JP2009145153A - Electronic component testing apparatus and electronic component testing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component testing apparatus and an electronic component testing method which can detect an electronic component that remain in the inside, or in the vicinity of an inspection socket. <P>SOLUTION: The electronic component test apparatus is provided with the inspection socket 5 in which an electronic component is installed removably, first and second electronic component transfer apparatuses 6, 7 which install/remove an electronic component in/from the inspection socket 5, and component detection apparatuses (a socket imaging apparatus 35 and a controller) for detecting the presence or the absence of an electronic component within a predetermined area including at least the inspection socket 5. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  2. Description of the Related Art Conventionally, as disclosed in, for example, Patent Document 1, an electronic component testing apparatus used for testing an electronic component such as an IC component is provided with an inspection socket on which an electronic component is detachably loaded, and the inspection socket. And an electronic component moving device for loading and unloading the electronic component. The inspection socket is attached to the base of the electronic component testing apparatus so that electronic components can be loaded from above.

The electronic component moving device has a configuration in which a suction head including a suction nozzle for sucking electronic components moves in a horizontal direction and a vertical direction. In this electronic component moving device, an uninspected electronic component is loaded in the inspection socket, and the electronic component after inspection is taken out from the inspection socket and transferred to the component storage unit.
JP 11-333775 A

  However, in the conventional electronic component testing apparatus described above, the next electronic component may be loaded in the inspection socket even though the electronic component remains in the inspection socket or in the vicinity of the periphery of the inspection socket. there were. The reason why the electronic component remains in the inspection socket or in the vicinity of the periphery of the inspection socket in this way is, for example, the electronic component that was being tested because the test was interrupted for some reason when the electronic component was being tested. For example, a test may be started for a new electronic component in a state where is left unattended.

In addition, even if an electronic component comes off from the suction nozzle after the test and falls off, and the device that detects the dropout of the component does not function properly at this time, as described above, the inside of the inspection socket and the vicinity of the periphery The electronic parts are left behind.
As described above, when electronic components remain in or near the inspection socket and the next electronic component is loaded into the inspection socket and the electronic components collide with each other, these electronic components may be damaged, The test socket may be damaged.

Further, when the remaining electronic component is located at the peripheral edge of the inspection socket, the new electronic component is placed on the inspection socket in an inclined state overlapping with the edge of the remaining electronic component. In such a case, a test is performed. However, since the mounting state in the inspection socket is different from that in the normal state, it is impossible to correctly perform the pass / fail judgment.
The present invention has been made to solve such a problem, and provides an electronic component inspection apparatus and an electronic component inspection method capable of detecting that an electronic component remains in an inspection socket and the vicinity thereof. With the goal.

  In order to achieve this object, an electronic component inspection apparatus according to the present invention includes an inspection socket in which an electronic component is detachably loaded, and an electronic component that performs loading and unloading of the electronic component with respect to the inspection socket. An electronic component testing apparatus including a moving device includes a component detection device that detects the presence or absence of an electronic component at least in a predetermined area including the inspection socket.

  The present invention further includes an image pickup device for picking up an image of the inspection socket from above, wherein the component detection device uses the image picked up by the image pickup device to detect presence / absence of an electronic component by image processing. A processing unit is provided.

  The present invention according to the present invention further includes an electronic component collection device for transferring an electronic component detected by the component detection device to a predetermined electronic component storage unit.

  The present invention further includes a notification device that performs a predetermined notification operation when the electronic component detected by the component detection device cannot be recovered by the electronic component recovery device.

  The present invention relates to an electronic component testing method in which an uninspected electronic component is loaded into an inspection socket, and the inspected electronic component is moved to the component storage after the inspection, before the uninspected electronic component is loaded into the inspection socket. In addition, the presence / absence of another electronic component is detected at least in a predetermined area including the inspection socket, and when no other electronic component is detected in this detection step, the electronic component test is started.

  According to the present invention, when an electronic component remains in a predetermined area including the inspection socket, the component detection device detects this. For this reason, according to this invention, it is possible to test an electronic component after confirming that there is no remaining component by the component detection apparatus. As a result, it is possible to reliably prevent the electronic components and the inspection socket from being damaged due to the collision between the electronic components. In addition, since the test is not performed in a state where the inspection electronic component sucked by the suction nozzle and the remaining electronic component interfere with each other, it is possible to prevent erroneous determination of the quality of the electronic component. Can do. Therefore, according to the present invention, it is possible to provide an electronic component testing apparatus that can prevent damage to electronic components and inspection sockets and that can correctly determine whether a test is good or bad.

  According to the invention including an image processing unit that detects presence / absence of an electronic component by image processing, the presence / absence of an electronic component is detected by comparing a normal image with an image when the electronic component remains. Therefore, in addition to detecting whether or not the electronic component remains, the position of the electronic component can be detected. For this reason, according to the present invention, when the electronic component remains, the operator is notified of the position of the electronic component, and whether or not the electronic component can be sucked and removed by the component moving device. Can be determined.

  According to the invention provided with the electronic component recovery device that transfers the electronic component detected by the component detection device to the predetermined electronic component storage unit, the remaining electronic component can be removed, so that the inspection socket and its The electronic component can be tested in a state where no electronic component remains in the vicinity of the periphery.

  According to the invention including the notification device, it is possible to notify the operator that the electronic component remains, so that the electronic component can be tested in a state where the electronic component is removed by the operator.

  According to the method for testing an electronic component according to the present invention, when the electronic component is tested, the electronic component does not remain in the inspection socket and in the vicinity thereof, so the electronic component or the inspection socket is caused by a collision between the electronic components. Can be prevented from being damaged, or the test being performed without electronic components being correctly loaded in the socket for inspection.

(First embodiment)
Hereinafter, an embodiment of an electronic component testing apparatus and an electronic component testing method according to the present invention will be described in detail with reference to FIGS.
1 is a plan view showing the configuration of an electronic component testing apparatus according to the present invention, FIG. 2 is a perspective view of the same, FIG. 3 is a block diagram showing the configuration of a control system of the electronic component testing apparatus according to the present invention, and FIG. It is a flowchart which shows all the processes when testing an electronic component with the electronic component testing apparatus which concerns on invention. FIG. 5 is a flowchart for explaining the operation in the preparatory process before operation, FIG. 6 is a flowchart for explaining the operation at the start of operation, and FIG. 7 is an operation for picking up an electronic component in the inspection socket. It is a flowchart for doing. FIG. 8 is a flowchart for explaining the operation when notifying the operator of the abnormality.

  In these drawings, what is denoted by reference numeral 1 is an electronic component testing apparatus according to this embodiment. As shown in FIGS. 1 and 2, the electronic component testing apparatus 1 includes a base 2, an electronic component testing apparatus main body 3 positioned at the rear end portion (upper end portion in FIG. 1) of the base 2, Between a tray moving device 4 that conveys electronic components together with a tray (not shown) from the front end portion to the central portion of the base 2, and between the tray moving device 4 and a later-described inspection socket 5 of the electronic component testing device main body 3. Are provided with first and second electronic component moving devices 6 and 7 for moving the electronic components, and a control device 8 (see FIG. 3) for controlling the operation of these devices. In the present specification, the vertical direction in FIG. 1 is referred to as the Y direction as the longitudinal direction of the apparatus, the horizontal direction in FIG. 1 is referred to as the X direction as the lateral direction of the apparatus, and the direction orthogonal to the paper surface is simply the Z direction. That's it. The tray moving device 4 and the first and second electronic component moving devices equipped in the electronic component testing apparatus 1 according to this embodiment are described in Japanese Patent Application Laid-Open No. 2006-337053 filed by the applicant of the present application. Is equivalent to

  The electronic component testing apparatus main body 3 includes a test head 3 a facing the opening 2 a formed in the base 2. The test head 3a is provided with four inspection sockets 5 for loading electronic components. These inspection sockets 5 are provided so that two sets of inspection sockets 5 and 5 arranged in the X direction are arranged in the Y direction. The electronic component test / inspection is performed by inputting / outputting an inspection current between the electronic component and the electronic component testing apparatus main body 3 in a state where the electronic component is placed in the inspection socket 5.

  As shown in FIGS. 1 and 2, the tray moving device 4 includes a plurality of stockers 11 to 17 arranged in the X direction at the front end portion of the base 2, and tray transfer located below these stockers 11 to 17. The apparatus 18 includes a tray support device 19 positioned at the center of the base 2 in the front-rear direction, and a relay conveyor 20 positioned between the tray support device 19 and the tray transfer device 18. The tray moving device 4 is controlled by a moving device control unit 21 (see FIG. 3) of the control device 8.

  The stockers 11 to 17 support a large number of trays stacked in the vertical direction, and are configured so that the trays can be taken in and out one by one from a tray inlet / outlet formed at the lower end. In FIG. 2, only the stockers 11 and 17 located at both ends in the X direction are depicted among the plurality of stockers. In FIG. 1, among the stockers 11 to 17, the leftmost stocker 11 is a supply stocker for storing a tray on which a large number of uninspected electronic components are placed, and the stocker 12 is empty. It is a stocker for empty trays for storing trays. The stockers 13 to 17 are storage stockers to which electronic components are distributed according to the test / inspection results.

  Among these stockers 11 to 17, a touch panel display 22 and an input device 25 including an operation keyboard 23 and a mouse 24 are provided in the vicinity of the rightmost stocker 17 in FIG. 1. . Each of the display 22 and the input device 25 is connected to the control device 8.

  The tray transfer device 18 includes two conveyors 18a (see FIG. 2) for supporting the tray, and is provided on the base 2 so as to be movable in the X direction. Further, the tray transfer device 18 can take out the trays downward from the respective stockers 11 to 17 and place them on the conveyor 18a, or raise the tray on the conveyor 18a and store it in the stockers 12 to 17. It is configured as follows. The conveyor 18a of the tray transfer device 18 moves the tray in the Y direction with the relay conveyor 20.

  In this embodiment, the tray support device 19 includes five conveyors 19a to 19e arranged in the X direction, and moves these conveyors 19a to 19e to positions adjacent to the relay conveyor 20 in the Y direction. In FIG. 2, only three conveyors 19a to 19c are illustrated. The tray support device 19 is configured so that the tray can be fixed and positioned on the conveyors 19a to 19e.

  The five conveyors of the tray support device 19 are a conveyor 19a for heating electronic components by a hot plate (not shown) and a conveyor for supporting a tray for uninspected components on which uninspected electronic components are placed. 19b, two conveyors 19c and 19d for supporting an inspected component tray on which electronic components are placed after the test / inspection, and electronic components recovered from and around the inspection socket 5 as described later. There is a conveyor 19e for supporting the collection tray to be placed. The collection tray constitutes a “predetermined electronic component storage portion” as defined in the third aspect of the invention.

  Between the tray support device 19 and the inspection socket 5, a component imaging device 26 for imaging electronic components moved from below by first and second electronic component moving devices 6, 7 described later. Is provided. The component imaging device 26 sends image data obtained by imaging the electronic component to an image processing unit 27 described later of the control device 8.

  The first and second electronic component moving devices 6 and 7 are arranged so as to be symmetric with respect to a center line extending in the Y direction of the base 2. These electronic component moving devices 6 and 7 include a rail support base 31 provided on the base 2 so as to cross the upper side of the tray support device 19 in the Y direction at both ends in the X direction of the base 2, and the rails. A Y direction moving member 32 that moves in the Y direction on the support base 31 and a head unit 33 that moves in the X direction while being supported by the Y direction moving member 32 are configured.

  The head unit 33 is provided with four suction heads 34 and a socket imaging device 35 for imaging a predetermined area including the inspection socket 5 from above. The suction head 34 is provided with a suction nozzle (not shown) for sucking electronic components. The suction nozzle 34 can be moved in the X direction, the Y direction, and the Z direction, and can be moved around the axis in the Z direction. It is comprised so that it can be rotated by.

  The socket imaging device 35 is configured by a line sensor, an area sensor, and the like, and sends captured image data to the image processing unit 27 of the control device 8. The socket imaging device 35 can image one inspection socket 5 and the vicinity of the periphery of the inspection socket 5 by one imaging operation.

As shown in FIG. 3, the control device 8 includes a moving device control unit 21, an image processing unit 27, a test unit 36, a notification unit 37, and the like, and a memory 38 is connected thereto. The memory 38 stores image data, dimension data, and the like of the inspection socket 5 and electronic components.
The moving device control unit 21 controls operations of the tray moving device 4 and the first and second electronic component moving devices 6 and 7.
The image processing unit 27 controls the imaging operation of the component imaging device 26 and the socket imaging device 35, and applies image processing to image data sent from the imaging devices 26 and 35, which will be described later. So get various information.

  The image processing unit 27 detects the position of the electronic component in the X direction and the Y direction, the angle around the axis in the Z direction, and the like based on the image data sent from the component imaging device 26. The moving device control unit 21 loads electronic components into the inspection socket 5 in a state where the position of the suction nozzle, the angle, and the like are corrected based on the detection result of the image processing unit 27.

  Further, the image processing unit 27 determines whether the type of the inspection socket 5 is correct based on the image data sent from the socket imaging device 35 and detects the position of the inspection socket 5. Further, the image processing unit 27 compares the image data (input image) with a normal reference image to determine whether or not electronic components remain in the inspection socket 5 and the vicinity thereof. If the electronic component remains as a result of the determination, it is determined whether or not the electronic component can be taken out by the first or second electronic component moving device 6, 7. In this embodiment, the image processing unit 27 of the control device 8 and the socket image pickup device 35 constitute a component detection device referred to in the present invention.

  When the electronic component remains in the inspection socket 5 and in the vicinity thereof, the moving device control unit 21 takes out the electronic component by the first or second electronic component moving device 6, 7 and collects it. To be transferred to. In this embodiment, the moving device control unit 21 of the control device 8 and the first and second electronic component moving devices 6 and 7 constitute an electronic component collecting device according to the present invention.

The test unit 36 controls the operation of the electronic component testing apparatus main body 3 and causes the electronic component testing apparatus main body 3 to perform various tests and inspections.
The informing unit 37 displays an abnormal content on the display 22 when the electronic components remaining in the inspection socket 5 and in the vicinity thereof cannot be taken out by the first or second electronic component moving devices 6, 7. While displaying, the warning light 39 (refer FIG. 3) is lighted. At the time of this warning, a warning sound can be generated by, for example, a buzzer instead of turning on the warning light 39, or the warning light 39 can be turned on and a warning sound can be generated. In this embodiment, the notification unit 37 of the control device 8, the display 22, the warning lamp 39 (buzzer) and the like constitute the notification device referred to in the present invention.

  Next, the electronic component testing method according to the present invention using the electronic component testing apparatus 11 configured as described above will be described in detail with reference to the flowcharts shown in FIGS. 4 to 8, the electronic component is described as an IC component, and the inspection socket 5 is described as an IC socket.

First, the outline of the operation from the start of operation to the end of operation of the electronic component test apparatus 11 will be described with reference to FIG. The electronic component testing apparatus 11 operates as described in steps 401 to S411 of the flowchart shown in FIG.
In step S401, preparation before operation is performed. In the preparatory step before this operation, various preparatory operations described in S501 to S504 of the flowchart shown in FIG. 5 are performed.
In step S501, image processing data for the inspection socket 5 is created. As this data, for example, there is dimensional data for each type of inspection socket 5.
In step S <b> 502, the reference image of the inspection socket 5 is picked up by the socket image pickup device 35 and stored in the memory 38 with no electronic components remaining in or near the inspection socket 5.

In step S503, image processing data for the electronic component is created. Examples of this data include numerical data and image data indicating the outer shape of the electronic component. Here, image processing data for all usable electronic components is created.
In step S504, a tray (collection tray on the conveyor 19e) as a collection destination when the electronic component is collected from the inspection socket 5 side is designated.
Thus, after implementing to step S504, a driving | operation is started (step S505).

  As shown in step S402 of the flowchart shown in FIG. 4, the electronic component testing apparatus 11 starts operation when the start switch is turned on, and sequentially performs various operations described in the next steps S403 to S411. . The start switch is constituted by the keyboard 23. The operations performed in step 402 to step 408 will be outlined here in order to be described in detail later using the flowcharts shown in FIGS.

In step S <b> 403, the socket for inspection 5 is imaged by the socket imaging device 35.
In step S404, the presence / absence of the inspection socket 5 and a mistake are confirmed based on the image data.
In step S405, the amount of displacement of the inspection socket 5 is measured.
In step S406, it is confirmed whether or not an electronic component remains in the inspection socket 5.

In step S407, when the electronic component remains in the inspection socket 5, the position of the electronic component is measured.
In step S408, the electronic components are transferred to a predetermined tray (collection tray) by the first or second electronic component moving device 6, 7. After proceeding to step S408, no electronic components remain in the inspection socket 5 and in the vicinity thereof.

In step S409, a test operation (production operation) is started.
In step S410, first, a tray on which uninspected electronic components are placed is transported from the supply stocker 11 to the component supply conveyors 19a and 19b of the tray support device 19 by the tray transfer device 18 and the relay conveyor 20. Note that an empty tray for storing the electronic components after the inspection is placed in advance on the other conveyor of the tray support device 19. Thereafter, uninspected electronic components stored in the tray on the tray support device 19 are loaded into the inspection socket 5 by the first and second electronic component moving devices 6 and 7, and the electronic components are tested and inspected. Do.

  After the test / inspection is completed, the electronic component is transferred to the tray on the tray support device 19 by the first and second electronic component moving devices 6 and 7. At this time, the electronic components are transferred to a predetermined tray (a tray on the conveyors 19c and 19d) so as to be classified according to the test / inspection result. When the electronic component is removed from the suction nozzle when the electronic component is pulled up from the inspection socket 5 after the test or inspection is completed, the detected value of the pressure gauge (not shown) connected to the suction nozzle is normal. Therefore, it is possible to detect that the electronic component has dropped out. In this case, the control device 8 displays on the display 22 that the electronic component has dropped off, lights up the warning lamp 39, and waits until the operator performs a stop operation or a switch operation to continue the operation.

  In step S411, the test / inspection operation is terminated when the electronic component is tested / inspected a predetermined number of times (when the lot end is reached). Thereafter, all the electronic components on the tray support device 19 are transported to the storage stockers 13 to 17 together with the tray, thereby completing the operation (step S412).

Next, the operation from step S402 (operation start) to step S408 (collected parts are stored in a tray) will be described with reference to FIGS.
As shown in step S601 of the flowchart shown in FIG. 6, after the start switch is turned on, the first inspection socket 5 is imaged by the socket imaging device 35 in step S602.

  In step S603, the control device 8 determines whether or not the first inspection socket 5 is correct and whether or not the first inspection socket 5 is correct based on the image data obtained by the imaging. Determine. Here, there is no inspection socket 5, that is, the first inspection socket 5 is not attached to the test head 3a, or a different type of inspection socket 5 is attached even if it is attached. In this case, the process proceeds to step S604, and the control device 8 stops the operation of the electronic component testing device 11.

  On the other hand, if it is determined in step S603 that the first inspection socket 5 is correctly attached, the process proceeds to step S605, and the first image data that has been previously captured and stored with the above-described imaging data (input image). Are compared with the reference image of the inspection socket 5, and it is determined whether or not they are the same. If they are the same, in step S606, the position of the first inspection socket 5 is detected based on the input image.

  According to the electronic component testing apparatus 11 of this embodiment, the position of the electronic component when the electronic component is loaded into the inspection socket 5 is corrected based on the position of the inspection socket 5 detected in step S606. If the input image is different from the reference image, that is, if an electronic component remains in the first inspection socket 5 or in the vicinity thereof for some reason, the process proceeds to step S607 and the remaining electronic The position of the part is detected from the input image. The data at this position is stored in the memory 38.

  Next, in step S608, it is determined whether imaging has been completed for all the inspection sockets 5. If there is an inspection socket 5 that has not been imaged, the process returns to step S602, and the inspection socket 5 is imaged. In this embodiment, the process proceeds from step S608 to step S609 with each of the four inspection sockets 5 being imaged, and after confirming that no electronic components remain in all the inspection sockets 5 In step S610, production (test) is started. If even one of the four inspection sockets 5 has an electronic component remaining, the process proceeds to step S611, and an operation of picking up (removing) the electronic component from the inspection socket 5 is performed.

  As a method for detecting the position of the inspection socket 5, as described above, the image captured by the socket imaging device 35 is automatically analyzed and the operator captures the image captured by the socket imaging device 35. There is so-called socket teaching that is performed while watching. This socket teaching is performed when the operator recognizes the inspection socket 5 on the screen and clicks the four corners of the inspection socket 5 by operating the mouse or the like. When such socket teaching is performed, the control device 8 is configured not to execute the above-described determination step in step S603 and the socket position detection step in step S606.

  The operation of taking out the remaining electronic components is performed as shown in the flowchart of FIG. First, in step S701, it is determined whether or not an electronic component remains in the first inspection socket 5. If the inspection socket 5 in which the electronic parts remain is not the first inspection socket 5, the process proceeds to step S702, and it is determined whether or not all the inspection sockets 5 have been confirmed to have any remaining parts. . Here, if NO, that is, if there is an inspection socket 5 in which the presence / absence of remaining parts is not confirmed, the process returns to step S701.

  If it is determined in step S701 that the electronic component remains, it is determined in step S703 whether or not the electronic component can be taken out by the first and second electronic component moving devices 6 and 7. At this time, the electronic component is taken out when the electronic component is dropped in a place where the suction head 34 cannot move, or when the size of the electronic component on the image data is different from the actual size of the dropped electronic component. If this is not possible, the process proceeds to step S702. On the other hand, if it is possible to take out the electronic component, in step S704, the electronic component is picked up and taken out, and in step S705, the electronic component is transferred to the collection tray and stored.

  After the operation for confirming the presence or absence of the remaining parts is performed for all the inspection sockets 5, the process proceeds from step S <b> 702 to step S <b> 706 to determine whether or not the electronic components have been removed from all the inspection sockets 5. If all the electronic components have been removed, the process proceeds to step S707, and actual operation for testing and inspecting the electronic components is started. On the other hand, if there is an electronic component that has not been removed, the process advances to step S707 to perform an operator call operation.

  This operator call operation is performed as shown in the flowchart of FIG. First, in step S801, input images of all the inspection sockets 5 are displayed on the display 22, and in step S802, contents indicating the remaining parts are displayed and a warning lamp 39 is turned on. For this reason, in this electronic component testing apparatus 11, when the electronic component remaining in the inspection socket 5 or in the vicinity thereof cannot be collected by itself, this can be notified to the operator.

  In a case where the operation can be started, such as when the operator can easily remove the remaining electronic components by hand, the start switch is turned ON by the operator in step S803. Thus, the production (test) operation performed by loading the electronic component into the inspection socket 5 is started (step S804). On the other hand, when the operator operates the stop switch, such as when the remaining electronic components cannot be easily taken out, the control device 8 ends the operation in step S805. Thereafter, the operator removes the remaining electronic components by removing the inspection socket 5 from the test head 3a or removing the test head 3a from the base 2 (step S806).

  Note that in determining the presence or absence of an electronic component, the above-described image processing is not universal, and a foreign object that is not an electronic component may be erroneously recognized as an electronic component. In such a case, the operator visually confirms the image and determines whether or not the part has fallen. At this time, if the component has actually fallen, the operator operates the stop switch to end the operation of the electronic component test apparatus 11. On the other hand, if dust or the like has been erroneously recognized, the operator turns on the start switch to start operation of the electronic component testing apparatus 11.

  Therefore, in the electronic component testing apparatus 11 configured as described above, when an electronic component remains in a predetermined area including the inspection socket 5, the component detection device (the image processing unit 27 and the socket imaging device). Since 35) detects this, it is possible to test the electronic parts after confirming that there are no remaining parts. For this reason, it can prevent reliably that an electronic component and the test | inspection socket 5 are damaged by the collision of electronic components. Moreover, since the test is not performed in a state where the electronic component for inspection adsorbed by the adsorption nozzle and the remaining electronic component interfere with each other, it is possible to prevent erroneous determination of the quality of the electronic component. Can do. Therefore, according to this embodiment, it is possible to provide the electronic component testing apparatus 1 that can prevent the electronic component and the inspection socket 5 from being damaged and can correctly perform the pass / fail judgment of the test / inspection.

  The electronic component testing apparatus 1 according to this embodiment employs a configuration that detects the presence or absence of an electronic component by image processing, and compares a normal image with an image when the electronic component remains. The presence or absence of electronic components can be detected. For this reason, in addition to the detection of whether or not the electronic component remains, the position of the remaining electronic component can also be detected. As a result, according to this embodiment, when the electronic component remains, the operator is notified of the position of the electronic component, or the electronic component is attracted by the first or second electronic component moving device 6, 7. It can also be determined whether or not it can be removed.

  In this embodiment, an electronic component recovery device (moving device) that transfers electronic components detected by a component detection device (image processing unit 27 and socket imaging device 35) to a predetermined electronic component storage unit (collection tray). Since the control unit 21 and the first and second electronic component moving devices 6 and 7) are provided, the electronic component testing apparatus 1 removes the remaining electronic components by itself and tests and inspects the electronic components. Can do.

  Since the electronic device testing apparatus 1 according to this embodiment includes the notification device (the notification unit 37, the display 22, and the warning lamp 39), the operator can be notified that the electronic components remain. For this reason, the electronic component can be tested and inspected with the electronic component removed by the operator.

  According to the method for testing an electronic component according to this embodiment, when the electronic component is tested / inspected, the electronic component does not remain in the inspection socket 5 and in the vicinity thereof. It is possible to prevent the inspection socket 5 from being damaged or the test from being performed without properly loading electronic components into the inspection socket 5. In particular, in this embodiment, the presence / absence of remaining electronic components is detected before the testing / inspection of electronic components, and the presence / absence of remaining components is not detected during the testing / inspection. Can be performed efficiently. The timing for detecting the presence or absence of remaining parts is not limited to before the test / inspection process is performed as shown in this embodiment, and is performed every time the test / inspection is performed a predetermined number of times. be able to.

(Second embodiment)
In the embodiment described above, an example including a tray transfer device and a tray support device for moving the tray in the X direction has been shown. However, the configuration of the tray moving device can be changed as appropriate, for example, the configuration shown in FIG. 9 is adopted. Can do.

FIG. 9 is a plan view showing another embodiment of the electronic component testing apparatus. In the figure, the same or equivalent members as those described with reference to FIGS. 1 to 8 are given the same reference numerals, and detailed description thereof is omitted as appropriate.
The tray moving device 4 of the electronic component testing apparatus 1 shown in FIG. 9 conveys the trays of the four stockers 11 to 14 in the Y direction, and between the stockers 11 to 14 and the component delivery position A on the rear side of the device. The structure to reciprocate is taken. The first and second electronic component moving devices 6 and 7 according to this embodiment are provided with two head units 33, and each of these head units 33 is moved in the X direction, and is in the component delivery position A. An electronic component can be delivered to each tray.
Even if the tray moving device 4 and the electronic component moving devices 6 and 7 are configured as shown in FIG. 9, the same effect can be obtained as in the first embodiment.

It is a top view which shows the structure of the electronic component test apparatus which concerns on this invention. It is a perspective view which shows the structure of the electronic component test apparatus which concerns on this invention. It is a block diagram which shows the structure of the control system of the electronic component test apparatus which concerns on this invention. It is a flowchart which shows all the processes when testing an electronic component with the electronic component testing apparatus which concerns on this invention. It is a flowchart for demonstrating the operation | movement in the preparatory process before a driving | operation. It is a flowchart for demonstrating the operation | movement at the time of a driving | operation start. It is a flowchart for demonstrating operation | movement when picking up the electronic component in the socket for a test | inspection. It is a flowchart for demonstrating operation | movement when notifying an operator of abnormality. It is a top view which shows the other Example of an electronic component test apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Electronic component test apparatus, 2 ... Base, 4 ... Tray movement apparatus, 5 ... Inspection socket, 6, 7 ... 1st, 2nd electronic component movement apparatus, 8 ... Control apparatus, 21 ... Movement apparatus control part , 22 ... display, 27 ... image processing unit, 35 ... imaging device for socket, 37 ... notification unit, 39 ... warning light.

Claims (5)

In an electronic component testing apparatus comprising an inspection socket in which an electronic component is detachably loaded, and an electronic component moving device that loads and removes the electronic component from the inspection socket.
An electronic component testing apparatus, comprising: a component detection device that detects the presence or absence of an electronic component in a predetermined region including at least the inspection socket. The electronic component testing apparatus according to claim 1, further comprising an imaging device that images the inspection socket from above.
The component detection apparatus includes an image processing unit that detects presence / absence of an electronic component by image processing using an image captured by the imaging device.   2. The electronic component test apparatus according to claim 1, further comprising an electronic component recovery device that transfers the electronic component detected by the component detection device to a predetermined electronic component storage unit. .   4. The electronic component testing apparatus according to claim 3, further comprising a notification device that performs a predetermined notification operation when the electronic component detected by the component detection device cannot be recovered by the electronic component recovery device. Electronic component testing equipment. In an electronic component testing method in which an uninspected electronic component is loaded into an inspection socket, and the inspected electronic component is moved to the component storage after the inspection, at least before the uninspected electronic component is loaded into the inspection socket An electronic component test method for detecting the presence or absence of other electronic components in a predetermined area including a socket for a test, and starting an electronic component test when no other electronic components are detected in this detection step .

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