JPH0974128A - Vacuum suction hand for ic package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to stop vacuum suction and carrying operation in a vacuum hand for an IC package when an error occurs in suction, by detecting the IC package remaining in a carrying jig. SOLUTION: A supporting axle 6 is supported vertically to a part of a moving arm 5 in a way that the supporting axle 6 can be slid vertically. The supporting axle 6 has a displacement measuring detector 13 for detecting a quantity of vertical displacement of the supporting axle 6 when an IC package 9 is sucked by vacuum force. If a detected quantity of displacement is larger than a normal level, a vacuum sucking state of a sucking pad 10 for the IC package is stopped. Even when the IC package 9 remains in the carrying jig 8 at an error in sucking, the remaining state is detected and the vacuum sucking and the carrying operation can be stopped.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a horizontal transfer handler which is used in a final inspection process of an IC manufacturing process and which delivers an IC package to be inspected to a test position.
A vacuum suction hand of an IC package for refilling a C package between a tray and a transfer jig in a loader section and an unloader section, especially when an IC package remains in the transfer jig due to occurrence of a suction error. The present invention relates to an IC package vacuum suction hand capable of detecting the residual and stopping the vacuum suction and transfer.

[0002]

2. Description of the Related Art A horizontal transfer handler is used in a final inspection process of an IC manufacturing process to deliver an IC package to be inspected to a test position. As shown in FIG. 4, a tray on which a large number of IC packages are arranged is arranged. The loader unit 1 for taking out the IC package from the package and refilling it with a transfer jig
And a first inspection unit 2 and a second inspection unit 3 for connecting the conveyance jig conveyed from the loader unit 1 to a test board for testing, and conveyed from these inspection units 2 and 3. Each IC package is taken out from the carrying jig and classified into good products and defective products according to the above test results, and the unloader unit 4 is provided to refill the tray. The loader unit 1 and the unloader unit 4 are provided with a vacuum suction hand that suctions and picks up the IC package.

In the vacuum suction hand, the loader section 1 and the unloader section 4 refill the IC packages between the tray and the transfer jig. As shown in FIG. A motion arm 5 connected to the Z robot,
A support shaft 6 vertically supported by a part of the operation arm 5 and a vacuum pipe 7 provided at the lower end of the support shaft 6 are connected to vacuum the IC package 9 on the upper surface of the transfer jig 8 or the tray. The IC package 9 that has a suction pad 10 that suctions is transferred from the transfer jig 8 to a predetermined location. In addition, in FIG.
Reference numeral 11 denotes a plurality of ICs arranged on the upper surface of the carrying jig 8.
The open top socket for mounting and carrying the package 9 is shown. In FIG. 5, for example, the IC package 9 after the test is completed is sucked by the vacuum suction hand 12 from the open top socket 11 by the unloader unit 4 and is withdrawn, and is classified into a predetermined tray according to the test result of good or bad. It shows the state of moving.

[0004]

However, in such a conventional vacuum suction hand 12 of an IC package,
Since the loader unit 1 or the unloader unit 4 does not have a means for detecting the presence or absence of the IC package 9 on the carrying jig 8, the defect due to the IC package 9 remaining may occur. That is, for example, in the unloader unit 4, when the IC package 9 after the test in the first inspection unit 2 and the second inspection unit 3 in the preceding stage is vacuum-sucked by the vacuum suction hand 12 and pulled out from the transport jig 8, When a suction error occurs, the IC package 9 remains in the open top socket 11 of the carrying jig 8. On the other hand, the operator may find it and remove the remaining IC package 9, but if this is not done reliably, the IC package 9 remains. Alternatively, when the sensitivity adjustment of the vacuum sensor of the vacuum suction hand 12 is defective, the suction pad 10 is
The package 9 cannot be adsorbed, and the IC package 9 remains in the open top socket 11 as described above.

Here, in the horizontal transfer handler shown in FIG. 4, since the transfer jig 8 is adapted to be circulated in the apparatus and used repeatedly, the transfer jig 8 is placed on the transfer jig 8 in the unloader section 4. When the IC package 9 remains, the transfer jig 8 remains with the IC package 9 remaining.
Returns to the loader unit 1 for the next use. However,
In the loader unit 1, a specific open top socket 1
It is not known that the IC package 9 remains in the package 1, and the next IC package 9 to be inspected is also stacked on the remaining package to form two layers (see FIG. 3). Then, as it is, the transfer jig 8 is transferred to the first inspection unit 2 and the second inspection unit 3 shown in FIG. 4, a test is performed, and the transfer jig 8 after the test is transferred to the unloader unit 4. In the unloader unit 4, the good product and the bad product are classified according to the test result and refilled in the tray in the same manner as described above.

However, at the portion of the open top socket 11 of the carrying jig 8 where the residual package is located, the residual package located below is tested, but the IC package 9 placed on top of it is tested. Has not been tested. However, the unloader unit 4
In (1), according to the test result of the residual package located below, the good or defective of the IC package 9 located above it is classified and transferred to a predetermined tray. Therefore, if the test result of the residual package is a non-defective product, even if the IC package 9 located thereabove is a defective product, it is classified as a non-defective product and transferred to that tray. As a result, erroneous classification may occur in the processing of the IC package 9 after the test in the unloader unit 4. As a result, the quality of subsequent IC products may vary.

Therefore, the present invention addresses such a problem, and when the IC package remains in the carrying jig due to a suction error or the like, the residual is detected and the vacuum suction and transfer are stopped. It is an object of the present invention to provide a vacuum suction hand of an IC package which can be manufactured.

[0008]

In order to achieve the above object, a vacuum suction hand of an IC package according to the present invention is
An operating arm connected to the XYZ robot, a supporting shaft vertically supported by a part of the operating arm, a vacuum pipe connected to a lower end of the supporting shaft, and connected to a tray or a transfer arm. In a vacuum suction hand of an IC package, which has a suction pad for vacuum-sucking the IC package on the upper surface of the tool and transfers the vacuum-sucked IC package from a transfer jig to a predetermined location, the support shaft is part of an operating arm. Is supported slidably in the vertical direction, and a displacement amount detector for detecting the vertical displacement amount of the support shaft when vacuum-sucking the IC package is provided on a part of the support shaft. The vacuum suction of the IC package by the suction pad is stopped when the container detects a larger displacement than usual.

In the displacement detector, a slit plate, which is connected to the support shaft and has a light passage hole, is provided between the light emitting portion and the light receiving portion provided on the same axis line. This is a photoelectric switch that operates by movement.

Further, the displacement amount detector may be a micro switch provided on the support shaft and operated by moving the support shaft by a predetermined amount or more.

[0011]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 shows I according to the invention.
It is a perspective explanatory view showing an embodiment of a vacuum suction hand of a C package. Vacuum suction hand of this IC package 1
2'is a horizontal transfer handler that is used in the final inspection process of the IC manufacturing process and transfers the IC package to be inspected to the test position. The IC package is packed between the tray and the transfer jig in the loader section and the unloader section. As shown in FIG. 1, it has a movement arm 5, a support shaft 6, and a suction pad 10, and further includes a displacement detector 13. First, the horizontal transfer handler includes a loader unit 1 and a first inspection unit 2 as shown in FIG.
And a second inspection unit 3 and an unloader unit 4. The loader unit 1 and the unloader unit 4 are provided with a vacuum suction hand 12 'for sucking and picking up the IC package.

The operation arm 5 is a vacuum suction hand 1
It serves as a member for moving the entire 2'to the front, back, left, right, and up and down, and is formed in a substantially L shape in a side view, and its vertical piece is connected to an XYZ robot (not shown). A support shaft 6 is provided on a part of the operating arm 5. The support shaft 6 supports a suction pad 10 which will be described later, and is vertically fixed to the horizontal piece 14 of the operating arm 5 by being screwed. Further, a suction pad 10 is provided at the lower end of the support shaft 6. This suction pad 10
The IC package 9 is vacuum-sucked by the upper surface of the transfer jig 8 or a tray (not shown). The IC package 9 is communicated with the vacuum pipe 7 connected to the lower portion of the support shaft 6, and the IC is sucked by the vacuum suction force from the vacuum pipe 7. The package 9 is sucked. In FIG. 1, reference numeral 11 denotes an open top socket arranged on the upper surface of the carrying jig 8 for mounting and carrying the IC packages 9.

Here, in the present invention, the support shaft 6 is used.
Is supported by a part of the operating arm 5 so as to be slidable in the vertical direction, and a displacement amount detector 13 is provided on a part of the support shaft 6.
Is provided. As shown in FIG. 2, the slide structure of the support shaft 6 penetrates the horizontal piece 14 of the operating arm 5 in the vertical direction, and a spring is interposed in this penetrating portion so that the support shaft 6 is always downward. It is biased and screwed by the action of this spring so that it can slide vertically.

The displacement amount detector 13 detects the amount of vertical displacement of the support shaft 6 when the IC package 9 is vacuum-sucked, and as shown in FIG. The light emitting portion 15 provided on the same horizontal axis in
A slit plate 18 that is connected to the upper end of the support shaft 6 and has a light passage hole 17 (see FIG. 2) is provided between the light receiving unit 16 and the light receiving unit 16, and the slit plate 18 operates by moving the slit plate 18 in the vertical direction. It is configured as a photoelectric switch. The light emitting section 15 is formed of a light emitting element such as a light emitting diode, and the light receiving section 16 is formed of a light receiving element such as a phototransistor, and the light beam emitted from the light emitting section 15 is incident on the light receiving section 16. . As shown in FIG. 2, a circular or elliptical light passage hole 17 is formed in the upper end portion of the slit plate 18, and the light passage hole 17 is formed in a normal state in which the support shaft 6 extends downward. The light beam from the light emitting unit 15 is located between the light emitting unit 15 and the light receiving unit 16 and passes through the light passage hole 17 to enter the light receiving unit 16. Then, the vertical movement of the support shaft 6 causes the slit plate 18 to move up and down,
The light beam traveling from the light emitting portion 15 to the light receiving portion 16 due to the displacement of the light passage hole 17 is blocked, and a light blocking signal is output. This acts as a photoelectric switch.

Next, the operation of the vacuum suction hand 12 'of the IC package thus constructed will be described with reference to FIGS. 2 and 3 show a state in which, for example, the unloader unit 4 sucks the IC package 9 after completion of the test from the open top socket 11 of the carrying jig 8 and pulls it out. First, FIG. 2 shows a normal state in which only one IC package 9 tested this time is mounted in the open top socket 11. In this case, by the movement control of the XYZ robot to which the operation arm 5 is connected, the entire vacuum suction hand 12 'moves above the target open top socket 11 and is stopped. In this state, the support shaft 6 of the vacuum suction hand 12 'slides downward as indicated by an arrow A by the urging force of the spring interposed inside. The slit plate 18 also moves downward together with the support shaft 6,
The light passage hole 17 shown in FIG. 2 is located between the light emitting portion 15 and the light receiving portion 16, and the displacement amount detector 13 is in a light transmitting state.

Next, the movement arm 5 is lowered by the movement control of the XYZ robot as shown by an arrow B,
The entire vacuum suction hand 12 'is lowered by a predetermined amount toward the target open top socket 11. Then, in the vacuum suction hand 12 ', the suction pad 10 at the lower end of the vacuum suction hand 12' is lowered by a predetermined amount, and the IC package 9 is held.
Contact the upper surface of and start vacuum adsorption. At this time, the position of the light passage hole 17 of the slit plate 18 remains the same as before, the displacement detector 13 is in the light passing state, and it is determined that there is no residual package from the previous time. Therefore, the vacuum suction hand 12 'continues vacuum suction, vacuum-sucks and extracts the IC package 9 as shown in FIG. 1, sorts the IC packages 9 according to the test result of non-defective product or defective product, and transfers them to a predetermined tray.

Next, as shown in FIG. 3, there is a residual package 9a in the open top socket 11 which has not been extracted due to the occurrence of a suction error after the previous test, and another IC package 9b for the present test is further provided thereon. An abnormal state is shown in which two layers are stacked and mounted. In this case, the XY-
By the movement control of the Z robot, the operating arm 5 is lowered as shown by the arrow B, and when the entire vacuum suction hand 12 'is lowered toward the intended open top socket 11, a predetermined amount is obtained, as shown in FIG. And IC package 9
Since the a and 9b are stacked in two stages, the suction pad 10 at the lower end comes into contact with the upper surface of the package at a higher position than that shown in FIG. Will be slid upwards.

As a result, the slit plate 18 also moves upward, and the position of the light passage hole 17 of the slit plate 18 shifts upward, as shown in FIG. As a result, the light emitting unit 15
From the slit plate 18
Is blocked by the plate material, and a light blocking signal is output. Based on the output of this light-shielding signal, it is determined that there is a residual package 9a from the previous time, and the vacuum suction hand 1
The vacuum suction of the IC package 9b by 2'is stopped and the operation of the apparatus is stopped. In this state, the worker
The residual package 9a and the IC package 9b placed on the residual package 9a are removed manually from the open top socket 11 of the corresponding transport jig 8. Therefore, it is possible to prevent erroneous classification in which a defective product is transferred to a predetermined position as a non-defective product. After that, by restarting the apparatus, the transport jig 8 from which the residual package 9a is removed returns to the unloader unit 4 and is circulated to the loader unit 1 for use.

Although not shown in the drawing, as the displacement detector 13, a micro switch that is turned on / off by moving the support shaft 6 in the vertical direction by a predetermined amount or more on the support shaft 6 shown in FIG. Provided, turn on this micro switch,
IC package 9 by suction pad 10 by off operation
The vacuum suction of may be stopped. Alternatively,
The displacement amount detector 13 may be formed by using other detection means as long as it detects the amount of vertical displacement of the support shaft 6 when the IC package 9 is vacuum-sucked to perform on / off operation.

[0020]

Since the present invention is constructed as described above,
A support shaft is slidably supported in a vertical direction on a part of the operating arm, and a displacement amount detection is performed to detect a vertical displacement amount of the support shaft when the IC package is vacuum-sucked to a part of the support shaft. If a displacement detector detects a larger displacement than usual, a suction pad
Since the vacuum suction of the C package is stopped, when the IC package remains in the carrying jig due to occurrence of a suction error or the like, it is possible to detect the residual and stop the vacuum suction and transfer. Therefore, unlike the prior art, it is possible to prevent the IC packages on the residual packages from being adsorbed and classified while the residual packages are present, and it is possible to prevent erroneous classification in which a defective product is transferred to a predetermined position as a good product. From this, it is possible to prevent variations in the quality of IC products thereafter.

[Brief description of drawings]

FIG. 1 is a perspective explanatory view showing an embodiment of a vacuum suction hand of an IC package according to the present invention.

FIG. 2 is a front explanatory view showing the operation of the vacuum suction hand of the IC package, showing a normal state in which only one IC package tested this time is mounted in the open top socket of the transfer jig. .

FIG. 3 is also a front explanatory view showing the operation of the vacuum suction hand of the IC package, in which the residual package after the previous test and the other IC package for this test are in two stages in the open top socket of the transfer jig. The abnormal state mounted in layers is shown.

FIG. 4 is a perspective explanatory view showing an overall configuration of a horizontal transfer handler.

FIG. 5 is an explanatory perspective view showing a vacuum suction hand of a conventional IC package.

[Explanation of Codes] 5 ... Operation Arm 6 ... Support Shaft 7 ... Vacuum Piping 8 ... Transfer Jig 9, 9b ... IC Package 9a ... Residual Package 10 ... Suction Pad 11 ... Open Top Socket 12 '... Vacuum Suction Hand 13 ... Displacement Quantity detector 15 ... Light emitting part 16 ... Light receiving part 17 ... Light passing hole 18 ... Slit plate

Claims (3)

[Claims] 1. An operating arm connected to an XYZ robot, a support shaft vertically supported by a part of the operating arm, and a vacuum pipe connected to a lower end of the support shaft and connected thereto. And a suction pad for vacuum-sucking the IC package on the upper surface of the tray or the transfer jig, and in the vacuum suction hand of the IC package for transferring the vacuum-sucked IC package from the transfer jig to a predetermined location, A part of the operating arm is slidably supported in the vertical direction, and a part of this support shaft is provided with a displacement amount detector for detecting the vertical displacement amount of the support shaft when the IC package is vacuum-sucked. , If this displacement amount detector detects a displacement amount larger than usual, it will be IC by the above suction pad.
A vacuum suction hand for an IC package, characterized in that the vacuum suction of the package is stopped. 2. The displacement detector is provided with a slit plate, which is connected to the support shaft and has a light passage hole, between a light emitting portion and a light receiving portion provided on the same axis line. The vacuum suction hand for an IC package according to claim 1, wherein the photoelectric switch is operated by movement. 3. The I according to claim 1, wherein the displacement detector is a microswitch provided on the support shaft and operated by moving the support shaft by a predetermined amount or more.
Vacuum suction hand for C package.