CN108573899A - Semiconductor manufacturing apparatus and its control method - Google Patents
Semiconductor manufacturing apparatus and its control method Download PDFInfo
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- CN108573899A CN108573899A CN201810144298.1A CN201810144298A CN108573899A CN 108573899 A CN108573899 A CN 108573899A CN 201810144298 A CN201810144298 A CN 201810144298A CN 108573899 A CN108573899 A CN 108573899A
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- pallet
- semiconductor
- information
- semiconductor packages
- container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The purpose of the present invention is to provide a kind of semiconductor manufacturing apparatuses, can shorten input if even if the device is in the case where the type of material changes and set the time of material information, to improve the operational efficiency of equipment, and improve the accuracy of setting.For this purpose, the device is characterized in that, the 2 d code with material information and various information is loaded in the conversion kit for needing while replacing in the type change of material, by detecting the 2 d code come the various information needed for automatic conversion processing material.
Description
Technical field
The present invention relates to a kind of semiconductor manufacturing apparatus and its control methods, in more detail, are related to a kind of semiconductor manufacturing
Device and its control method, even if material type change in the case of can shorten input and set material information when
Between, at the same can the quickly and accurately positioning confirmation in executive device and correction, to improve the operational efficiency of equipment.
Background technology
In general, semiconductor packages is manufactured by following technique：Manufacture is formed on the semiconductor substrate being made of silicon as brilliant
After the semiconductor chip of the high density integrated circuits such as body pipe and capacitor, which is adhered to such as lead frame or printing electricity
In the strip materials such as base board, and by electric wire etc. semiconductor chip connected with strip material so that it is powered, then for
Protection semiconductor chip exempts to be affected by and use molding for epoxy resin.
Semiconductor package is packaged in strip material in the form of array type arrangement, and in cutting strip material
While each encapsulation is to be separately separated, after selecting the encapsulation detached one by one according to preset quality standard, it is loaded in support
Subsequent technique is transplanted on disk.
The form for completing moulding process is usually known as semiconductor band or semi-conducting material, and executes cutting technique, with
Semiconductor band is separated into each semiconductor packages.
This cutting technique is executed by semiconductor manufacturing apparatus, and semiconductor manufacturing apparatus includes：Loading part, for supplying
Semiconductor band；Cutting part cuts the semiconductor band of loading；Cleaning part cleans the semiconductor packages of cutting；Drying section,
The semiconductor packages of cleaning is dried；Aligning section arranges dry each semiconductor packages；Inspection portion checks
The semiconductor packages of arrangement；And loading part is encapsulated into row classification to semiconductor and loads according to inspection result.
One semiconductor manufacturing apparatus not only handles specific semi-conducting material, but also when the type of material changes, and needs
It is manually entered the number of the material informations such as size, the size of semiconductor packages, spacing, X-axis quantity and the Y-axis quantity including material
Ten information, and replace and meet the scratch diskette (cutting part) of the material, irradiation modules (drying section), turntable (aligning section) etc. and turn
Change external member (conversion kit).
At this point, when the problem of generation operator's input error or omission material information, expensive material can be wasted, is caused
Loss etc. in terms of expense, and can not confirm mistakenly having replaced the conversion kit, therefore do not simply fail to normally drive
Dynamic equipment, and may also result in failure or the damage of equipment.
In addition, the loading technique for constituting the entire technique performed by semiconductor manufacturing apparatus includes finding out each container
(pocket) technique of accurate positional value is executed in the specification of initial setting or change product for driving equipment
Vision positioning for initial setting turntable or pallet.
In existing vision positioning method, in order to confirm that the position of container and Chooser (picker), operator are moved manually
The position of dynamic Chooser and pallet and the position for recording motor, then place the fixture of encapsulation shape in the corner container of pallet
(jig), it after Chooser chooses the fixture of the encapsulation character on pallet, is moved to the position of sighting device and is shot, from
And by for several times repeatedly shooting find out of deviant (X, Y, Z) and the center of pallet at 3 points after, using known tray information,
Number of containers, pitch information find out the accurate positional value of each container of matrix structure.
But there are the following problems for existing vision positioning method：Operator needs to manually set, therefore inconvenient, separately
Outside, it substantially needs to use fixture, therefore inconvenient in the management such as keeping or loss, and when choosing or placing and is mobile
The possibility that error occurs is big, it is most important that needs the longer initial setting task time.
Invention content
(1) technical problems to be solved
In order to solve the problem above-mentioned, the purpose of the present invention is to provide a kind of semiconductor manufacturing apparatuses, even if the device
Input can also be shortened in the case where the type of material changes and set the time of material information, so as to improve equipment
Operational efficiency.
In addition, another embodiment of the present invention is designed to provide a kind of semiconductor manufacturing apparatus, which can carry
Shorten the time needed for setting work while the accuracy of height setting.
(2) technical solution
According to an aspect of the present invention, semiconductor manufacturing apparatus includes：Loading part, semiconductor band is to introduce the shape of box
State is provided；Band Chooser adsorbs the semiconductor band drawn from the loading part and is transferred to scratch diskette；Cutting part has and uses
In the cutting part sighting device for obtaining the location information for being adsorbed on semiconductor band on the scratch diskette, and on scratch diskette to
The semiconductor band is cut into multiple semiconductor packages while the upper surface jet cleaning water of the semiconductor packages；It is dry
Module, in the state that the semiconductor packages of cutting is completed in the unit selection device selection being arranged in a manner of it can move along the x-axis
After being cleaned, the semiconductor packages of cleaning is received, and the internal institute for being equipped with heating plate to adsorb and drying is cleaned
State semiconductor packages；First look unit, is arranged on the top of the irradiation modules, and the irradiation modules are loaded in check
Semiconductor packages upper surface；Turntable Chooser chooses the entire semiconductor packages for completing to check, and can be along X-axis
It moves in direction；Turntable has the loading chute for loading the semiconductor packages chosen by the turntable Chooser, and can be along Y-axis side
To transfer, and can be rotated along the directions θ；Classifying and selecting device, it is individual to choose the semiconductor packages being loaded on the turntable, and transfer
To the top of the second visual unit of the lower surface for checking the semiconductor packages and inspection is executed, then will complete to check
Semiconductor packages be loaded on pallet；And pallet Chooser, pallet sighting device is set in side, and can be in the pallet
Top transferred together to X-direction, be built-in with letter in the upper load of the scratch diskette, the irradiation modules, the turntable
The 2 d code of breath.
Also, the information being built in the 2 d code may include semiconductor information, semiconductor packages information, half
The X-axis spacing of conductor encapsulation, the Y-axis spacing of semiconductor packages, the scratch diskette, the irradiation modules, in the turntable information
More than one information.
Also, the 2 d code being loaded on the scratch diskette can be detected by the cutting part sighting device to obtain
Semiconductor information and the scratch diskette information are stated, can be detected and be loaded in the irradiation modules by the First look unit
2 d code obtain the semiconductor packages information and the irradiation modules information, can be examined by the pallet sighting device
The 2 d code that is loaded on the turntable is surveyed to obtain the semiconductor packages information and the turntable information.
Also, according to the change of the type of the semiconductor packages, the scratch diskette, the irradiation modules and the disk turn
It is replaceable, the scratch diskette, the irradiation modules, the 2 d code on the turntable can be loaded in by detection, it is automatic to set
Semiconductor band or semiconductor information, or the various information for handling semiconductor band or semiconductor packages.
Also, at the two of two terminal edges of the detectable X-direction positioned at the pallet of the pallet sighting device
Hole at the one of the edge of the Y direction in the hole of gabarit container and any one hole in hole at described two.
Also, the pallet sighting device the gabarit container of the pallet hole damage or in the absence of, can detect position
Hole in the hole periphery of gabarit container, and the gabarit of the pallet can be calculated by the position in the hole on the periphery detected
The position in the hole of container.
Also, the pallet sighting device may include：Vision camera is shot in the container or pallet container of the pallet
The image in the hole in portion；And four illumination portions are set in position corresponding with the four of the pallet container sides with 90 degree of interval
It sets, by lighting each illumination portion in four illumination portions successively, and according to the pallet obtained by inspection by four times
The position in the hole inside position or pallet container of the marginal value of container to detect pallet container.
Also, the pallet sighting device can detect the X-axis of the pallet and the profile of Y-axis, and pass through the pallet
Profile calculate pallet gabarit container position.
Also, the Selection Center that can be set to the classifying and selecting device is consistent with the center of pallet sighting device.
Also, the inspection of the executable 2 d code being loaded on the turntable of the pallet sighting device is loaded in institute
State the inspection of the semiconductor packages on turntable, the inspection of the container of the pallet, the semiconductor packages being loaded on the pallet
Inspection in more than one.
(3) advantageous effect
Even if semiconductor manufacturing apparatus according to an embodiment of the invention can lead in the case where the type of material changes
The 2 d code acquisition material information for being formed in each conversion kit is crossed, without the letter of the tens of types of operator's personally input
Breath, and the various information needed for material can be handled with automatic conversion, therefore can not only shorten material information input time, also
Error caused by can preventing the input error of information and omitting.Also, beginner can also carry out the input and setting of equipment,
Therefore the operational efficiency of equipment can be improved.
In addition, semiconductor manufacturing apparatus according to an embodiment of the invention, without using fixture, in installation driving
The positioning of classifying and selecting device and pallet sighting device can be confirmed, and calculate location information and deviant automatically, therefore carry
While the accuracy of height setting, the time needed for setting work can be shortened.
In addition, when shooting the pallet of three-dimensional shape, ensured using shade while four illuminations can be controlled successively
Apparent contour line, therefore accurate positional value can be obtained, to improve the reliability of inspection.
Description of the drawings
Fig. 1 is the plan view for the semiconductor manufacturing apparatus for showing one embodiment of the present of invention.
Fig. 2 (a) and Fig. 2 (b) is the image of the conversion kit for the loading 2 d code for showing one embodiment of the present of invention,
Fig. 2 (a) is the image for indicating the 2 d code being loaded in the irradiation modules of the present invention, and Fig. 2 (b) is to indicate to be loaded on turntable
2 d code image.
Fig. 3 is that the vision inspection apparatus of four sides about container for indicating one embodiment of the present of invention lights shape
The upward view of state.
Fig. 4 is the image that illuminating state according to fig. 3 directly shoots pallet.
Fig. 5 is the master of the illuminating state of vision inspection apparatus in the vision positioning method for indicate one embodiment of the present of invention
View.
Fig. 6 (a) and Fig. 6 (b) be according to one embodiment of present invention come detect pallet hole image.
Fig. 7 is to be carried out in the vision positioning method for indicate another embodiment of the present invention by checking the profile of pallet
The upward view of the state of positioning.
Fig. 8 (a) and Fig. 8 (b) is in the vision positioning method for indicate one embodiment of the present of invention by shooting container
Hole is come the upward view and front view of the state positioned.
Fig. 9 is the flow chart of the process for the execution vision positioning method for indicating one embodiment of the present of invention.
Description of the drawings label
10：Pallet
12：Container
100：Loading part
120：Lamp
140：Band Chooser
150：Fixed module
200：Cutting part
210：Scratch diskette
212：Storage part
220：Scratch diskette pedestal
300：Cleaning part
310：Unit selection device
400：Drying section
410：Irradiation modules
500：Aligning section
520：Turntable
530：Turntable Chooser
600：Loading part
610：Top sighting device
611：Pallet sighting device
612：Classifying and selecting device
620：Pallet Chooser
700：Semi-conducting material
Specific implementation mode
In the following, the embodiment of the present invention is described in detail with reference to attached drawing.
Embodiment introduced below is to fully convey the present invention to those skilled in the art
Thought and propose.The present invention is not limited to embodiments presented below, can also implement otherwise.
In order to clearly demonstrate the present invention, it can omit in the accompanying drawings and the part unrelated with explanation is shown, and in order to have
Help understand, the size etc. for indicating component can be amplified.
Fig. 1 is the plan view for the semiconductor manufacturing apparatus for showing one embodiment of the present of invention, and Fig. 2 (a) and Fig. 2 (b) are
Show that the image of the conversion kit of the loading 2 d code of one embodiment of the present of invention, Fig. 3 are a realities for indicating the present invention
The block diagram of the structure of example is applied, Fig. 4 is the flow of the control method for the semiconductor manufacturing apparatus for showing one embodiment of the present of invention
Figure.
The semiconductor manufacturing apparatus of the present embodiment may include multiple works according to the manufacturing process or step of semiconductor packages
Make region and operating area.
Include according to the manufacturing device of the invention of Fig. 1：Loading part 100, semiconductor band is to be introduced into box
(magazine) state is provided；Band Chooser 140 adsorbs the semiconductor band drawn from loading part and is transferred to scratch diskette
212；Cutting part 200 will be supplied to scratch diskette by the semiconductor band with Chooser supply, to semiconductor package on scratch diskette
The semiconductor packages is cut into multiple semiconductor packages while the upper surface jet cleaning water of dress；Irradiation modules 410, with
It can be in the state that the semiconductor packages of cutting be completed in the unit selection device selection that the mode that Y-axis moves is arranged, in cleaning part
300 clean the semiconductor packages using brush and two-fluid spray nozzle, and inside is equipped with heating plate to adsorb
And the semiconductor packages of the dry cleaning；First look unit 610 is arranged on the top of the irradiation modules, to check
It is loaded in the upper surface of the semiconductor packages of the irradiation modules；Turntable Chooser 530 chooses the entire semiconductor for completing to check
Encapsulation, and can movably be arranged along X-direction；Turntable 520, the semiconductor packages to turning Chooser selection by the disk carry out
Arrangement, also, the turntable includes：First order portion, the loading chute for loading the semiconductor packages load half with no
The portion off board of conductor encapsulation is alternatively formed along X-axis and Y direction；And second order portion, symmetrically with first order portion
It is formed, and upper load has 2 d code, is arranged with can transferring along Y-axis；Classifying and selecting device 612, individual choose are loaded in
Semiconductor packages on the turntable, and the second vision of the lower surface for checking the semiconductor packages can be transferred to
Unit, and the semiconductor packages for completing to check is loaded on pallet；Pallet 600 loads and is arranged choosing according to inspection result
The semiconductor packages for taking device to choose；And pallet Chooser, it is used to supply the pallet, and side is equipped with for checking pallet
Or detection is loaded in the pallet sighting device of the 2 d code on the turntable, and can be on the top of the pallet along X-axis
Direction transfer ground setting.
Semiconductor making method using the manufacturing device of the present invention above-mentioned includes：Loading technique becomes for supplying
By the semiconductor band of cutting object；The semiconductor band of loading is cut into semiconductor packages by cutting technique on scratch diskette；Cleaning
Technique cleans the semiconductor packages of cutting using ejected wash water and brush；Drying process, to cleaning in irradiation modules
Semiconductor packages is dried；Upper surface checks technique, checks the upper surface of dry semiconductor packages；Arrangement technique, half-and-half
Conductor encapsulation is arranged；Lower surface checks technique, checks the lower surface of the semiconductor packages of arrangement；Loading technique, according to institute
It states inspection result semiconductor packages is loaded on pallet.
It needs first to input and confirm the relevant information of material to be processed to execute technique as described above.For this purpose,
Preferably, the two-dimentional generation including material information is still loaded on scratch diskette and irradiation modules other than turntable in the present invention
Code.
These are entirely the conversion kit changed simultaneously to be needed, due to two-dimentional generation when the types such as the size of material change
Code is equipped with the information needed for driving equipment, therefore cumbersome, input error, the input that can solve to be inputted every time when setting are lost
The problems such as leakage.
Wherein, 2 d code is two-dimensional bar (2D Barcode), may include Quick Response Code (QR-Code), data square
Battle array (Data Matrix), buphthalmos code (Maxi Code) etc. can also use shape shown in Fig. 2 (a) and Fig. 2 (b) of the present invention
Formula.
At this point, may include various information in 2 d code, e.g., X-axis spacing, the Y-axis of the semiconductor packages of work are needed
Spacing, the X-axis quantity of semiconductor packages, Y-axis quantity, the X-axis quantity of pallet, Y-axis quantity, from the center of irradiation modules (turntable)
To between first container X-axis distance, Y-axis distance etc. information.
Wherein, the structure of inspection and inspection 2 d code is preferably made of vision camera, for scratch diskette, can be used
The vision camera (not shown) being arranged to check the cutting line for the semiconductor band being placed on scratch diskette.
Also, it when checking the 2 d code being mounted in irradiation modules, can be executed by First look video camera 610, institute
Stating First look video camera 610 can move in the side of the air nozzle on irradiation modules top along Y direction from being arranged.
In addition, though being equipped with 2 d code on turntable yet, but does not have on turntable Chooser and check 2 d code
Sighting device.Although the 2 d code that turntable can also be arranged on turntable Chooser checks sighting device, additional setting
Expensive sighting device can greatly increase the price of equipment, it is therefore important that using the vision camera being arranged.Therefore,
Check that the pallet Chooser of pallet sighting device whether loading of pallet is located at the top of turntable to examine to make side be equipped with
It looks into turntable, when the stroke of the X-axis of extension tray Chooser, can not only check pallet with pallet sighting device, can also check
The 2 d code of turntable.
When the type of material changes, the conversion kits such as scratch diskette, irradiation modules, turntable are needed replacing to meet material,
In the prior art, operator is with being manually entered and confirm tens of kinds of information, but in the present invention, as long as vision camera is examined
The Quick Response Code mounted on the external member is measured, it can simply and accurately confirmation input, and can be true to the information of 2 d code
Recognize whether each tool meets the material.At this point, if not the material conversion kit, then sends out prompting or warning chases after to take
The measure added.
In addition, the semiconductor manufacturing apparatus to one embodiment of the present of invention is described in more details.
The present invention can provide a kind of semiconductor manufacturing apparatus, can also include：Loading part 100, semiconductor supply material
Material 700；Cutting part 200 receives semi-conducting material from loading part and is cut into an other semiconductor packages；Cleaning part 300, to
The semiconductor packages of the cutting part cutting is cleaned；Drying section 400 carries out the semiconductor packages of cleaning part cleaning
It is dry；Aligning section 500 arranges dry semiconductor packages；And loading part 600, the inspection of row vision is encapsulated into semiconductor
It looks into, and is loaded according to inspection result, which can carry out cutting, clearly for semi-conducting material 700 successively
Wash, dry, visual inspection and according to the visual inspection result by semiconductor packages classification load loading technique.
In the following, simple declaration is applicable to the manufacturing process of the semiconductor packages of the present embodiment referring to Fig.1.
Be loaded in loading part 100 multiple semi-conducting materials pass sequentially through band Chooser 140 be transferred to scratch diskette 210.
The scratch diskette 210 can be moved forward and backward in cutting part 200 to be arranged with moving in rotation, the semiconductor material being placed on scratch diskette
Material can be cut into an other semiconductor packages by the relative movement of cutter and scratch diskette 210.Certainly, the cutting can
To be executed by cutting part 200.
Wherein, scratch diskette 210 shown in FIG. 1 may be mounted on pedestal 220.Pass through the back-and-forth motion of the pedestal 220
And rotation, the movement of scratch diskette 210 and rotation.It can be considered as, by the movement and rotation of the pedestal 220, be mounted on scratch diskette
Semi-conducting material on 210 is mobile and rotates.
The position of scratch diskette 210 and pedestal 220 shown in FIG. 1 can be considered as initial position, and can also be considered as can replace
The replacement position of scratch diskette 210.
In addition, the semiconductor package for completing cutting passes through cleaning part 300 mounted in being adsorbed in the state of unit selection device 310
The semiconductor packages completed cleaning, and complete cleaning is passed to the top of irradiation modules 410.At this point, the semiconductor package
Dress can be transferred to irradiation modules by the unit selection device 310 from cleaning part.
For completing dry semiconductor packages in irradiation modules 400, regarded using positioned at the first of irradiation modules top
Device 610 is felt to check the upper surface of semiconductor packages.
In addition, First look device checks the upper surface of semiconductor packages in installation driving, but in equipment
When initial setting, the 2 d code by being loaded in irradiation modules obtains semiconductor packages information and irradiation modules set information.
For example, based between the X-axis to first adsorption hole from the central point of irradiation modules and Y-axis distance, the X-axis of adsorption hole
The information that the quantity of adsorption hole etc. in quantity, Y-axis away from the adsorption hole in, Y-axis spacing and X-axis is obtained by 2 d code,
Semiconductor packages can be transferred to irradiation modules by unit selection device.
Later, turntable Chooser 530 disposably chooses the whole semiconductor packages for being adsorbed on irradiation modules, and is divided into
Half is individually placed in the first order portion and second order portion on turntable, wherein the first order portion is formed as, for filling
The loading chute for carrying the semiconductor packages replaces shape with the portion off board without loading semiconductor packages along X-axis and Y direction
At the second order portion and first order portion are asymmetrically formed.Turntable with can to Y direction transfer and it is rotatable
Mode is arranged, and classifying and selecting device 612 chooses the individual semiconductor package being loaded on turntable and is moved to third vision dress later
613 top is set, and checks the lower surface of semiconductor packages, according to the inspection of First look device 611 and third sighting device 613
It looks into as a result, good semiconductor packages is loaded on non-defective unit pallet, undesirable semiconductor packages is loaded in bad/waste product support
On disk.
As described above, when set device, pallet sighting device 611 has obtained the relevant set information of turntable.Turntable inspection
It is moved to the top of turntable by pallet sighting device and detection is loaded in the 2 d code of disk upper surface, to can get support
Disk center's point is to information such as the loading chute quantity of X-axis, the loading chute quantity of Y-axis, X-axis spacing, Y-axis spacing.
Therefore material set information need not be manually entered one by one, can by with sighting device detect Quick Response Code process come
So that setting time and review time is minimized, to can significantly reduce on the whole expense needed for manufacture semiconductor packages and
Time.
Be explained above from semi-conducting material to cutting, cleaning, drying, inspection and classification entire technique can be at one
The semiconductor manufacturing apparatus and manufacturing process that device is realized, but semiconductor manufacturing apparatus can also handle partly leading for other forms
Body material.
For this purpose, when the type of material changes, conversion kit (conversion kit) is needed replacing, conversion kit can be
The replaceable structure of semi-conducting material handled by semiconductor manufacturing apparatus.For example, the conversion kit can be work
Disk 210, irradiation modules 410 and turntable 520.
In order to execute the entire technique about New raxa or the semi-conducting material of new type, needed in semiconductor manufacturing apparatus
Reset various information.That is, the semi-conducting material handled as needed, including control to be changed is needed in semiconductor manufacturing apparatus
The various information of variable processed or parameter have to change.
Therefore, in the prior art, according to the change of semi-conducting material, conversion kit is needed replacing, while according to partly leading
Body material modification or the various information of change.
For example, according to semi-conducting material, need to change following information.
The arrangement information of semi-conducting material is changed, for example, the line information of change semiconductor packages, also changes and be used for
Transfer position and the coordinate information of semi-conducting material or the transfer device of semiconductor packages.In addition, change semi-conducting material or
The arrangement information or aligning method of semiconductor packages are changed about the letter for differentiating undesirable standard in visual inspection
Breath also changes the information about cleaning device or the operation scheme of drying device.
Based on the above reasons, in existing semiconductor manufacturing apparatus, setting work and input when replacing new material every time
Many times are needed, therefore semiconductor manufacturing apparatus can not be efficiently used.
Therefore, it with the variation of raw material to be treated, in order to run or operate manufacturing device, needs to change or change
Many information, it is therefore desirable to which a kind of setting work for the new model that can easily input many information is provided.
Described information may include line information, dimension information, the cutting line sequence, cutting speed, knife of semi-conducting material
It is checked after piece information, location information, pneumatics information, motor information, cleaning program, cleaning information, cutting, whether there is or not bad, visions
The various information such as image information.Certainly, described information is not limited to this, may include being used in entire semiconductor fabrication process
Drive the more than one information in cutter device, transfer device, check device, cleaning device and pneumatics feedway.
With reference to Fig. 2 (a) and Fig. 2 (b) image of irradiation modules and turntable is shown as an example of conversion kit,
It can be confirmed that the side in irradiation modules and turntable is mounted with the 2 d code for inputting various information.
As described above, the semi-conducting material that the conversion kit is configured as handling as needed is replaced.It is described
Replacement can execute on replacement position as shown in Figure 1.
More than, to the step needed for initialization is omitted when changing semi-conducting material by replacing conversion kit, to
The feature that semiconductor manufacturing apparatus can effectively be run is illustrated.It is that can lead to also illustrate this effect simultaneously
It crosses and loads 2 d code in conversion kit to obtain.
In existing semiconductor manufacturing apparatus, in identical conversion kit, the work after placing next semi-conducting material
Before skill starts, need to execute repeatedly and the same or similar intermediate settings work of initial setting task, it is therefore desirable to repeatedly defeated
Enter such as to cut information, cleaning information and the various information of visual information.
But embodiment through the invention, conversion kit have 2 d code, so as to pass through the one of various information
Secondary property input can omit intermediate settings work.Certainly, the initial setting task is also to be grasped by the computer of 2 d code
Make rather than user is manually entered, therefore can rapidly and correctly execute
Therefore, initial setting task required when replacing conversion kit is not only can be omitted, but also can be omitted follow-up
For handling the setting work of semi-conducting material, so as to effectively run semiconductor manufacturing apparatus on the whole.
2 d code information includes：Top sighting device 610 can shoot the image about semi-conducting material on top
And identify the code in storage part；Pallet sighting device 611 identifies the code identically as the top sighting device 610；
And unshowned scratch diskette sighting device.
For this purpose, the stroke of pallet Chooser 620 can extend to the position where turntable, so as to be moved to described turn
Therefore the top of disk 520 can read in the pallet sighting device that the side of pallet Chooser has and be arranged in the turntable
The code in storage part on 520.
In the following, the control method to the embodiment of the present invention is described in detail.
Conversion kit can be replaced in order to handle new semi-conducting material.Due to the conversion kit replacement and can be with
Obtain the various information for handling new semi-conducting material.After obtaining various information, actual various letters can be set
Breath, and can be according to the actual various information, and the various information based on acquisition execute various techniques.Wherein, respectively
Kind technique can also include cutting, cleaning, dry and inspection technique.
In addition, can be the relevant basic letter of semi-conducting material by the various information that the 2 d code of conversion kit provides
Breath or first time information.Therefore, it needs to set actual various information to control the operation of practical manufacturing device.For example,
Second of information of essential information or first time Information procession or modification can be set by.
Also, it, can also be according to above-mentioned when needing replacing conversion kit to handle the semi-conducting material of New raxa
Content executes.
Therefore, because based on the initial identical semi-conducting material of various information processings, therefore can constantly manage quilt
It is revised as best various information.That is, need not integrally input or change various information, therefore it is very convenient.
In the following, the pallet inspection and pallet setting method to the semiconductor manufacturing apparatus using the present invention illustrate.
In the semiconductor manufacturing apparatus of the present invention, pallet is moved to Y direction, and pallet sighting device is moved to X-direction,
The accurate positional value of each container can be found out by their relative movement.In particular, being used in combination by the gabarit edge for shooting pallet
Diagonal line connects contour edge to find out the center of pallet, then can pass through known tray information, pallet container quantity, pallet
Pitch information finds out the accurate positional value of each container of pallet.
When detecting pallet, it is described in more details with reference to the attached drawing of the present invention.
Fig. 3 is that the vision inspection apparatus of four sides about container for indicating one embodiment of the present of invention lights shape
The upward view of state, Fig. 4 are the images that illuminating state according to fig. 3 directly shoots pallet, and Fig. 5 is an implementation for indicating the present invention
The front view of the illuminating state of vision inspection apparatus in the vision positioning method of example.Fig. 6 (a) and Fig. 6 (b) is according to the present invention
One embodiment detects the image in the hole of pallet, and Fig. 7 led in the vision positioning method for indicate another embodiment of the present invention
It crosses and checks the profile of pallet come the upward view of the state positioned, Fig. 8 (a) and Fig. 8 (b) are a realities for indicating the present invention
In the vision positioning method for applying example, by the hole of shooting container come the upward view and front view of the state positioned, Fig. 9 is table
Show the flow chart of the process of the execution vision positioning method of one embodiment of the present of invention.
With reference to Fig. 3 to Fig. 5, it has been confirmed that in an embodiment of the present invention, pallet sighting device 611 include setting with
Four lamps 120 of the corresponding position in four sides of container 12.Preferably, in the present invention when checking pallet, using only respectively
The mode that Site control configures the illumination in the lamp of four positions and lights, is examined by the shade formed to the negative direction of illumination
Survey the edge of the container.
For this purpose, four lamps (4direction light) are used in pallet sighting device, and each side in four direction
Illumination is lighted successively upwards, while shooting the image of four sides of the container 12.Four images are obtained in this way,
Then using the shade formed to the negative direction of each illumination come extraction vessel edge, and the marginal information at comprehensive four sides can be passed through
To find out the center of container.
Although the position of each container of pallet can be obtained by checking the edge of container, if using being difficult to examine
When looking into the pallet of the design of container, the form of container can not be seen in the image captured by possible pallet sighting device.At this moment, such as
Shown in Fig. 6 (a), the position in the hole positioned at the gabarit edge of the pallet of three positions can also be directly detected.At this point, when to find
Gabarit edge on when hole is not present, as shown in Fig. 6 (b), the container on periphery can be found or hole and transmitted corresponding
Sequence.
For example, place pallet 10 for transferring pallet, in order to position and pallet 10 is moved into the pallet Chooser
After on the line of 620 operation, pass through the side Y of the movement and pallet 10 of the X-direction of the pallet Chooser 620 from now on
To movement, executes and be used for the initially set positioning of pallet.
In the pallet Chooser 620, side is provided with pallet sighting device 611, the pallet sighting device can be passed through
611 directly shoot the position of container hole present in the gabarit edge and provide information used for positioning (shooting value).
Therefore, the center of container can be found out by the synthesis marginal information, and using the edge of the container,
Center, number of containers and the pitch information of container find out the positional value of each container of matrix structure.
Except the edge of detection container, the hole of container method in addition to, as shown in fig. 7, can also be utilized when checking pallet
The edge of pallet checks pallet.That is, in the case of known vessel and the distance of the contour line of pallet, it can be outer by checking
Profile finds out the position of container.
The accurate positional value of each containers such as specification, center, the quantity for finding out container by the position of detection container, from
And tray position value can be set, and semiconductor packages can be loaded on the accurate location of pallet by classifying and selecting device.
In addition, it is this setting be by physically initial setting so that the center of pallet sighting device and arrangement Chooser in
The heart is identical, therefore the deviant (X, Y, Z) of image that reflection is shot by pallet sighting device, the size correction of opsition dependent value with
It is mobile to arrange Chooser to be loaded.
Therefore, in the prior art, there are the following problems when the position of confirmation pallet and Chooser in above-mentioned positioning operation：
It needs operator to manually set, therefore inconvenient, further, since substantially needing to use fixture, therefore in keeping or loses
It is inconvenient in management to lose etc., and when choosing or placement and it is mobile when generate error possibility it is big.But this problem can
Semiconductor manufacturing apparatus through the invention and its control method are eliminated.
That is, according to the present invention, even if without using the fixture of existing encapsulation shape, positioning operation can also be carried out, is not
Using fixture by way of the automatic calculating out position correction of the inspection of the container of pallet or profile and deviant, therefore can
To improve the accuracy of setting and shorten the time needed for setting work.
By one embodiment shown in attached drawing, the present invention is described, but this is only illustrated, ability
Field technique personnel are it is generally understood that this progress various modifications and impartial other embodiment.Therefore, actual guarantor of the invention
Shield range should be determined according to claims.
Claims (10)
1. a kind of semiconductor manufacturing apparatus, which is characterized in that including：
Loading part, semiconductor band are provided with the state for introducing box；
Band Chooser adsorbs the semiconductor band drawn from the loading part and is transferred to scratch diskette；
Cutting part has the cutting part vision dress of the location information for obtaining the semiconductor band being adsorbed on the scratch diskette
It sets, and is cut into the semiconductor band while on scratch diskette to the upper surface jet cleaning water of the semiconductor packages
Multiple semiconductor packages；
Irradiation modules choose the semiconductor packages that cutting is completed in the unit selection device being arranged in a manner of it can move along the x-axis
In the state of cleaned after, receive the semiconductor packages of cleaning, and inside is equipped with heating plate to adsorb and dry
The semiconductor packages of cleaning；
First look unit is arranged on the top of the irradiation modules, to check the semiconductor for being loaded in the irradiation modules
The upper surface of encapsulation；
Turntable Chooser is chosen the entire semiconductor packages for completing to check, and can be moved along X-direction；
Turntable has the loading chute for loading the semiconductor packages chosen by the turntable Chooser, and can be moved along Y direction
It send, and can be rotated along the directions θ；
Classifying and selecting device, it is individual to choose the semiconductor packages being loaded on the turntable, and be transferred to and described partly led for checking
The top of second visual unit of the lower surface of body encapsulation simultaneously executes inspection, is then loaded in the semiconductor packages for completing to check
On pallet；And
Pallet Chooser is arranged pallet sighting device in side, and can together be moved to X-direction on the top of the pallet
It send,
It is built-in with the 2 d code of information in the upper load of the scratch diskette, the irradiation modules, the turntable.
2. semiconductor manufacturing apparatus according to claim 1, which is characterized in that
The information being built in the 2 d code includes semiconductor information, semiconductor packages information, the X-axis of semiconductor packages
One or more of spacing, the Y-axis spacing of semiconductor packages, the scratch diskette, the irradiation modules, described turntable information are believed
Breath.
3. semiconductor manufacturing apparatus according to claim 1, which is characterized in that
The 2 d code being loaded on the scratch diskette is detected by the cutting part sighting device to obtain the semiconductor band
Information and the scratch diskette information,
The 2 d code being loaded in the irradiation modules is detected by the First look unit to obtain the semiconductor package
Information and the irradiation modules information are filled,
The 2 d code being loaded on the turntable by pallet sighting device detection is believed to obtain the semiconductor packages
Breath and the turntable information.
4. semiconductor manufacturing apparatus according to claim 1, which is characterized in that
According to the change of the type of the semiconductor packages, the scratch diskette, the irradiation modules and the disk turn replaceable,
It is loaded in the scratch diskette, the irradiation modules, the 2 d code on the turntable by detection, sets semiconductor automatically
Band or semiconductor information, or the various information for handling semiconductor band or semiconductor packages.
5. semiconductor manufacturing apparatus according to claim 1, which is characterized in that
The hole of gabarit container at the two of two terminal edges of X-direction of the pallet sighting device detection positioned at the pallet
With the one of the edge of the Y direction in any one hole in the hole at described two at hole.
6. semiconductor manufacturing apparatus according to claim 5, which is characterized in that
The pallet sighting device the hole of the gabarit container of pallet damage or in the absence of, detection is positioned at gabarit container
The hole on hole periphery, and calculate by the position in the hole on the periphery detected the position in the hole of the gabarit container of the pallet
It sets.
7. semiconductor manufacturing apparatus according to claim 5 or 6, which is characterized in that
The pallet sighting device includes：
Vision camera shoots the container of the pallet or the image in the hole inside pallet container；And
Four illumination portions are arranged in position corresponding with the four of the pallet container sides with 90 degree of interval,
By lighting each illumination portion in four illumination portions successively, and according to the pallet obtained by inspection by four times
The position in the hole inside position or pallet container of the marginal value of container to detect pallet container.
8. semiconductor manufacturing apparatus according to claim 5, which is characterized in that
The pallet sighting device detects the X-axis of the pallet and the profile of Y-axis, and the gabarit line computation for passing through the pallet
Go out the position of the gabarit container of pallet.
9. semiconductor manufacturing apparatus according to claim 1, which is characterized in that
The Selection Center for being set to the classifying and selecting device is consistent with the center of pallet sighting device.
10. semiconductor manufacturing apparatus according to claim 1, which is characterized in that
The inspection for the 2 d code that the pallet sighting device execution is loaded on the turntable, half be loaded on the turntable
One in the inspection of conductor encapsulation, the inspection of container of the pallet, the inspection for the semiconductor packages being loaded on the pallet
More than a.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0031360 | 2017-03-13 | ||
| KR1020170031360A KR102008515B1 (en) | 2017-03-13 | 2017-03-13 | semiconductor manufacturing apparatus and controlling method of the same |
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| CN108573899A true CN108573899A (en) | 2018-09-25 |
| CN108573899B CN108573899B (en) | 2022-12-23 |
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| Country | Link |
|---|---|
| KR (1) | KR102008515B1 (en) |
| CN (1) | CN108573899B (en) |
| TW (1) | TWI744484B (en) |
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| CN113330545A (en) * | 2019-02-26 | 2021-08-31 | 杰纳森株式会社 | Automatic exchange device of workstation module and conversion external member |
| CN115139150A (en) * | 2022-09-05 | 2022-10-04 | 中科航迈数控软件(深圳)有限公司 | Cutter cutting amount setting method and system applied to numerical control machine tool |
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| KR102095728B1 (en) * | 2019-02-26 | 2020-04-02 | 제너셈(주) | Conversion kit auto change system |
| KR102280196B1 (en) * | 2019-06-27 | 2021-07-22 | 한미반도체 주식회사 | Semiconductor manufacturing apparatus |
| KR102274543B1 (en) * | 2020-03-20 | 2021-07-07 | ㈜토니텍 | saw & placement system |
| KR102309174B1 (en) * | 2020-04-01 | 2021-10-06 | (주) 인텍플러스 | System and method for checking mounting state of picker mounts |
| KR102636291B1 (en) * | 2023-08-30 | 2024-02-14 | 제너셈(주) | Apparatus and method for tray recognition using reference point |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20180104800A (en) | 2018-09-27 |
| TWI744484B (en) | 2021-11-01 |
| TW201834093A (en) | 2018-09-16 |
| CN108573899B (en) | 2022-12-23 |
| KR102008515B1 (en) | 2019-10-22 |
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