬送方向と平行な方向に移動可能に設けられ、図示を省略する移動装置により基板搬送方向に平行な方向に移動させられ、基板支持装置１６の真上に位置する押さえ位置と、基板支持装置１６上から退避した退避位置とに移動させられる。
【００３１】
本スクリーン印刷機は、図１に示す制御装置２００により制御される。制御装置２００はコンピュータを主体とし、前記基板コンベヤ１２等を制御するとともに、電源（図示省略）から前記電磁石１５４への電流の供給，遮断等を制御する。
【００３２】
以上のように構成されたスクリーン印刷機により、図３に示すプリント回路板３０の表面１６２にクリーム状半田を塗布する場合を説明する。このプリント回路板３０の裏面３６には、既に電子回路部品Ｃが装着され、接着または半田付けにより固定されていて凹凸がある。スクリーン印刷時には、プリント回路板３０の種類に応じたスクリーン４０がスクリーン支持台４２に固定される。そして、プリント回路板３０は搬送コンベヤ１２により搬送され、図示を省略するストッパ装置により、予め定められた印刷位置であって、基板支持装置１６の上方で停止させられる。プリント回路板３０の搬入時には支持ピン装置６２は下降端位置にあり、基板押さえ板１６０は押さえ位置に位置し、プリント回路板３０は基板支持装置１６と基板押さえ板１６０との間に進入させられる。
【００３３】
プリント回路板３０の搬入後、基板リフタ６８が上昇させられ、支持ピン装置６２が上昇させられてプリント回路板３０を基板コンベヤ１２から持ち上げ、基板押さえ板１６０に押し付けた状態とするのであるが、このときレール２６に設けられた位置決めピン（図示省略）がプリント回路板３０の位置決め穴に嵌入し、プリント回路板３０を正確に位置決めする。
【００３４】
支持ピン装置６２の上昇時には、電磁石１５４への電流の供給は断たれ、移動阻止装置１５８においては非拘束状態が実現され、複数の支持ピン９０はいずれも長手方向の移動を許容されている。そして、支持台９２の正圧室１３４に圧縮エアが供給されており、ピストン１３０が負圧供給路形成部材１００の下面に当接して支持ピン９０は上昇端位置にあり、複数の支持ピン９０の各支持面１４０は水平な同一平面内に位置する。そのため、基板リフタ６８が上昇させられることにより、まず、多数の支持ピン９０のうち電子回路部品Ｃに対応する支持ピン９０が電子回路部品Ｃに当接し、ベルト３２から持ち上げて基板押さえ板１６０に押し付け、基板押さえ板１６０がプリント回路板３０を表面１６２側から押さえる。電子回路部品Ｃは裏面３６に固定されているため、支持ピン９０が当接しても電子回路部品Ｃがずれる恐れはない。また、支持ピン９０の先端部には吸着部材１４２が設けられているため、プリント回路板３０や電子回路部品Ｃに柔らかく接触する。
【００３５】
この状態から更に基板リフタ６８が上昇させられることにより、電子回路部品Ｃに当接した支持ピン９０には、支持台９２に向かって押し戻す向きの力が加えられ、支持ピン９０は、正圧室１３４の正圧に基づいて支持ピン９０を上方へ付勢する力に抗して支持台９２側へ後退するとともに、プリント回路板３０の裏面３６の電子回路部品Ｃがない部分に対応する支持ピン９０がプリント回路板３０に当接する。
【００３６】
このように支持ピン９０が上方への付勢力に抗して支持台９２側へ後退することにより、支持ピン９０はプリント回路板３０の凹凸に倣って下方から接触する状態となる。この際、正圧室１３４の正圧に基づいて、プリント回路板３０には上方に付勢する力が加えられるが、プリント回路板３０は基板押さえ板１６０に押し付けられているため上方へ反ることはなく、平らに保たれる。また、プリント回路板３０にもともと上方あるいは下方への反りがある場合にも、平らな基板押さえ板１６０への押付けにより平らに矯正される。正圧室１３４の圧力は、電子回路部品Ｃに接触した支持ピン９０が支持台９２側へ後退することを許容する大きさであって、支持ピン９０を、移動阻止装置１５８によって移動を阻止されるまで、電子回路部品Ｃあるいは裏面３６に接触した状態に保つのに足る大きさに設定されている。
【００３７】
支持ピン９０がプリント回路板３０に当接させられた後、支持ピン９０内に負圧が供給されてプリント回路板３０を吸着する。プリント回路板３０の電子回路部品Ｃがない部分を支持する支持ピン９０は、ピストン１３０が負圧供給路形成部材１００に当接する上昇端位置より僅かに下方にあって、通路１４４が負圧供給路１１８に連通する状態にあり、負圧が供給され、プリント回路板３０を供給するのに対し、電子回路部品Ｃに当接した支持ピン９０は支持台９２側への後退により通路１４４が負圧供給路１１８との連通を遮断された状態にあり、負圧が供給されない。したがって、電子回路部品Ｃに当接した支持ピン９０は、吸着部材１４２がプリント回路板３０に密着せず、電子回路部品Ｃの横断面積が吸着部材１４２の開口の横断面積より大きければ、吸着部材１４２の開口が電子回路部品Ｃによって塞がれることもあるが、吸着部材１４２は、その開口の少なくとも一部が電子回路部品Ｃから外れた状態で電子回路部品Ｃに当接することもあり、負圧が供給されれば漏れることとなるのであるが、この支持ピン９０には負圧が供給されないため、負圧の漏れがなく、プリント回路板３０に当接した支持ピン９０によるプリント回路板３０の吸着力が低下する恐れがない。
【００３８】
このように支持ピン９０に負圧が供給され、プリント回路板３０を吸着すれば、プリント回路板３０は基板押さえ板１６０に押し付けられた平らな状態で、支持ピン９０により下方から支持されるとともに、吸着によって下方へ引き付けられた状態となる。この状態で電磁石１５４に電流が供給されて拘束状態が実現される。それにより、球１５２が磁化されて互いに相対移動不能に拘束し合うとともに、支持ピン９０の球収容室１２８内に位置する部分に強く接触し、その長手方向の移動を阻止する。そのため、支持ピン９０は、プリント回路板３０の裏面３６の凹凸にならってプリント回路板３０を支持する状態に保たれ、プリント回路板３０は下から強固に支持されるとともに、負圧による吸着によって浮き上がりも防止された状態となる。
【００３９】
本実施形態においては、電子回路部品Ｃはプリント回路板３０の裏面３６に接着または半田付けによって固定されており、静電気により支持ピン９０に付着してプリント回路板３０から脱落することはなく、静電防止ゴム製の吸着部材１４２によって覆われた支持面１４０は、電子回路部品Ｃ等に柔らかく接触するとともに、静電気によって埃等が付着して汚れることが防止される。支持面１４０の帯電が防止され、電子回路部品Ｃ内の回路等が破損することも防止される。吸着部材１４２は、クッションでもあり、帯電防止部材でもある。
【００４０】
支持ピン９０の移動が阻止され、支持台９２に固定された後、正圧室１３４が大気に解放され、エアの供給が遮断される。その後、基板押さえ板１６０がプリント回路板３０上から退避させられる。この際、支持ピン装置６２は小距離下降させられて、プリント回路板３０が基板押さえ板１６０から離間させられる。基板押さえ板１６０の退避によってプリント回路板３０は支持ピン９０から浮き上がって上方へ反ることが可能となるが、吸着部材１４２によって支持ピン９０側へ引き付けられているため反ることはない。また、正圧室１３４へのエアの供給が遮断されるため、支持ピン９０が正圧に基づく付勢力によって動く恐れがなく、プリント回路板３０を押したりする恐れがない。
【００４１】
基板押さえ板１６０の退避後、基板リフタ６８が更に上昇させられてプリント回路板３０がスクリーン４０の下面に接触させられる。そして、スキージ４４あるいは４６の移動によりプリント回路板３０にクリーム状半田が印刷される。プリント回路板３０は基板支持装置１６によって下方から強固に支持されるとともに、吸着されて保持されており、プリント回路板３０が撓んだり、スクリーン４０に対してずれたりすることがなく、精度良く印刷が行われる。
【００４２】
印刷後、支持ピン装置６２が下降させられ、プリント回路板３０が下降させられる。この際、負圧供給路１１８への負圧の供給が断たれ、吸着部材１４２によるプリント回路板３０の吸着が解除され、支持ピン９０がプリント回路板３０から離間可能とされる。支持ピン装置６２は、プリント回路板３０が基板コンベヤ１２により下方から支持される状態となってから更に下降させられ、プリント回路板３０はベルト３２により下方から支持され、基板コンベヤ１２により搬出される。基板昇降装置６０は、支持部材と回路基板とを、回路基板の板面に対して直角な方向に相対移動ないし接近，離間させる相対移動装置ないし接近・離間装置の一種であり、支持部材昇降装置でもある。
【００４３】
プリント回路板３０の搬出後、次にクリーム状半田が塗布されるプリント回路板３０が搬入される。基板支持装置１６においては、支持ピン９０への負圧の供給は断たれるが、電磁石１５４への通電は続けられ、支持ピン９０の移動が阻止され、プリント回路板３０の裏面３６の凹凸にならった状態のままである。したがって、次のプリント回路板３０が種類が同じプリント回路板３０であれば、複数の支持ピン９０はそのままの状態でプリント回路板３０を支持することができる。プリント回路板３０は、一対のレール２６の各垂直な案内面により両側面の各々を案内され、ストッパ装置によって予め定められた印刷位置において停止させられるとともに、基板支持装置１６によって支持される際には位置決めピンにより位置決めされるため、同種のプリント回路板３０と基板支持装置１６との間には、同じ相対位置が得られ、支持ピン９０は前のプリント回路板３０と同様に次のプリント回路板３０を支持することができる。
【００４４】
種類が同じである複数のプリント回路板３０に連続してクリーム状半田が印刷される場合、１枚目のプリント回路板３０へのクリーム状半田の印刷時に、複数の支持ピン９０にプリント回路板３０の裏面３６の凹凸をならわせることにより、その裏面３６の状態が複数の支持ピン９０によりコピーされ、支持ピン９０の移動が阻止されることにより裏面３６の状態が記憶されることとなる。そのため、２枚目以降のプリント回路板３０については、複数の支持ピン９０を移動可能な状態としてプリント回路板３０の裏面３６の凹凸をならわせなくても、支持ピン装置６２を所定の位置へ上昇させれば、複数の支持ピン９０がプリント回路板３０を裏面３６側からその凹凸に沿って強固に支持する状態が得られる。なお、２枚目以降のプリント回路板３０の支持時にも、基板押さえ板１６０は用いられ、支持ピン９０が裏面３６に当接した状態において負圧が供給され、プリント回路板３０を吸着する。
【００４５】
クリーム状半田が印刷されるプリント回路板３０の種類が変わり、裏面３６の凹凸の状態が変わる場合には、基板支持装置１６においては、電磁石１５４が消磁され、球１５２が支持ピン９０の長手方向の移動を許容する状態とされる。そのため、支持ピン９０は次にクリーム状半田が印刷されるプリント回路板３０の裏面３６の凹凸に沿ってプリント回路板３０を支持することができる。本基板支持装置１６によれば、例えば、配線パターンにまだ電子回路部品が装着されていないプリント配線板や、回路基板の裏面に電子回路部品の固定以外にも突部が設けられたプリント回路板や、裏面の凹凸が電子回路部品以外の突部のみによって形成されたプリント配線板等も支持することができる。
【００４６】
上記実施形態において拘束・非拘束状態実現装置は磁化装置を含んで構成されていたが、袋状体および圧力変更装置を含んで構成してもよい。また、保持装置は、付勢手段としての弾性部材の一種であるスプリングにより構成してもよく、さらに、支持部材は回路基板を吸着しない非吸着型としてもよい。それらの実施形態を図４に基づいて説明する。
【００４７】
本実施形態の基板支持装置２５０の支持ピン装置２５２において複数の支持ピン２５４（図４には１つのみ代表的に図示されている）はそれぞれ、上端に支持面２５６を備えており、支持面２５６はクッション２５７によって覆われている。クッション２５７は、ゴムまたはその類似物製であり、本実施形態においては静電防止対策が講じられている。クッション２５７は、例えば、前記吸着部材１４２と同様に、静電防止ゴム製、例えば、静電防止対策が講じられたブチルゴム製とすることができ、支持ピン２５４の回路基板や電子回路部品への接触を柔らかくし、また、支持面２５６への埃等の付着，回路の破損等が防止される。クッション２５８は帯電防止部材でもある。支持ピン２５４を保持する支持台２５８は、一体に図示されているが、実際には複数の部材が組み付けられて成る。支持台２５８内には、球収容室２６０が設けられており、複数の支持ピン２５４は、球収容室２６０を貫通する状態で、支持台２５８に設けられた嵌合穴２６４，貫通穴２６６に長手方向に移動可能に嵌合され、その上端部は支持台２５８から上方へ突出させられている。
【００４８】
支持ピン２５４は、嵌合穴２６４内に配設された弾性部材の一種である圧縮コイルスプリング（以後、スプリングと略称する）２６８により、支持台２５８から上方へ突出する向きに付勢されている。スプリング２６８の付勢による支持ピン２５４の移動限度は、支持ピン２５４に設けられたストッパとしてのストッパプレート２７０が、嵌合穴２６４の肩面２７２に当接することにより規定される。この状態で複数の支持ピン２５４は上昇端位置に位置し、スプリング２６８の付勢により、各支持面２５６は水平な一平面内に位置する状態に保たれる。スプリング２６８のばね定数および予荷重は小さく、電子回路部品Ｃに接触した支持ピン２５４が支持台２５８側へ後退することを許容する大きさであって、支持ピン２５４を、移動阻止装置によって移動を阻止されるまで、電子回路部品Ｃあるいは裏面３６に接触した状態に保つのに足る大きさに設定されている。本実施形態においては、スプリング２６８およびストッパプレート２７０が保持装置２７４を構成している。また、嵌合穴２６４は通路２７６によって大気に解放されている。
【００４９】
複数の支持ピン２５４のそれぞれ、球収容室２６０内に位置する部分には、可撓性材料から成る袋状体２８０の一端部が気密に固着されている。袋状体２８０の他端部はベース２６０に気密に固着されており、この袋状体２８０内に拘束体としての複数の球２８２が収容されている。複数の球２８２は、支持ピン２５４に弱い力で接触させられ、互いにも接触させられるとともに、２層以上に重なり合った状態で収容されている。袋状体２８０内の空間は、ベース２６０に形成された負圧供給路２８４等によって図示を省略する負圧源に接続されている。
【００５０】
したがって、袋状体２８０内に負圧が供給されて、その内部が負圧状態とされれば、袋状体２８０が吸引され、しぼまされて球２８２を締め付け、互いに相対移動不能に拘束し合わせるとともに、支持ピン２５４に強く接触させ、その長手方向の移動を拘束させる。拘束状態が実現されるのである。また、袋状体２８０への負圧の供給が断たれ、大気に解放されて内部が負圧解除状態とされれば、球２８２は互いに接触し、支持ピン２５４にも接触するが、その力は弱い状態となり、支持ピン２５４を拘束せず、その長手方向の移動を許容する。非拘束状態が実現されるのである。本実施形態においては、電磁制御弁（図示省略）および図示を省略する制御装置の、電磁制御弁を制御し、袋状体２８０への負圧の供給，遮断を制御する部分が圧力変更装置を構成し、袋状体２８０と共に拘束・非拘束状態実現装置を構成し、球２８２と共に移動阻止装置２８６を構成している。
【００５１】
基板支持装置２５０がプリント回路板を支持する際には、非拘束状態が実現され、支持ピン２５４が長手方向に移動可能な状態にある。そして、支持ピン装置２５２が上昇させられ、まず、複数の支持ピン２５４のうち、プリント回路板の裏面に固定された電子回路部品に対応する支持ピン２５４が電子回路部品に当接してプリント回路板を持ち上げ、図示を省略する回路板押さえ板に押し付ける。支持ピン装置２５２が更に上昇させられるとき、裏面３６に当接した支持ピン２５４はスプリング２６６を圧縮して支持台２５８側へ後退し、プリント回路板の裏面の電子回路部品がない部分に対応する支持ピン２５４がプリント回路板に当接する。
【００５２】
複数の支持ピン２５４がプリント回路板の裏面にならい、プリント回路板を下方から支持する状態とされたならば、袋状体２８０内に負圧が供給されて支持ピン２５４が球２８２により拘束され、長手方向の移動を阻止されて、プリント回路板が支持ピン２５４によって裏面側から強固に支持される。なお、必要であれば、プリント回路板３０を基板支持装置２４０にクランプするクランプ装置を設ける。プリント回路板の種類が変わる等により、支持ピン２５４にプリント回路板を支持し直させる場合には、袋状体２８０内への負圧の供給が断たれ、支持ピン２５４の長手方向における移動が許容される。
なお、袋状体は、複数の支持ピンに共用としてもよい。
【００５３】
前記実施形態において支持ピン９０は非磁性材料製とされていたが、磁性材料製とすることが望ましい。球１５２が磁化されるとき、支持ピン９０も磁化されて球１５２を引き付け、球１５２がより強い力で支持ピン９０に接触させられて、支持ピン９０の長手方向の移動がより強固に阻止されるからである。この場合、支持面１４０の近傍部は非磁性材料製とし、磁力が電子回路部品に直接作用しないようにすることが望ましい。
【００５４】
また、基板支持装置が種類が同じ回路基板を連続して支持する場合でも、回路基板１枚毎に移動阻止装置による支持部材の移動阻止を解除して、支持部材に回路基板を支持させるようにしてもよく、あるいは設定枚数毎に支持部材の移動阻止を解除して、回路基板を支持し直させてもよい。
【００５５】
さらに、上記実施形態においてプリント回路板３０は、基板押さえ板１６０に当接させられ、水平な姿勢で支持ピン９０，２５４により支持されるようになっており、プリント回路板３０の被印刷面が精度良く一平面とされ、スクリーン印刷を精度良く行うことができる。しかし、回路基板をそれほど精度良く一平面とする必要がない場合や、回路基板の剛性が高く、反りが生じないものである場合には基板押さえ部材を設けることは不可欠ではなく、省略してもよい。
【００５６】
また、上記各実施形態においては、裏面に電子回路部品が固定されたプリント回路板を支持する場合を説明したが、回路基板の裏面に電子回路部品が固定されていることは不可欠ではなく、回路基板支持装置に、電子回路部品が裏面に接着剤やクリーム状半田によって仮止めされているのみの回路基板を裏面側から支持させてもよい。この場合、支持面近傍部を構成する静電防止対策が施された吸着部材１４２およびクッション２５７は、静電気によって電子回路部品が支持部材に付着し、回路基板から脱落することを防止する役割も果たす。
【００５７】
さらに、上記実施形態においては支持ピン９０がプリント回路板３０に対して昇降させられ、これを支持するようにされていたが、回路基板を支持部材に接近，離間する方向に移動させて支持部材に支持させるようにしてもよい。
また、支持ピン９０とプリント回路板３０とは、上下方向に相対移動させられるようになっていたが、それらを上下方向に対して傾斜させられた方向において相対移動させて支持部材に回路基板を支持させる場合にも本発明を適用することができる。
【００５８】
また、図１ないし図３に示す実施形態において球収容室は、複数の支持ピンの各々について別個に設け、各球収容室に球を収容してもよい。
【００５９】
さらに、本発明は、上記各実施形態の各特徴を組み合わせた態様で実施することができる。例えば、非吸着型の支持部材の移動を移動阻止装置１５８によって阻止し、吸着型の支持部材の移動を移動阻止装置２８６によって阻止する。
【００６０】
また、回路基板の両縁部を、側部拘束装置によって少なくとも上方へ移動不能に拘束してもよい。
【００６１】
さらに、本発明は、回路基板にクリーム状半田を印刷する場合の回路基板の支持に限らず、ディスペンサによって接着剤を回路基板に塗布する装置，電子回路部品を回路基板に装着する装置等の作業装置により回路基板の板面について何らかの作業を行う場合や、回路検査装置により、回路基板に形成された回路を検査する場合等に回路基板を支持する装置に適用することができる。
【００６２】
その他、特許請求の範囲を逸脱することなく、当業者の知識に基づいて種々の変形，改良を施した態様で本発明を実施することができる。
【図面の簡単な説明】
【図１】本発明の一実施形態である基板支持装置を備えたスクリーン印刷機を概略的に示す正面図である。
【図２】上記基板支持装置を示す正面図（一部断面図）である。
【図３】上記基板支持装置の支持ピン装置の要部を拡大して示す正面図（一部断面）である。
【図４】本発明の別の実施形態である基板支持装置の要部を拡大して示す正面図（一部断面）である。
【符号の説明】
１６：基板支持装置 ３０：プリント回路板 ６０：回路板昇降装置 ６２：支持ピン装置 ９０：支持ピン ９２：支持台 １３０：ピストン１３４：正圧室 １３８：保持装置 １４０：支持面 １５２：球 １６０：回路板押さえ板 ２００：制御装置 ２５０：基板支持装置 ２５４：支持ピン ２５６：支持面 ２５８：支持台 ２６０：球収容室２６８：スプリング ２７０：ストッパプレート ２７４：保持装置 ２８０：袋状体 ２８２：球 ２８６：移動阻止装置[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an apparatus for supporting a circuit board from the back surface side, and particularly to support of a circuit board having unevenness on the back surface by mounting electronic circuit components.
[0002]
[Prior art]
In the circuit board support device, there is a device in which a plurality of support members are held by a support base so as to be movable in the longitudinal direction, and support the circuit board from the back surface side according to the unevenness of the back surface of the circuit board. In this support device, for example, a plurality of support pins, which are a kind of support member, are fitted to the support base so as to be movable in the longitudinal direction, and are urged by a spring in a direction protruding from the support base. The limit of movement of the support pin due to the urging of the spring is regulated by the stopper provided on the support pin coming into contact with the downward surface provided on the support base, and the support surface formed on each upper end of the plurality of support pins. Is kept in a horizontal plane, and when a force is applied to each support pin in a direction to push it back toward the support base, the support pin is retracted toward the support base side due to the compression of the spring. Permissible. The longitudinal movement of the plurality of support pins with respect to the support base is blocked by the movement blocking device. The movement blocking device includes a clamp plate and a clamp plate moving device. The plate surface of the clamp plate is disposed so as to be movable in a plane perpendicular to the longitudinal direction of the support pin, and a plurality of large diameter holes are formed through the thickness direction. An annular rubber with a high coefficient of friction is provided for each. The inner diameter of the annular rubber is larger than the outer diameter of the support pin, and each of the plurality of support pins is fitted in the annular rubber with a gap in the radial direction.
[0003]
The plurality of support pins are allowed to move in the longitudinal direction, and are brought close to the circuit board from the back side in a state where each support surface is located in a horizontal plane. If an electronic circuit component is already mounted on the back surface of the circuit board, among the plurality of support pins, the support pin corresponding to the electronic circuit component on the back surface of the circuit board contacts the electronic circuit component and supports the circuit board. Raised and brought into contact with the substrate pressing plate. In this state, the support base is further brought closer to the circuit board. At this time, the support pins that are in contact with the electronic circuit components are retracted into the support base against the biasing force of the spring, and the circuit board The support pin corresponding to the portion where the electronic circuit component is not mounted is allowed to contact the back surface of the circuit board. In this way, the support pins corresponding to the electronic circuit components are retracted into the support base against the urging force of the spring, so that the plurality of support pins are in contact with the back surface of the circuit board from below according to the unevenness. It becomes. In this state, the clamp plate is moved to prevent the support pins from moving. As the clamp plate moves, the support pin is pushed through the annular rubber, and is pressed against the inner peripheral surface of the through hole into which the support pin of the support base is fitted. The movement of the support pin is prevented by the frictional force generated between the rubber and the printed wiring board is firmly supported. If support pins that can move in the longitudinal direction with respect to the support base are used in this way, even if the type of circuit board changes and the unevenness of the back surface changes, the printed wiring board can be used without changing the support pins accordingly. Can be supported, and the time required for the setup change is shortened. In addition, if an annular rubber is used, the elastic deformation absorbs the dimensional error of the support pin, the through hole of the support base, and the large diameter hole of the clamp plate. In addition, it is possible to stably prevent the movement of the support pin (see, for example, Patent Document 1).
[0004]
[Patent Document 1]
Japanese Patent No. 2889012
[0005]
[Problems to be solved by the invention, means for solving problems and effects]
However, if the movement of the support pin is repeatedly prevented by the clamp plate, and the annular rubber is repeatedly contacted and separated from the support pin, the annular rubber will deteriorate or wear out, and the support pin will penetrate to the inner peripheral surface of the through hole. The pressing is insufficient and the movement is not blocked well. Further, in order to prevent the movement of the support pin, a clamp plate and a clamp plate moving device provided with a plurality of large-diameter holes and an annular rubber are necessary, and there is a problem that the structure of the movement blocking device is complicated.
[0006]
With the above circumstances as a background, the present invention improves the life of the movement prevention device in a circuit board support device in which a plurality of support members move in the longitudinal direction with respect to the support base to support the circuit board from the back side. The present invention has been made with the object of simplifying the structure, and according to the present invention, circuit board support devices of the following aspects can be obtained. As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is for the purpose of facilitating understanding of the present invention, and should not be construed as limiting the technical features described in the present specification and the combinations thereof to those described in the following sections. . In addition, when a plurality of items are described in one section, it is not always necessary to employ the plurality of items together. It is also possible to select and employ only some items.
[0007]
In each of the following items, the combination of items (1), (2), and (4) corresponds to claim 1, and the feature of item (3) is added to claim 1. The features of the second aspect to which the feature of the fifth aspect is added correspond to the third aspect. Further, claim 4 is obtained by adding the matters described in paragraph [0053] to claim 3, and claim 5 is obtained by adding features described in the explanation of claim (5) to claim 1 or 2. It is.
[0008]
(1) a support base;
A plurality of support members protruding upward from the support table and held movably in the longitudinal direction by the support table;
When these support members are maintained in a state in which the support surface formed at the upper end of each support member is located within a predetermined plane, and a force is applied to each support member in a direction to push it back toward the support base. A holding device that allows the support member to move backward toward the support base,
A movement blocking device for blocking the relative movement of each of the support members in the longitudinal direction with respect to the support base;
In a circuit board support device that supports the circuit board from the back side,
The movement blocking device;
A plurality of restraining bodies held on the support base so as to be able to contact each of the plurality of support members,
The restraint body is in strong contact with each of the plurality of support members, the restraint state in which the movement of each support member in the longitudinal direction is restrained, and the support member is in contact with each support member with a weak force or in the longitudinal direction of the support member. A constrained / unconstrained state realizing apparatus that selectively realizes a non-constrained state that allows movement of
A circuit board support device including:
Circuit boards include, for example, a printed wiring board in which electronic circuit components are not mounted on all of the printed wiring provided on the insulating substrate, a printed wiring board in which electronic circuit components are already mounted in part of the printed wiring, This corresponds to a printed circuit board in which electronic circuit components are mounted on one printed wiring and soldered and joined. Electronic circuit components are mounted on a circuit board to constitute an electronic circuit.
The support member may be a non-adsorption type support member that does not adsorb the circuit board by negative pressure, or may be a holding member that is an adsorption type support member that adsorbs and holds the circuit board by negative pressure.
Various shapes can be adopted as the restraining body. For example, it may be a spherical shape, a regular polyhedron, or an indefinite shape whose shape is not constant. Further, a constraining body having a shape in which a hollow cylindrical body or a hollow tapered cylindrical body is divided into a plurality of parts in the axial direction may be disposed so as to surround a support member having a circular cross-sectional shape. The plurality of restraints may all have the same shape and dimensions, and at least one of the shapes and dimensions may be different in two or more types.
“Movement prevention” is a force that normally acts on the support member, for example, when mounting electronic circuit components on the circuit board by the mounting device, or by applying high-viscosity fluid such as cream solder or adhesive by the high-viscosity fluid application device. Depending on the force applied to the support member via the circuit board during application to the circuit board or the force applied by the holding device to the support member, the support member may be longitudinally moved depending on the force acting in the direction of pushing the support member from the support base. It does not mean that the movement of the support member is absolutely prevented.
The “predetermined surface” is one plane, two or more stepped surfaces, a curved surface, or the like. When the back surface, which is the supported surface of the circuit board, is a stepped surface or a curved surface, the surface on which the support member is located has two or more flat surfaces having a difference equal to the difference in height between the stepped surfaces, If a curved surface corresponding to the curved surface of the substrate is used, the amount of retraction of the support member into the support table can be determined by the amount of protrusion of the electronic circuit components, regardless of the difference in height of the back surface. . However, it is not indispensable that the surface on which the support member is located has the same shape as the back surface of the circuit board.
[0009]
When the circuit board support device supports the circuit board, the circuit board and the plurality of support members are brought close to each other. At this time, the constrained / unconstrained state realizing device realizes the unconstrained state, and the support member is movable in the longitudinal direction with respect to the support base. Therefore, for example, if an electronic circuit component is already mounted on the back surface of the circuit board and there are irregularities, a plurality of support members corresponding to the electronic circuit component abut against the electronic circuit component and further support from that state. When the member and the circuit board are brought close to each other, a force in a direction of pushing back toward the support base is applied to the support member corresponding to the electronic circuit component. As a result, the support member retracts toward the support base, and the support member that does not correspond to the electronic circuit component is allowed to contact the back surface of the circuit board. Then, the restraint / unconstrained state realizing device realizes the restrained state in a state in which the plurality of support members are in contact with the unevenness of the back surface of the circuit board, thereby preventing the support member from moving in the longitudinal direction. The circuit board is firmly supported from the back side, so that the circuit board is not bent at the time of work such as mounting of the electronic circuit component on the circuit board, and the work is performed satisfactorily.
Thus, according to the circuit board support device of this section, the movement of the support member can be prevented without using rubber, and a circuit board support device having a long life of the movement prevention device can be obtained. In addition, by changing the contact strength of the plurality of restraints to the support member, the movement of the support member can be prevented or allowed to move, and a circuit board support device with a simple configuration of the movement prevention device can be obtained. .
[0010]
(2) The support base includes a restraint body accommodating chamber therein, and each of the plurality of support members is fitted to the support base in a state of penetrating the restraint body accommodating chamber, and the plurality of restraint bodies include: In the restraint body accommodation chamber, the support members are accommodated in contact with each other and in contact with each other. In the restrained state, the restraint members restrain each other so that they cannot move relative to each other, and restrain the longitudinal movement of the support members. The circuit board support device according to the item.
When the restraint / unconstrained state realization device realizes the restraint state, the plurality of restraints restrain each other and come into strong contact with the support member to prevent movement in the longitudinal direction.
[0011]
(3) The circuit board support device according to (2), wherein each of the plurality of restraints is spherical.
(4) The circuit board support device according to (3), wherein the spherical restraint is housed in the restraint housing chamber in a state where two or more layers overlap each other.
According to the circuit board support device of this section, the plurality of restraining bodies are arranged in the longitudinal direction of the support member and come into contact with the support member in an overlapping state, and the contact area of the support member with the restraint body is large. The movement can be more reliably prevented.
(5) The plurality of constraining bodies are formed of a magnetic material, and the constraining / unconstraining state realization device includes a magnetizing device that magnetizes the constraining body. Circuit board support device.
When the restraining body is magnetized, the plurality of restraining bodies come into contact with each other by magnetic force, restrain each other so that they cannot move relative to each other, and strongly contact the support member to prevent the movement.
It is desirable that the support member is made of a nonmagnetic material at least in the vicinity of the support surface so that the magnetic force does not directly act on the electronic circuit component.
The restraint / unconstrained state realization device may be a device that generates a pressing force that presses the restraint against the support member. In addition to the magnetizing device, the restraint / non-restraint state realization device is made of, for example, a flexible material and includes the plurality of restraints. And a pressure changing device that changes the inside of the bag-like body between a negative pressure state and a negative pressure release state (atmospheric pressure state or positive pressure state).
[0012]
(6) The circuit board support device according to any one of (1) to (5), wherein at least a portion near the support surface of the support member is made of an antistatic material-type flexible material.
According to this aspect, when the support member comes into contact with the electronic circuit component mounted on the back surface of the circuit board, the support member comes in contact softly with little impact, and there is no fear of damaging the electronic circuit component. In addition, for example, it is possible to avoid that the electronic circuit component temporarily fixed to the back surface of the circuit board by the cream-like solder adheres to the support member due to static electricity and leaves the circuit board and falls off. In addition, it is possible to prevent dirt or the like from adhering to the support surface due to static electricity and soiling the support surface. In addition, at least the support surface vicinity of the support member is charged, and internal damage is prevented from occurring in a circuit in an electronic circuit component mounted on the back surface of the circuit board, a circuit provided on the circuit board, an integrated circuit, or the like. The When the electronic circuit component is mounted on the surface of the circuit board, internal damage of the circuit in the electronic circuit component is also prevented. In addition, when the electronic circuit component is mounted on the surface of the circuit board, vibration of the circuit board is prevented, and deviation of the electronic circuit component already mounted on the surface is prevented. Furthermore, the impact when the electronic circuit component is brought into contact with the circuit board is mitigated, and cracking of the electronic circuit component to be mounted and the electronic circuit component mounted on the back surface of the circuit board and in contact with the support member is prevented. The At least a portion near the support surface of the support member also functions as a cushion and a vibration damping member.
[0013]
(7) The circuit according to any one of (1) to (6), including a substrate pressing member that presses the circuit board from the front side when the support surface of the support member is brought into contact with the back surface of the circuit board. Substrate support device.
The board pressing member may be a flat plate member that contacts most of the surface of the circuit board, or may be a frame-like member that continuously presses a part of the circuit board. But you can.
If the circuit board is pressed by the board pressing member, for example, even if the circuit board is highly flexible, the circuit board is bent upward when the support member contacts and supports the circuit board from the back side. Or even if the circuit board originally warps upward or downward, it is corrected to be flat.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment in which the present invention is applied to support of a circuit board in a screen printer that applies cream solder (hereinafter abbreviated as solder) to a circuit board wiring pattern will be described in detail with reference to the drawings. . The screen printing machine itself is already known in Japanese Patent Publication No. 2-13475 except for the circuit board support device, and will be described briefly.
[0015]
As schematically shown in FIG. 1, the screen printing machine of the present embodiment includes a substrate conveyor 12 (see FIG. 2) as a substrate transfer device provided on a bed 10 as a main body, a substrate support device 16, and a screen positioning support. A device (not shown) and a squeegee device 18 are provided.
[0016]
As shown in FIG. 2, the substrate conveyor 12 includes a pair of rails 26 (only one rail is shown in FIG. 2). Belt conveyors 28 are provided on the surfaces of the rails 26 that face each other, and convey a printed circuit board 30 (see FIGS. 1 and 3) as a circuit board. The belt conveyor 28 includes an endless belt 32 that is a winding member and a belt driving device 34 that is a winding member driving device that circulates the belt 32, and the printed circuit board 30 is placed on the belt 32, and the back surface 36 side. Is supported by the belt 32 and conveyed by the movement of the belt 32. Each of the opposed surfaces of the pair of rails 26 is provided with a vertical guide surface parallel to the longitudinal direction of the rail 26, and the pair of guide surfaces are printed from both sides in the width direction of the printed circuit board 30. Each side surface of the circuit board 30 is guided, and the printed circuit board 30 is guided in the longitudinal direction of the rail 26.
[0017]
The screen positioning support device positions the screen 40 (see FIG. 1) and fixes it to the screen support base 42 by a fixing device (not shown). As shown in FIG. 1, the squeegee device 18 includes two squeegees 44 and 46, and these squeegees 44 and 46 are alternatively lowered by lifting and lowering devices 48 and 50 and brought into contact with the screen 40. In this state, the squeegee moving device 52 moves the squeegee to apply the cream solder to the wiring pattern of the printed circuit board 30. In the present embodiment, the squeegees 44 and 46 are moved in a direction parallel to the conveyance direction of the printed circuit board 30 during application of cream-like solder.
[0018]
The substrate support device 16 will be described.
In the present embodiment, the substrate support device 16 includes a substrate lifting device 60 and a support pin device 62 as shown in FIG. The substrate lifting device 60 has a substrate lifter 68. A pair of guide rods 70 extend from the lower surface of the substrate lifter 68 and are fitted to a guide cylinder 74 fixed to the base 72 so as to be movable up and down. A screw shaft 76 is also fixed to the lower surface of the substrate lifter 68, and is screwed into a nut 78 that is attached to the base 72 so as to be rotatable about a vertical axis and not movable in the axial direction. By being rotated by a driving motor (not shown), the screw shaft 76 moves in the vertical direction, and the substrate lifter 68 is moved up and down.
[0019]
As shown in FIG. 2, the support pin device 62 is provided on the substrate lifter 68 and is raised and lowered by raising and lowering the substrate lifter 68. As shown in FIG. 3, the support pin device 62 includes a plurality of support pins 90 and a support base 92 as support members. In the present embodiment, for the convenience of manufacturing, the support base 92 is configured such that a plurality of members are assembled together and fixed, and functions as an integral support base 92 after assembly. In this embodiment, the support base 92 includes a base 96, a positive pressure supply path forming member 98, a negative pressure supply path forming member 100, a spacer 102, and a housing member 104, and is positioned and fixed to the substrate lifter 68 so as to be detachable. Yes. These bases 96 and the like have a plate shape, and in a state where they are stacked and assembled with each other, a plurality of cylinder bores 110 formed through the base 96 in the thickness direction and the negative pressure supply path forming member 100 have a thickness. A plurality of through holes 112 formed so as to penetrate in the direction and a plurality of fitting holes 114 and 115 formed in the thickness direction in the housing member 104 are concentric with each other.
[0020]
The spacer 102 is sandwiched between the negative pressure supply path forming member 100 and the housing member 104. In the spacer 102, an opening 116 is formed at a portion corresponding to the through hole 112, and the opening 116 is closed by the negative pressure supply path forming member 100 and the housing member 104 to form a negative pressure supply path 118. ing. The negative pressure supply path 118 is connected to a negative pressure source (not shown) via a passage (not shown) formed in the negative pressure supply path forming member 100 and the like and the joint device 120 and the like.
[0021]
The positive pressure supply path forming member 98 is provided with a concave portion 122, and the positive pressure supply path 124 is formed by closing the opening of the concave portion 122 with the base 96. The cylinder bore 110 is opened to the positive pressure supply path 124. The positive pressure supply path 124 is connected to a positive pressure source (not shown) via a passage (not shown) formed in the positive pressure supply path forming member 98 and the like and the joint device 126 and the like. An electromagnetic direction switching valve (not shown) serving as an electromagnetic control valve is provided between the coupling devices 120 and 126 and the negative pressure source and the positive pressure source, respectively, to the negative pressure supply path 118 and the positive pressure supply path 124. The supply of negative pressure and positive pressure is allowed and cut off, respectively.
[0022]
Inside the housing member 104, a ball housing chamber 128 is formed as a restraint body housing chamber, and the plurality of fitting holes 114 and 115 are opened on the upper and lower surfaces of the housing member 104, respectively. The storage chamber 128 is opened. Each of the plurality of support pins 90 is fitted into the fitting holes 114 and 115 and the through hole 112 so as to be movable in the longitudinal direction in a state of penetrating the ball housing chamber 128, and an upper end portion thereof is upward from the support base 92. It protrudes and is held by the support base 92 so as to be movable in the longitudinal direction.
[0023]
The support pin 90 is a hollow pin in the present embodiment, and is entirely formed of aluminum which is a kind of nonmagnetic material. A piston 130 having a diameter larger than that of the support pin 90 is provided concentrically at the rear end portion or the lower end portion of the support pin 90 and is fitted to the cylinder bore 110 so as to be airtight and movable in the axial direction. Thereby, in the cylinder bore 110, an atmospheric pressure chamber 132 is formed on the negative pressure supply path forming member 100 side, and a positive pressure chamber 134 is formed on the positive pressure supply path forming member 98 side. The atmospheric pressure chamber 132 is released to the atmosphere by a passage 136, and the positive pressure chamber 134 is communicated with the positive pressure supply path 124. In this embodiment, the piston 130 is also made of aluminum, which is a kind of nonmagnetic material.
[0024]
The through hole 112 formed in the negative pressure supply path forming member 100 is formed with high dimensional accuracy, and the support pin 90 is fitted with high precision so that the gap between the support pin 90 and the negative pressure supply path forming member 100 can be reduced. Negative pressure leakage is prevented.
[0025]
A support surface 140 that is perpendicular to the center line of the support pin 90 and forms a flat surface is formed at the tip or upper end of the support pin 90. In a state where compressed air is supplied to the positive pressure chamber 134, the support pin 90 is urged in a direction to move upward. The movement limit of the support pin 90 by this urging is that the piston 130 has a negative pressure supply path. The plurality of support pins 90 are positioned at the ascending end position, and each support surface 140 is a predetermined surface and is positioned in a horizontal plane. Kept in a state. When force is applied to the support pin 90 so as to push it back toward the support base 92, the piston 130 compresses the air in the positive pressure chamber 134 and allows the support pin 90 to move backward toward the support base 92. . In the present embodiment, the piston 130 constitutes a stopper, and the holding device 138 is constituted together with the positive pressure chamber 134 constituting the urging means.
[0026]
A suction member 142 is attached to the tip of the support pin 90. The adsorbing member 142 has a ring shape and is made of rubber or the like. In the present embodiment, the attracting member 142 is made of, for example, butyl rubber with antistatic measures taken, and the vicinity of the support surface 140 of the support pin 90 is made of an antistatic flexible material. . A plurality of passages 144 are formed at the tip of the support pin 90 so as to penetrate the side wall in the radial direction. The passage 144 is located between the housing member 104 and the negative pressure supply when the piston 130 is located between the rising end position where the piston 130 contacts the lower surface of the negative pressure supply path forming member 100 and a position slightly below the rising end position. It is formed at a position where it communicates with the negative pressure supply path 118 formed between the path forming member 100. In a state where the passage 144 communicates with the negative pressure supply path 118, a negative pressure is supplied into the support pin 90, and the support pin 90 sucks the printed circuit board 30 by the negative pressure at the suction member 142. In the present embodiment, the support pin 90 is an adsorption-type support member and is a holding pin that is a holding member.
[0027]
In the present embodiment, the housing member 104 is made of steel, which is a kind of magnetic material, and a plurality of spheres 152 serving as restraints are housed in the sphere housing chamber 128 formed therein. Has been. The restraint body has a spherical shape in the present embodiment, and the sphere 152 is formed of iron, which is a kind of magnetic material, in the present embodiment. The sphere 152 may be made of steel. These spheres 152 are accommodated in the sphere accommodating chamber 152 in a state where they contact the support pins 92 and also contact each other, and overlap each other in two or more layers.
[0028]
The housing member 104 is provided with a sphere housing chamber 128 and an inlet (not shown) for opening the sphere housing chamber 128 to the outside inside the integral member, and the sphere from the entrance is fitted with the support pin 90 fitted to the support base 92. 152 may be accommodated in the ball accommodating chamber 128, and the entrance may be closed after the accommodation, or the accommodating member 104 is formed by assembling a plurality of members, and a member in which a recess is formed and a closing member that closes the opening of the recess And the ball storage chamber 128 may be formed by closing the opening of the recess. In this case, the support pin 90 is fitted to the bottom wall of the member having the recess so as to be movable in the longitudinal direction, and the ball 152 is accommodated in the recess, and then the opening of the recess is closed by the closing member. The blocking member is provided with a plurality of through holes into which the plurality of support pins 90 are fitted so as to be movable in the longitudinal direction. One fitting hole 114 into which the support pin 90 of the housing member 104 is fitted is formed with high dimensional accuracy, and the other fitting hole 115 is fitted with the support pin 90 having a slight gap in the radial direction. The movement of the support pin 90 in the longitudinal direction is guided by the negative pressure supply path forming member 100 and the portion of the housing member 104 where the fitting hole 114 is provided.
[0029]
The spacer 102 and the negative pressure supply path forming member 100 are made of steel, which is a kind of magnetic material, and a plurality of electromagnets 154 are embedded in the negative pressure supply path forming member 100. The base 96 and the positive pressure supply path forming member 98 are made of aluminum which is a kind of nonmagnetic material. Therefore, when the electromagnet 154 is energized, the negative pressure supply path forming member 100, the spacer 102, and the housing member 104 are magnetized and the sphere 152 is magnetized, and the plurality of spheres 152 are strongly attracted to each other by magnetic force and cannot move relative to each other. , And strongly contact the support pin 90 to restrain the movement in the longitudinal direction. This is because the restrained state is realized, and the longitudinal movement of the support pin 90 relative to the support base 92 is prevented. Further, if the electromagnet 154 is de-energized, the magnetic force disappears, and the plurality of spheres 152 come into contact with the support pins 90 but the force is weak, and the non-supporting movement of the support pins 90 in the longitudinal direction is allowed. A restraint state is realized. In the present embodiment, the negative pressure supply path forming member 100 made of a magnetic material, the spacer 102, the housing member 104, the electromagnet 154, and the like constitute the magnetizing device 156, and the movement preventing device 158 together with the ball 152.
[0030]
As shown in FIG. 3, a substrate pressing plate 160 is provided above the support pin device 62 configured as described above, and presses the printed circuit board 30 from the surface 162 side. The substrate pressing plate 160 is provided so that the plate surface is horizontal and, in this embodiment, movable in a direction parallel to the conveyance direction of the printed circuit board 30 by the substrate conveyor 12, and is conveyed by a moving device (not shown). It is moved in a direction parallel to the direction, and is moved to a pressing position located directly above the substrate support device 16 and a retreat position retracted from the substrate support device 16.
[0031]
The screen printing machine is controlled by the control device 200 shown in FIG. The control device 200 is mainly a computer and controls the substrate conveyor 12 and the like, and also controls the supply and interruption of current from a power source (not shown) to the electromagnet 154.
[0032]
The case where cream-like solder is applied to the surface 162 of the printed circuit board 30 shown in FIG. 3 using the screen printer configured as described above will be described. On the back surface 36 of the printed circuit board 30, the electronic circuit component C is already mounted and fixed by bonding or soldering, and there are irregularities. During screen printing, the screen 40 corresponding to the type of the printed circuit board 30 is fixed to the screen support base 42. The printed circuit board 30 is transported by the transport conveyor 12 and is stopped above the substrate support device 16 at a predetermined printing position by a stopper device (not shown). When the printed circuit board 30 is carried in, the support pin device 62 is at the lower end position, the substrate pressing plate 160 is positioned at the pressing position, and the printed circuit board 30 is moved between the substrate supporting device 16 and the substrate pressing plate 160. .
[0033]
After loading the printed circuit board 30, the board lifter 68 is raised and the support pin device 62 is raised to lift the printed circuit board 30 from the board conveyor 12 and press it against the board holding plate 160. At this time, positioning pins (not shown) provided on the rail 26 are fitted into the positioning holes of the printed circuit board 30 to accurately position the printed circuit board 30.
[0034]
When the support pin device 62 is raised, the supply of current to the electromagnet 154 is cut off, the movement preventing device 158 is realized in an unconstrained state, and the plurality of support pins 90 are all allowed to move in the longitudinal direction. The compressed air is supplied to the positive pressure chamber 134 of the support base 92, the piston 130 abuts the lower surface of the negative pressure supply path forming member 100, the support pin 90 is at the rising end position, and the plurality of support pins 90 Each support surface 140 is located in the same horizontal plane. Therefore, when the substrate lifter 68 is raised, first, the support pins 90 corresponding to the electronic circuit component C out of the large number of support pins 90 abut against the electronic circuit component C, and are lifted from the belt 32 to the substrate holding plate 160. The board pressing plate 160 presses the printed circuit board 30 from the surface 162 side. Since the electronic circuit component C is fixed to the back surface 36, there is no possibility that the electronic circuit component C is displaced even if the support pin 90 comes into contact. In addition, since the suction member 142 is provided at the tip of the support pin 90, the printed circuit board 30 and the electronic circuit component C are softly contacted.
[0035]
When the substrate lifter 68 is further raised from this state, a force in a direction of pushing back toward the support base 92 is applied to the support pin 90 in contact with the electronic circuit component C, and the support pin 90 is moved in the positive pressure chamber. The support pin 90 moves backward to the support base 92 against the force that urges the support pin 90 upward based on the positive pressure of 134, and corresponds to the portion of the back surface 36 of the printed circuit board 30 where the electronic circuit component C is absent. 90 contacts the printed circuit board 30.
[0036]
As described above, the support pin 90 moves back toward the support base 92 against the upward biasing force, so that the support pin 90 comes into contact with the printed circuit board 30 from the bottom along the unevenness. At this time, based on the positive pressure in the positive pressure chamber 134, a force that biases upward is applied to the printed circuit board 30, but the printed circuit board 30 warps upward because it is pressed against the board pressing plate 160. It stays flat. Even when the printed circuit board 30 originally warps upward or downward, the printed circuit board 30 is corrected to be flat by being pressed against the flat substrate pressing plate 160. The pressure in the positive pressure chamber 134 is large enough to allow the support pin 90 in contact with the electronic circuit component C to move backward toward the support base 92, and the movement of the support pin 90 is blocked by the movement blocking device 158. Until it is in contact with the electronic circuit component C or the rear surface 36.
[0037]
After the support pin 90 is brought into contact with the printed circuit board 30, a negative pressure is supplied into the support pin 90 to attract the printed circuit board 30. The support pin 90 that supports the portion of the printed circuit board 30 where the electronic circuit component C is not present is slightly below the ascending end position where the piston 130 contacts the negative pressure supply path forming member 100, and the passage 144 is supplied with negative pressure. The circuit is in communication with the path 118 and is supplied with negative pressure and supplies the printed circuit board 30, while the support pin 90 that is in contact with the electronic circuit component C is retracted toward the support base 92, so that the path 144 is negative. The communication with the pressure supply path 118 is blocked and no negative pressure is supplied. Therefore, the support pin 90 that is in contact with the electronic circuit component C is not attached to the suction member 142 if the suction member 142 does not adhere to the printed circuit board 30 and the cross-sectional area of the electronic circuit component C is larger than the cross-sectional area of the opening of the suction member 142. Although the opening of 142 may be blocked by the electronic circuit component C, the suction member 142 may contact the electronic circuit component C in a state where at least a part of the opening is detached from the electronic circuit component C. Although leakage occurs if pressure is supplied, since no negative pressure is supplied to the support pin 90, there is no leakage of negative pressure, and the printed circuit board 30 by the support pin 90 that abuts the printed circuit board 30. There is no fear that the adsorptive power will be reduced.
[0038]
When the negative pressure is supplied to the support pin 90 and sucks the printed circuit board 30 in this way, the printed circuit board 30 is supported by the support pin 90 from below in a flat state pressed against the board pressing plate 160. Then, it will be attracted downward by adsorption. In this state, a current is supplied to the electromagnet 154 to realize a restrained state. As a result, the spheres 152 are magnetized and restrain each other so that they cannot move relative to each other, and the portions of the support pins 90 located in the sphere accommodating chamber 128 are in strong contact with each other to prevent movement in the longitudinal direction. Therefore, the support pin 90 is kept in a state of supporting the printed circuit board 30 following the unevenness of the back surface 36 of the printed circuit board 30, and the printed circuit board 30 is firmly supported from below and is attracted by negative pressure. It will be in a state where lifting is prevented.
[0039]
In the present embodiment, the electronic circuit component C is fixed to the back surface 36 of the printed circuit board 30 by adhesion or soldering, and does not adhere to the support pins 90 due to static electricity and does not fall off the printed circuit board 30. The support surface 140 covered with the adsorption member 142 made of the antistatic rubber is in soft contact with the electronic circuit component C and the like, and is prevented from being contaminated with dust due to static electricity. The support surface 140 is prevented from being charged, and the circuit in the electronic circuit component C is prevented from being damaged. The adsorption member 142 is also a cushion and an antistatic member.
[0040]
After the movement of the support pin 90 is blocked and fixed to the support base 92, the positive pressure chamber 134 is released to the atmosphere and the supply of air is shut off. Thereafter, the board pressing plate 160 is retracted from the printed circuit board 30. At this time, the support pin device 62 is lowered by a short distance, and the printed circuit board 30 is separated from the board pressing plate 160. Although the printed circuit board 30 can be lifted from the support pins 90 and warped upward by retracting the board pressing plate 160, it is not warped because it is attracted to the support pins 90 side by the suction member 142. Further, since the supply of air to the positive pressure chamber 134 is interrupted, there is no possibility that the support pin 90 moves due to the biasing force based on the positive pressure, and there is no possibility that the printed circuit board 30 is pushed.
[0041]
After the substrate holding plate 160 is retracted, the substrate lifter 68 is further raised and the printed circuit board 30 is brought into contact with the lower surface of the screen 40. The cream solder is printed on the printed circuit board 30 by the movement of the squeegee 44 or 46. The printed circuit board 30 is firmly supported from below by the substrate support device 16 and is held by being sucked, so that the printed circuit board 30 is not deflected or displaced with respect to the screen 40, and is accurate. Printing is performed.
[0042]
After printing, the support pin device 62 is lowered and the printed circuit board 30 is lowered. At this time, the supply of the negative pressure to the negative pressure supply path 118 is cut off, the suction of the printed circuit board 30 by the suction member 142 is released, and the support pin 90 can be separated from the printed circuit board 30. The support pin device 62 is further lowered after the printed circuit board 30 is supported from below by the substrate conveyor 12, and the printed circuit board 30 is supported from below by the belt 32 and carried out by the substrate conveyor 12. . The substrate lifting device 60 is a kind of relative movement device or approach / separation device that relatively moves, approaches, or separates the support member and the circuit board in a direction perpendicular to the plate surface of the circuit board. But there is.
[0043]
After the printed circuit board 30 is unloaded, the printed circuit board 30 to which the cream solder is applied is loaded next. In the substrate support device 16, the supply of the negative pressure to the support pins 90 is cut off, but energization to the electromagnet 154 is continued, the movement of the support pins 90 is prevented, and the unevenness of the back surface 36 of the printed circuit board 30 is uneven. It stays in the same state. Therefore, if the next printed circuit board 30 is the same type of printed circuit board 30, the plurality of support pins 90 can support the printed circuit board 30 as it is. When the printed circuit board 30 is guided on each side by the vertical guide surfaces of the pair of rails 26 and stopped at a predetermined printing position by the stopper device, and is supported by the substrate support device 16. Are positioned by the positioning pins, the same relative position is obtained between the same type of printed circuit board 30 and the substrate support device 16, and the support pins 90 are the next printed circuit as in the previous printed circuit board 30. The plate 30 can be supported.
[0044]
When cream-like solder is continuously printed on a plurality of printed circuit boards 30 of the same type, the printed circuit board is printed on the plurality of support pins 90 when the cream-like solder is printed on the first printed circuit board 30. By aligning the unevenness of the back surface 36 of 30, the state of the back surface 36 is copied by a plurality of support pins 90, and the state of the back surface 36 is stored by preventing the movement of the support pins 90. . Therefore, with respect to the second and subsequent printed circuit boards 30, the support pin device 62 is moved to a predetermined position without the unevenness of the back surface 36 of the printed circuit board 30 with the plurality of support pins 90 being movable. If it raises, the state which the several support pin 90 will firmly support the printed circuit board 30 along the unevenness | corrugation from the back surface 36 side will be obtained. Note that the substrate pressing plate 160 is also used when supporting the second and subsequent printed circuit boards 30, and negative pressure is supplied in a state where the support pins 90 are in contact with the back surface 36 to attract the printed circuit boards 30.
[0045]
When the type of the printed circuit board 30 on which the cream-like solder is printed changes and the unevenness of the back surface 36 changes, the electromagnet 154 is demagnetized in the board support device 16, and the sphere 152 is the longitudinal direction of the support pin 90. The movement is allowed. Therefore, the support pins 90 can support the printed circuit board 30 along the unevenness of the back surface 36 of the printed circuit board 30 on which cream-like solder is printed next. According to this board support device 16, for example, a printed wiring board in which electronic circuit components are not yet mounted on the wiring pattern, or a printed circuit board in which protrusions are provided on the back surface of the circuit board in addition to fixing the electronic circuit parts It is also possible to support a printed wiring board or the like in which the unevenness on the back surface is formed only by the protrusions other than the electronic circuit component.
[0046]
In the above embodiment, the constrained / unconstrained state realizing device is configured to include the magnetizing device, but may be configured to include a bag-like body and a pressure changing device. Further, the holding device may be constituted by a spring which is a kind of elastic member as an urging means, and the support member may be a non-adsorption type that does not adsorb the circuit board. These embodiments will be described with reference to FIG.
[0047]
In the support pin device 252 of the substrate support device 250 of the present embodiment, each of the plurality of support pins 254 (only one is representatively shown in FIG. 4) includes a support surface 256 at the upper end. 256 is covered with a cushion 257. The cushion 257 is made of rubber or the like, and in this embodiment, an antistatic measure is taken. The cushion 257 can be made of, for example, an antistatic rubber, for example, a butyl rubber having antistatic measures taken, like the suction member 142, and the support pin 254 can be attached to a circuit board or an electronic circuit component. The contact is softened, and adhesion of dust and the like to the support surface 256, damage to the circuit, and the like are prevented. The cushion 258 is also an antistatic member. Although the support base 258 for holding the support pins 254 is illustrated integrally, a plurality of members are actually assembled. A ball storage chamber 260 is provided in the support base 258, and the plurality of support pins 254 pass through the ball reception chamber 260 in the fitting holes 264 and the through holes 266 provided in the support base 258. The upper end portion of the support base 258 protrudes upward from the support base 258 so as to be movable in the longitudinal direction.
[0048]
The support pin 254 is urged in a direction protruding upward from the support base 258 by a compression coil spring (hereinafter abbreviated as a spring) 268 which is a kind of elastic member disposed in the fitting hole 264. . The movement limit of the support pin 254 by the bias of the spring 268 is defined by the stopper plate 270 provided as a stopper provided on the support pin 254 coming into contact with the shoulder surface 272 of the fitting hole 264. In this state, the plurality of support pins 254 are positioned at the ascending end position, and the support surfaces 256 are maintained in a single horizontal plane by the bias of the spring 268. The spring constant of the spring 268 and the preload are small, and are large enough to allow the support pin 254 contacting the electronic circuit component C to move backward toward the support base 258, and the support pin 254 is moved by the movement blocking device. It is set to a size sufficient to keep the electronic circuit component C or the back surface 36 in contact until it is blocked. In the present embodiment, the spring 268 and the stopper plate 270 constitute the holding device 274. Further, the fitting hole 264 is released to the atmosphere by the passage 276.
[0049]
One end of a bag-like body 280 made of a flexible material is airtightly fixed to a portion of each of the plurality of support pins 254 located in the ball housing chamber 260. The other end portion of the bag-like body 280 is airtightly fixed to the base 260, and a plurality of balls 282 serving as restraints are accommodated in the bag-like body 280. The plurality of spheres 282 are brought into contact with the support pins 254 with a weak force, are also brought into contact with each other, and are accommodated in a state where two or more layers are overlapped. The space in the bag-like body 280 is connected to a negative pressure source (not shown) by a negative pressure supply path 284 formed in the base 260.
[0050]
Therefore, if a negative pressure is supplied into the bag-like body 280 and the inside of the bag-like body 280 is brought into a negative pressure state, the bag-like body 280 is sucked and squeezed to tighten the sphere 282 so that they cannot be moved relative to each other. At the same time, it is brought into strong contact with the support pin 254 and restrains its longitudinal movement. A restraint state is realized. If the supply of negative pressure to the bag-like body 280 is cut off and released to the atmosphere and the inside is released from the negative pressure, the balls 282 come into contact with each other and come into contact with the support pins 254. Becomes weak, does not restrain the support pin 254, and allows its movement in the longitudinal direction. An unconstrained state is realized. In the present embodiment, an electromagnetic control valve (not shown) and a control device (not shown) that controls the electromagnetic control valve and controls the supply and shut-off of negative pressure to the bag-like body 280 are the pressure change device. And a restraint / unconstrained state realization device is constructed together with the bag-like body 280, and a movement blocking device 286 is constructed together with the ball 282.
[0051]
When the substrate support device 250 supports the printed circuit board, an unconstrained state is realized, and the support pins 254 are movable in the longitudinal direction. Then, the support pin device 252 is raised. First, among the plurality of support pins 254, the support pin 254 corresponding to the electronic circuit component fixed to the back surface of the printed circuit board comes into contact with the electronic circuit component, and the printed circuit board. And press against the circuit board retainer not shown. When the support pin device 252 is further raised, the support pin 254 abutting against the back surface 36 compresses the spring 266 and retracts to the support base 258 side, and corresponds to a portion where there is no electronic circuit component on the back surface of the printed circuit board. Support pins 254 abut the printed circuit board.
[0052]
If the plurality of support pins 254 follow the back surface of the printed circuit board and support the printed circuit board from below, negative pressure is supplied into the bag-like body 280 and the support pins 254 are restrained by the balls 282. The printed circuit board is firmly supported from the back surface side by the support pins 254 while being prevented from moving in the longitudinal direction. If necessary, a clamp device for clamping the printed circuit board 30 to the substrate support device 240 is provided. When the printed circuit board is re-supported by the support pin 254 due to a change in the type of the printed circuit board, the supply of negative pressure into the bag-like body 280 is cut off, and the support pin 254 moves in the longitudinal direction. Permissible.
The bag-like body may be shared by a plurality of support pins.
[0053]
In the embodiment, the support pin 90 is made of a nonmagnetic material, but is preferably made of a magnetic material. When the sphere 152 is magnetized, the support pin 90 is also magnetized to attract the sphere 152, and the sphere 152 is brought into contact with the support pin 90 with a stronger force, so that the longitudinal movement of the support pin 90 is more firmly prevented. This is because that. In this case, it is desirable that the vicinity of the support surface 140 is made of a nonmagnetic material so that the magnetic force does not directly act on the electronic circuit component.
[0054]
In addition, even when the substrate support device continuously supports the same type of circuit board, the support member is prevented from moving by the movement blocking device for each circuit board, and the support member supports the circuit board. Alternatively, the circuit board may be re-supported by releasing the blocking of the support member for each set number.
[0055]
Furthermore, in the above-described embodiment, the printed circuit board 30 is brought into contact with the board pressing plate 160 and is supported by the support pins 90 and 254 in a horizontal posture. One plane is accurately obtained, and screen printing can be performed with high accuracy. However, it is not essential to provide a board pressing member when the circuit board is not required to be flat with high accuracy, or when the circuit board has a high rigidity and does not warp, and may be omitted. Good.
[0056]
In each of the above embodiments, the case where the printed circuit board having the electronic circuit component fixed to the back surface is supported has been described. However, it is not essential that the electronic circuit component is fixed to the back surface of the circuit board. You may make a board | substrate support apparatus support the circuit board only by which the electronic circuit component is temporarily fixed to the back surface by the adhesive agent or cream-like solder from the back surface side. In this case, the suction member 142 and the cushion 257, which are provided with antistatic measures that constitute the vicinity of the support surface, also serve to prevent electronic circuit components from adhering to the support member due to static electricity and falling off the circuit board. .
[0057]
Further, in the above embodiment, the support pins 90 are moved up and down with respect to the printed circuit board 30 to support them. However, the circuit board is moved in the direction of approaching and separating from the support member to support the circuit board. You may make it support.
Further, the support pins 90 and the printed circuit board 30 can be moved relative to each other in the vertical direction, but they are moved relative to each other in a direction inclined with respect to the vertical direction to place the circuit board on the support member. The present invention can also be applied to support.
[0058]
In the embodiment shown in FIGS. 1 to 3, the ball storage chamber may be provided separately for each of the plurality of support pins, and the ball may be stored in each of the ball storage chambers.
[0059]
Furthermore, this invention can be implemented in the aspect which combined each characteristic of each said embodiment. For example, movement of the non-adsorption type support member is blocked by the movement blocking device 158, and movement of the adsorption type support member is blocked by the movement blocking device 286.
[0060]
Further, both edge portions of the circuit board may be restrained so as not to move at least upward by the side restraint device.
[0061]
Furthermore, the present invention is not limited to the support of the circuit board when cream-like solder is printed on the circuit board, but the operation of an apparatus for applying an adhesive to the circuit board by a dispenser, an apparatus for mounting an electronic circuit component on the circuit board, etc. The present invention can be applied to an apparatus that supports a circuit board when performing some work on the board surface of the circuit board by the apparatus, or when inspecting a circuit formed on the circuit board by a circuit inspection apparatus.
[0062]
In addition, the present invention can be implemented in various modifications and improvements based on the knowledge of those skilled in the art without departing from the scope of the claims.
[Brief description of the drawings]
FIG. 1 is a front view schematically showing a screen printer provided with a substrate support apparatus according to an embodiment of the present invention.
FIG. 2 is a front view (partially sectional view) showing the substrate support apparatus;
FIG. 3 is an enlarged front view (partial cross section) showing a main part of a support pin device of the substrate support device.
FIG. 4 is an enlarged front view (partially cross-sectional view) showing a main part of a substrate supporting apparatus according to another embodiment of the present invention.
[Explanation of symbols]
16: Board support device 30: Printed circuit board 60: Circuit board lifting device 62: Support pin device 90: Support pin 92: Support base 130: Piston 134: Positive pressure chamber 138: Holding device 140: Support surface 152: Ball 160: Circuit board holding plate 200: Control device 250: Substrate support device 254: Support pin 256: Support surface 258: Support table 260: Ball housing chamber 268: Spring 270: Stopper plate 274: Holding device 280: Bag-shaped body 282: Ball 286 : Movement prevention device

Claims (5)

内部に拘束体収容室を備えた支持台と、
前記拘束体収容室を貫通して前記支持台の上方および下方へ突出し、かつ、支持台に長手方向に移動可能に嵌合された複数の支持部材と、
それら支持部材を、各支持部材の上端に形成された支持面が予め定められた面内に位置する状態に保つとともに、各支持部材に下方へ押し戻す向きの力が加えられた場合には支持部材の下方への後退を許容する保持装置と、
前記支持部材の各々の前記支持台に対する長手方向の相対移動を阻止する移動阻止装置と
を含み、回路基板を裏面側から支持する回路基板支持装置において、
前記移動阻止装置を、
前記拘束体収容室内に前記複数の支持部材の各々に接触するとともに互いにも接触する状態で２層以上に重なり合って収容された多数の拘束体と、
それら拘束体が前記複数の支持部材の各々に強く接触するとともに互いにも強く接触し、互いに相対移動不能に拘束し合うとともに各支持部材の前記長手方向の移動を拘束する拘束状態と、各支持部材に弱い力で接触するとともに互いにも弱い力で接触し、支持部材の前記長手方向の移動を許容する非拘束状態とを選択的に実現する拘束・非拘束状態実現装置と
を含むものとしたことを特徴とする回路基板支持装置。 A support base with a restraint housing chamber inside ;
The projecting through the restraint accommodating chamber upward and downward of the support base and a plurality of support members movably fitted in the longitudinal direction to the support,
The support members are maintained in a state in which the support surface formed at the upper end of each support member is positioned within a predetermined plane, and when a force is applied to the support members in a downward direction, the support members are applied. A holding device that allows retraction of
In the circuit board support device for supporting the circuit board from the back side, including a movement prevention device for preventing the relative movement of each of the support members relative to the support base in the longitudinal direction,
The movement blocking device;
A plurality of restraining bodies accommodated in two or more layers in contact with each of the plurality of support members and in contact with each other in the restraining body accommodation chamber ;
A restraint state in which the restraining bodies are in strong contact with each of the plurality of support members and are also in strong contact with each other, restraining each other so that they cannot move relative to each other, and restraining the movement of each support member in the longitudinal direction; the contacts with a weak have power contacts by a weak force to each other, and intended to include said longitudinal selectively implemented restrained and non-constrained state implementation device and an unconstrained to permit movement of the support member A circuit board support device. 前記複数の拘束体の各々が球形である請求項１に記載の回路基板支持装置。The circuit board support device according to claim 1, wherein each of the plurality of restraining bodies is spherical. 前記複数の拘束体の各々が磁性材料から成り、かつ、前記拘束・非拘束状態実現装置が、前記拘束体を磁化する磁化装置を含む請求項１または２に記載の回路基板支持装置。3. The circuit board support device according to claim 1, wherein each of the plurality of restraints is made of a magnetic material , and the restraint / unconstraint state realization device includes a magnetizing device that magnetizes the restraint. 前記支持部材の先端部が非磁性材料から成り、前記拘束体収容室を貫通する部分が磁性材料から成る請求項３に記載の回路基板支持装置。The circuit board support device according to claim 3, wherein a tip portion of the support member is made of a nonmagnetic material, and a portion penetrating the restraint body accommodation chamber is made of a magnetic material. 前記拘束・非拘束状態実現装置が、前記多数の拘束体を気密に内包する袋状体と、その袋状体の内部を負圧状態と負圧解除状態とに変更する圧力変更装置とを含む請求項１または２に記載の回路基板支持装置。The restraint / unconstrained state realization device includes a bag-like body that contains the numerous restraints in an airtight manner, and a pressure changing device that changes the inside of the bag-like body between a negative pressure state and a negative pressure release state. The circuit board support device according to claim 1 or 2.
JP2002262997A 2002-09-09 2002-09-09 Circuit board support device Expired - Lifetime JP4100670B2 (en)

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JP2007185919A (en) * 2006-01-16 2007-07-26 Sharp Corp Surface plate for printing
JP5643540B2 (en) * 2010-05-12 2014-12-17 富士機械製造株式会社 Screen printing machine
JP7134910B2 (en) * 2019-04-09 2022-09-12 ヤマハ発動機株式会社 Substrate supporting device and substrate working device
CN116476524B (en) * 2023-04-20 2023-10-10 东台世恒机械科技有限公司 Gilding press of inside and outside layer printing of carton
CN116748783B (en) * 2023-08-17 2023-11-07 北京三重华星电子科技有限公司 Welding frame for circuit board

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