KR0180281B1 - Solder ball installing apparatus for integrated circuit package - Google Patents
Solder ball installing apparatus for integrated circuit package Download PDFInfo
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- KR0180281B1 KR0180281B1 KR1019950047349A KR19950047349A KR0180281B1 KR 0180281 B1 KR0180281 B1 KR 0180281B1 KR 1019950047349 A KR1019950047349 A KR 1019950047349A KR 19950047349 A KR19950047349 A KR 19950047349A KR 0180281 B1 KR0180281 B1 KR 0180281B1
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- solder ball
- seating
- hole
- integrated circuit
- solder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
본 발명은 집적회로패키지의 솔더볼 안착장치에 관한 것으로, 솔더볼보관함에 다수의 솔더볼을 담아놓고 하부로 형성된 안착공과 상·하부안착구의 안착공을 통해 다수의 솔더볼을 집적회로패키지의 솔더볼안착홀에 간단한 방법에 의해 정확하고, 효율적으로 안착시킴으로서 생산성 및 신뢰성을 향상시키도록 된 집적회로패키지의 솔더볼 안착장치이다.The present invention relates to a solder ball seating device of an integrated circuit package, containing a plurality of solder balls in the solder ball storage, and a plurality of solder balls through the seating hole formed in the lower and the upper and lower seating holes in the solder ball seating hole of the integrated circuit package It is a solder ball seating device of an integrated circuit package, which is to improve productivity and reliability by seating accurately and efficiently by the method.
Description
제1도는 본 발명의 집적회로패키지의 솔더볼 설치부를 도시한 배면도.1 is a rear view showing the solder ball mounting portion of the integrated circuit package of the present invention.
제2도의 (a)(b)는 일반적인 솔더볼 설치방법을 도시한 도면.Figure 2 (a) (b) is a view showing a general solder ball installation method.
제3도의 (a)(b)는 본 발명의 솔더볼 안착상태를 도시한 단면도.Figure 3 (a) (b) is a cross-sectional view showing a solder ball seating state of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
10 : 솔더볼안착홀 20 : 솔더볼보관함10: solder ball seating hole 20: solder ball storage box
21 : 상부안착구 22 : 하부안착구21: upper seating 22: lower seating
20a, 21a, 22a : 안착공 2 : 공간부20a, 21a, 22a: seating hole 2: space part
3 : 스프링 5 : 센서3: spring 5: sensor
30 : 솔더볼공급통 31 : 개방부30: solder ball supply container 31: opening
본 발명은 집적회로패키지의 솔더볼 안착장치에 관하 것으로, 더욱 상세하게는 다수의 솔더볼을 한번에 집적회로패키지에 안착시킬 수 있도록 된 집적회로패키지의 솔더볼 안착장치에 관한 것이다.The present invention relates to a solder ball seating device of an integrated circuit package, and more particularly, to a solder ball seating device of an integrated circuit package that can be seated on the integrated circuit package a plurality of solder balls at a time.
일반적으로 집적회로패키지중에 BGA(Ball Grid Array; 볼 그리드 어레이)패키지는 그 배면 에 솔더볼안착홀이 형성되어 있어 솔더볼(Solder Ball)을 안착하고 이를 접속한다. 이때, 솔더볼은 한 패키지당 수백개의 솔더볼안착홀에 안착되어 신호인출단자로 사용된다.In general, a ball grid array (BGA) package in an integrated circuit package has solder ball seating holes formed on the back thereof, and seats and connects a solder ball. At this time, the solder ball is seated in the hundreds of solder ball seating holes per package is used as a signal outgoing terminal.
이러한 BGA패키지는 배면에 다수의 솔더볼안착홀이 있어 솔더볼을 일일이 손으로 하나씩 안착시키거나, 티져(Tweezer)나 핀셋등으로 안착시킨다. 이렇게 함으로서 다수의 솔더볼안착홀에 솔더볼을 안착시키는 데는 작업시간이 많이 소용되어 생산성이 저하되고, 솔더볼을 패키지의 솔더볼안착홀에 정확히 안착시켜야 함으로 수작업을 통한 안착은 많은 불량을 초래하게 되는 문제점이 있었다.The BGA package has a plurality of solder ball seating holes on the back, so that the solder balls can be seated one by one by hand or by a teaser or tweezers. By doing so, it takes a lot of work time to settle the solder balls in a number of solder ball seating holes, resulting in a decrease in productivity. .
따라서, 본 발명은 이와같은 문제점을 해결하기 위해서 발명된 것으로, 솔더볼보관함에 다수의 솔더볼을 담아놓고 하부로 형성된 안착공과 상·하부 안착구의 안착공을 통해 다수의 솔더볼을 패키지의 솔더볼안착홀에 한꺼번에 안착시킴으로서 패키지의 불량을 방지하고, 생산성을 향상시키도록 된 집적회로패키지의 솔더볼 안착장치를 제공함에 그 목적이 있다.Therefore, the present invention has been invented to solve such a problem, and a plurality of solder balls are placed in the solder ball seating hole of the package at a time by placing a plurality of solder balls in the solder ball container and the seating holes formed at the bottom and the seating holes of the upper and lower seating holes. It is an object of the present invention to provide a solder ball seating device for an integrated circuit package to prevent defects of packages and improve productivity.
이러한 본 발명의 목적을 달성하기 위해서는 내부에는 솔더볼을 담을수 있는 공간부를 형성하고, 그 저면에는 다수의 집적회로패키지의 솔더볼안착홀과 동일한 수의 안착공이 형성된 솔더볼보관함과, 상기 솔더볼보관함의 저부에 설치되며 패키지의 솔더볼안착홀과 동일한 수의 안착공이 형성되고, 일측에는 스프링이 설치된 상부안착구와, 상기 상부안착구의 저부에 설치되며 패키지의 솔더볼안착홀과 동일한 수의 안착공이 형성되어 상기 상부안착구의 안착공과 어긋나게 설치된 하부안착구로 구성된 것을 특징으로 하는 집적회로의 솔더볼 안착장치에 의해 가능하다.In order to achieve the object of the present invention, there is formed a space for accommodating solder balls therein, the bottom of the solder ball storage box formed with the same number of mounting holes in the solder ball seating holes of the plurality of integrated circuit packages, and the bottom of the solder ball storage box It is installed and the same number of seating holes are formed in the solder ball seating hole of the package, one side of the spring is installed on the upper seating hole, the bottom of the upper seating hole is installed and the same number of seating holes of the solder ball seating hole of the package are formed It is possible by a solder ball seating device of an integrated circuit, characterized in that the lower seating port is installed to be offset from the seating hole of the seating.
즉, 솔더볼보관함에 다수의 솔더볼이 담겨진 상태에서 솔더볼보관함과 상·하부안착구에 형성된 각각의 안착공이 일치되면서 솔더볼이 패키지의 솔더볼안착홀에 안착되는 것이다.That is, the solder ball is seated in the solder ball seating hole of the package while the solder ball container and the seating holes formed in the solder ball container and the upper and lower seating holes coincide with each other.
이하, 본 발명은 첨부도면을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
제1도는 집적회로패키지중에서 배면에 신호인출단자인 수백개의 솔더볼(4)을 안착시키는 패키지의 솔더볼안착홀(10)을 갖는 BGA패키지(15)를 도시한 것이고, 제2도는 BGA패키지(15)의 솔더볼 안착방법을 도시한 것으로, 도면중 미설명 부호 24는 기판, 25는 솔더마스크이다.FIG. 1 shows a BGA package 15 having solder ball seating holes 10 in a package for seating hundreds of solder balls 4 as signal-out terminals on the back side of an integrated circuit package, and FIG. 2 shows a BGA package 15. The solder ball mounting method of FIG. 1 is shown in the figure, and reference numeral 24 denotes a substrate, and 25 denotes a solder mask.
제3도는 본 발명에 따른 BGA패키지(15)에 솔더볼(4)을 안착시키기 위한 솔더볼 안착장치를 도시하고 있는 것으로, 솔더볼보관함(20)의 내부에는 솔더볼(4)을 담을수 있는 공간부(2)를 구비하고, 그 저면에 솔더볼안착홀(10)과 동일한 수를 갖는 안착공(20a)이 형성되어 있다.3 is a view showing a solder ball seating device for seating a solder ball 4 in a BGA package 15 according to the present invention, the inside of the solder ball container 20, the space for accommodating the solder ball 4 (2) And a mounting hole 20a having the same number as the solder ball seating hole 10 is formed on the bottom surface thereof.
상기 솔더볼보관함(20)의 저부에는 상부안착구(21)가 슬라이딩 가능하게 설치되는데, 상기 상부안착구(21)에도 패키지의 솔더볼안착홀(10)과 동일한 수를 갖는 안착공(21a)이 형성되어 솔더볼보관함(20)에 형성된 안착공(20a)과 일치되며 상부안착구(21)가 일측으로 슬라이딩 되었다가 복귀될 수 있도록 상부안착구(21)의 일측에 스프링(3)을 설치한다.An upper seating hole 21 is slidably installed at the bottom of the solder ball storage box 20, and a seating hole 21a having the same number as the solder ball seating hole 10 of the package is formed in the upper seating hole 21. It is matched with the seating hole (20a) formed in the solder ball container 20, and the spring (3) is installed on one side of the upper seating port 21 so that the upper seating port 21 is slid to one side and returned.
또한, 상기 상부안착구(21)의 저면에는 하부안착구(22)를 설치하는데, 이 하부안착구(22)에도 패키지의 솔더볼안착홀(10)과 동일한 수를 갖는 안착공(22a)이 형성되어, 상부안착구(21)에 형성된 안착공(21a)과 어긋나게 설치된다.In addition, a lower seating hole 22 is installed on the bottom of the upper seating hole 21. A seating hole 22a having the same number as the solder ball seating hole 10 of the package is formed in the lower seating hole 22 as well. Thus, the mounting hole 21a is provided to deviate from the seating hole 21a formed in the upper seating port 21.
이러한 솔더볼 안착장치는 솔더볼보관함(20)에 대략 200~250만개의 솔더볼(4)을 담은 후, 상부안착구(21)를 일측으로 슬라이딩 시켜 하부로 솔더볼(4)을 자유낙하 시킴으로서 패키지의 솔더볼안착홀(10)에 솔더볼(4)을 안착시키는 것이다.The solder ball seating device contains approximately 2 to 2.5 million solder balls 4 in the solder ball container 20, and then slides the upper seat 21 to one side to freely drop the solder balls 4 to the bottom, thereby seating the solder balls in the package. The solder ball 4 is seated in the hole 10.
이때, 솔더볼보관함(20)과 상·하부안착구(21)(22)에 형성된 각각의 안착공(20a)(21a)(22a)은 초기에는 솔더볼보관함(20)의 안착공(20a)과 상부안착구(21)의 안착공(21a)은 일치되어 있고, 하부안착구(22)의 안착공(22a)이 어긋난 상태에서, 상부안착구(21)각 일측으로 슬라이딩 되면 솔더볼보관함(20)의 안착공(22a)과 상부안착구(21)의 안착공(21a)이 일치되면서 하부안착구(22)의 안착공(20a)과 상부안착구(21)의 안착공(21a)이 어긋남과 동시에 하부안착구(22)의 안착공(22a)을 통해 솔더볼(4)이 자유낙하되어 패키지의 솔더볼안착홀(10)에 안착시킨 다음, 상부안착구(21)의 일측에 설치된 스프링(3)에 의해 상부안착구(21)는 원위치로 복원되는 것이다.At this time, each of the seating holes 20a, 21a, and 22a formed in the solder ball holder 20 and the upper and lower seating holes 21 and 22 may initially have a seating hole 20a and an upper portion of the solder ball holder 20. The seating holes 21a of the seating holes 21 are coincident with each other, and when the seating holes 22a of the lower seating holes 22 are displaced, the seating holes 21a are slid to one side of each of the upper seating holes 21. As the seating hole 22a and the seating hole 21a of the upper seating hole 21 coincide with each other, the seating hole 20a of the lower seating hole 22 and the seating hole 21a of the upper seating hole 21 are displaced. The solder ball 4 falls freely through the seating hole 22a of the lower seating hole 22 and is seated in the solder ball seating hole 10 of the package, and then the spring 3 installed on one side of the upper seating hole 21. By the upper seat 21 is to be restored to the original position.
이와같이 상부안착구(21)가 슬라이딩 될 때 상부안착구(21)의 안착공(21a)에는 하나의 솔더볼(4)만이 위치되어 상부안착구(21)와 함께 이동되도록 상부안착구(21)에 형성된 안착공(21a)의 높이를 하나의 솔더볼(4)만이 위치되는 높이를 갖는다.As such, when the upper seating port 21 is slid, only one solder ball 4 is positioned in the seating hole 21a of the upper seating port 21 so as to move together with the upper seating port 21. The height of the formed seating hole (21a) has a height where only one solder ball (4) is located.
상기 솔더볼보관함(20)에 솔더볼(4)을 공급하기 위해서는 솔더볼보관함(20)의 상부에 원통형으로 된 솔더볼공급통(30)을 회전실린더(32)에 의해 회전 가능하게 설치한다. 상기 솔더볼공급통(30)의 중간부분에는 솔더볼(4)을 공급할 수 있는 개방부(31)를 형성하여 솔더볼공급통(30)이 회전실린더(32)에 의해 회전될 때 개방부(31)를 통해 솔더볼보관함(20)에 공급되는 것이다.In order to supply the solder ball 4 to the solder ball container 20, a cylindrical solder ball supply container 30 is rotatably installed on the upper part of the solder ball container 20 by the rotation cylinder 32. The opening 31 is formed in the middle of the solder ball supply barrel 30 to supply the solder ball 4 so that the opening 31 is rotated when the solder ball supply cylinder 30 is rotated by the rotation cylinder 32. Will be supplied to the solder ball container 20 through.
상기 솔더볼공급통(30)을 회전시켜 솔더볼보관함(20)에 솔더볼(4)을 공급하기 위한 회전실린더(32)의 작동은 솔더볼보관함(20)의 공간부(2) 내측벽에 센서(5)를 설치하여 상기 센서(5)에서 솔더볼(4)이 없음을 감지하면 회전실린더(32)를 작동시키도록 되는 것으로, 여기서 사용되는 센서(5)는 수광부와 발광부를 갖는 광센서를 사용할 수 있다. 즉, 상기 센서(5)의 수광부와 발광부에 빛이 투과되지 않으면 솔더볼(4)이 있음을 감지하고, 빛이 투과되면 솔더볼(4)이 없음을 감지하여 회전실린더(32)를 동작시켜 솔더볼공급통(30)이 회전되면서 솔더볼(4)을 공급하도록 된다.The operation of the rotary cylinder 32 for supplying the solder ball 4 to the solder ball container 20 by rotating the solder ball supply container 30 is performed by the sensor 5 on the inner wall of the space part 2 of the solder ball container 20. By installing the sensor 5 to detect the absence of the solder ball (4) to operate the rotating cylinder 32, the sensor 5 used here may use an optical sensor having a light receiving unit and a light emitting unit. That is, when light does not penetrate the light receiving part and the light emitting part of the sensor 5, the solder ball 4 is detected, and when the light is transmitted, the solder ball 4 is not detected to operate the rotating cylinder 32 to operate the solder ball. Supply tube 30 is rotated to supply the solder ball (4).
상술한 바와같은 본 발명은 집적회로패키지의 솔더볼안착홀에 수백개의 솔더볼을 간단한 방법에 의해 정확하고, 효율적으로 안착시킴으로서 생산성 및 신뢰성을 향상시킬 수 있는 등의 효과가 있다.The present invention as described above has the effect of improving productivity and reliability by accurately and efficiently seating hundreds of solder balls in the solder ball seating holes of the integrated circuit package by a simple method.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950047349A KR0180281B1 (en) | 1995-12-07 | 1995-12-07 | Solder ball installing apparatus for integrated circuit package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950047349A KR0180281B1 (en) | 1995-12-07 | 1995-12-07 | Solder ball installing apparatus for integrated circuit package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970053750A KR970053750A (en) | 1997-07-31 |
| KR0180281B1 true KR0180281B1 (en) | 1999-03-20 |
Family
ID=19438222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950047349A KR0180281B1 (en) | 1995-12-07 | 1995-12-07 | Solder ball installing apparatus for integrated circuit package |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0180281B1 (en) |
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1995
- 1995-12-07 KR KR1019950047349A patent/KR0180281B1/en not_active IP Right Cessation
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| Publication number | Publication date |
|---|---|
| KR970053750A (en) | 1997-07-31 |
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