KR20140041153A - Semiconductor manufacturing apparatus and a controlling method of the same - Google Patents

Abstract

The present invention relates to a semiconductor manufacturing apparatus and a control method thereof, and more particularly, to a semiconductor manufacturing apparatus and a control method thereof that can implement a user interface more easily.
According to an embodiment of the present invention, a semiconductor manufacturing apparatus for performing a general process for cutting a semiconductor material to generate a semiconductor package, having a general information that depends on the semiconductor material to be cut to perform the overall process A memory unit; A conversion kit provided to be replaced according to the semiconductor material; And a controller configured to perform the various processes based on the general information, and the memory unit may be provided in the conversion kit.

Description

Semiconductor manufacturing apparatus and a controlling method of the same

The present invention relates to a semiconductor manufacturing apparatus and a control method thereof, and more particularly, to a semiconductor manufacturing apparatus and a control method thereof that can implement a user interface more easily.

Recently, with the development of information communication and computer technology, high integration of semiconductors is progressing.In response to this trend, semiconductor packages also have solder ball type packages or MLF (micro leaded frames) instead of lead frames for connecting internal lines to the outside. ) Package is mainly used.

The solder ball type packages or MLF type packages manufactured as described above are referred to as semiconductor strips because they form a strip in a rectangular matrix form. Of course, such semiconductor strips are also called semiconductor materials.

Therefore, a state in which a plurality of semiconductor packages are connected to each other may be referred to as a semiconductor material, and a semiconductor package may be separately separated and united from the semiconductor material.

Packages produced in the form of strips need to be separated separately by a cutting device for their use.

A device for manufacturing a semiconductor package by cutting semiconductor materials may be referred to as a semiconductor cutting device, and a device for inspecting and classifying the cut semiconductor package may be referred to as a handler device.

Although the semiconductor cutting device and the handler device are separate devices, there are many examples in which the semiconductor cutting device and the handler device (inspection device) are combined into one semiconductor manufacturing device to increase the manufacturing speed of the semiconductor package.

More specifically, a cutting device, a cleaning device for washing the cut semiconductor package, a drying device for drying the cleaned semiconductor package, and a handler device may be combined to be combined to implement a single semiconductor manufacturing device.

One semiconductor material may include a plurality of semiconductor packages. Therefore, the semiconductor material is cut along the plurality of cutting lines to separate the semiconductor package.

For example, in the case of a semiconductor material having six semiconductor packages each horizontally and vertically, seven horizontally cutting lines and seven vertically cutting lines may be provided to separate a total of 36 semiconductor packages.

The cutting device cuts the semiconductor material along the cutting line, and cutting line information on the cutting sequence, namely, which cutting line starts cutting and which cutting line ends cutting, needs to be input to the semiconductor manufacturing apparatus. In addition, various information for cutting, cleaning and inspection, such as blade information, alignment information, motor information, cleaning scenario, cleaning information, burr check after cutting, vision image information, etc., need to be input to the semiconductor manufacturing apparatus. .

In the conventional semiconductor manufacturing apparatus, an operator has to inconvenience inputting such various and vast information through an input unit such as a keyboard.

The semiconductor manufacturing apparatus needs to be provided to cut various kinds of semiconductor materials having various sizes and various arrangements. Therefore, when the operator inputs material information, blade information, cutting sequence, cleaning and inspection information every time when cutting various kinds of semiconductor materials, the information to be input is enormous and the work is cumbersome and takes a lot of time. There was. In addition, there was a problem that the operator can enter the material information incorrectly.

On the other hand, the semiconductor material is cut after being seated on the chuck table. The chuck table may vary depending on the semiconductor material to be cut. In addition, one semiconductor manufacturing apparatus may be provided not only to cut a specific semiconductor material, but also to cut a wide variety of semiconductor materials as needed. To this end, different chuck tables may be used depending on the semiconductor material.

Of course, there may be configurations other than the chuck table depending on the semiconductor material. For example, the adsorption units for adsorbing and transporting the semiconductor material may also be configured to vary depending on the semiconductor material.

Therefore, the chuck table or the adsorption units may be referred to as a conversion kit. That is, according to the necessity, different semiconductor kits can be used to cut various semiconductor materials. Different from such a conversion kit, it is possible to perform various processes for processing various semiconductor materials in one semiconductor manufacturing apparatus.

Here, the replacement of the conversion kit needs to change very much information necessary to operate the semiconductor manufacturing apparatus. Information regarding the number of cutting lines and the cutting order may also be said to be one of such information.

Therefore, there has always been a problem of inputting a lot of information each time a conversion kit is replaced, and there is a need for a method for easily managing such information. This is because the preparation time for starting the process can be used more than the time required for the process of processing the actual semiconductor material.

In addition, after the process for one material is performed in a conversion kit such as a chuck table, the above-described various information needs to be input separately when the process for the next material is performed. In other words, various information needed to be input for the initial setting even before the process for the next material. Thus, the same problems could arise in starting the process for the next material after the process for one material.

The present invention basically aims to solve the above-mentioned problem.

Through one embodiment of the present invention, when processing a variety of semiconductor materials in one manufacturing apparatus to provide a semiconductor manufacturing apparatus and its manufacturing method that can significantly reduce the initial preparation time and setting time during material replacement.

Through one embodiment of the present invention, to provide a semiconductor manufacturing apparatus and a method of manufacturing the same that can be very easy and simple user interface.

Through one embodiment of the present invention, to provide a semiconductor manufacturing apparatus and a control method thereof that can easily determine and apply the control parameters or information of the manufacturing apparatus is modified or changed to other manufacturing apparatus.

Through an embodiment of the present invention, it is possible to provide a semiconductor manufacturing apparatus and a control method thereof, which is very easy to use because it is very easy to provide a variety of information of the semiconductor material corresponding to the replacement of the conversion kit.

Through one embodiment of the present invention, it is possible to significantly reduce the setting time and effort required every time a new material is replaced, and thus to provide a semiconductor manufacturing apparatus and a control method thereof that can effectively use the semiconductor manufacturing apparatus.

According to an embodiment of the present invention for achieving the above object, in the semiconductor manufacturing apparatus for performing a general process for cutting a semiconductor material to generate a semiconductor package, the semiconductor material is cut to perform the overall process A memory unit having various information depending on the memory unit; A conversion kit provided to be replaced according to the semiconductor material; And a controller for performing the various processes based on the general information, and the memory unit may provide a semiconductor manufacturing apparatus provided in the conversion kit.

The memory unit may be replaceable with the conversion kit.

In addition, it is possible to provide a semiconductor manufacturing apparatus which can replace the conversion kit and the memory unit together or replace the memory unit in the conversion kit.

It comprises an information processing unit for processing the overall information of the memory unit, the memory unit and the information processing unit may be connected wirelessly or may be connected by wire.

The memory unit may include an RFID tag or an NFC tag, and the information processing unit may include a terminal for reading or reading and writing information of the tag. The terminal may include an RF reader.

The information processing unit may obtain various information stored in the memory unit and transfer the general information to the control unit.

The general process may include at least one of a semiconductor material cutting process, a washing process, a cutting process, and a vision inspection process. In addition, the general information may include information for driving at least one of a cutting device, a transfer device, an inspection device, a cleaning device, and a pneumatic supply device.

The conversion kit may comprise a chuck table on which the semiconductor material may be seated and cut.

The chuck table can have a wide variety of shapes and sizes depending on the semiconductor material. In addition, the chuck table may include a chuck table frame and a suction pad provided in the frame. The adsorption pad has an adsorption structure having various shapes according to the semiconductor package.

The memory unit may be detachably provided to the chuck table. Specifically, the memory unit may be provided in the chuck table frame. The memory part may be integrally formed with the chuck table frame in a molding process for forming the suction pad.

The memory unit may be detachably attached to the chuck table.

The conversion kit may include a chuck table fixed to the chuck table base, and the chuck table base may be provided with a port for connecting to the memory unit. Therefore, the memory unit and the information processor may be wired through the port.

The controller may set actual general information based on the general information and allow the general process to be performed according to the set general information. That is, actual general information, which is processed or secondary information, may be set based on general information of the memory unit.

The screen for displaying the set general information may be included. The user can easily store the general information or the changed general information set through the screen.

According to the replacement input of the conversion kit through the screen, the control unit may control the transfer device to transfer the conversion kit to a predetermined replacement position.

Preferably, the replacement position is provided with an information processing unit for reading or reading information of the memory unit.

After the conversion kit is transferred to the replacement position, the controller may control the information processing unit so that the current general information is stored in the memory unit according to a storage input through the screen. Therefore, the current general information can be stored together with the replacement kit. Through this, it is possible to continuously secure or manage the improved general information. In addition, it is possible to easily expand and apply the improved information in one device to another semiconductor manufacturing apparatus for processing the same semiconductor material.

In order to achieve the above object, according to an embodiment of the present invention, in the control method of the semiconductor manufacturing apparatus for performing a general process for cutting the semiconductor material to generate a semiconductor package, provided in the control method according to the semiconductor material Obtaining various information depending on the semiconductor material to be cut through a memory unit included in the conversion kit; And it may provide a control method of a semiconductor manufacturing apparatus comprising the step of performing the various processes based on the obtained general information.

Based on the obtained general information, the step of setting the actual general information for performing the overall process is preferably performed, and the overall process is preferably performed according to the set actual information.

After the general information setting step, the method may include recording current general information into the memory unit.

The method may further include a step of checking whether the conversion kit is replaced. When the replacement kit is replaced, the general information acquisition step may be performed.

The control method according to the embodiment includes: receiving the conversion kit replacement command; Moving the conversion kit to a replacement position when the command is received; And recording current general information after the movement to the memory unit. Through this, replacement of the conversion kit and storage of the current general information can be performed sequentially and automatically.

The control method according to the embodiment includes: displaying the set general information; Changing general information set through the display; And storing the changed general information.

And recording the changed and stored general information into the memory unit. Therefore, management and use of the changed or improved information can be made easier.

Features appearing in the above embodiments may be implemented in combination with each other, unless they contradict or be exclusive to the features in other embodiments.

Through one embodiment of the present invention, when processing a variety of semiconductor materials in one manufacturing apparatus can provide a semiconductor manufacturing apparatus and its manufacturing method that can significantly reduce the initial preparation time and the setting time during material replacement.

Through one embodiment of the present invention, it is possible to provide a semiconductor manufacturing apparatus and a method of manufacturing the same that can be very easy and simple user interface.

Through one embodiment of the present invention, it is possible to provide a semiconductor manufacturing apparatus and a method of manufacturing the same, which can be easily applied to correct the problem generated during semiconductor manufacturing, and can prevent accidents caused by incorrect input in advance. .

According to one embodiment of the present invention, it is possible to provide a semiconductor manufacturing apparatus and a method of controlling the same, which can easily determine and apply control parameters or information of a manufacturing apparatus that is modified or changed to another manufacturing apparatus.

According to an embodiment of the present invention, it is possible to provide a semiconductor manufacturing apparatus and a control method thereof that are very easy to use because it is very easy to provide a variety of information of the semiconductor material corresponding to the replacement of the conversion kit at the same time.

According to one embodiment of the present invention, a semiconductor manufacturing apparatus capable of significantly reducing the time and effort required for setting by shortening a necessary setting step each time a new material is replaced, and thus, can efficiently use a semiconductor manufacturing apparatus. It can provide a control method thereof.

According to one embodiment of the present invention, by mounting a memory unit with all the built-in information in the conversion kit of the chuck table, it is possible to easily load the necessary information from the memory without having to repeatedly input the same and vast information every time, the semiconductor can easily work It is possible to provide a manufacturing apparatus and a control method thereof.

1 is a plan view showing a semiconductor manufacturing apparatus according to an embodiment of the present invention;
2 is a block diagram showing configurations according to an embodiment of the present invention;
3 and 4 are perspective views showing different types of chuck tables;
5 is a flowchart illustrating a control method of a semiconductor manufacturing apparatus according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view schematically showing a semiconductor manufacturing apparatus according to an embodiment of the present invention.

The semiconductor manufacturing apparatus according to the present exemplary embodiment may include a plurality of working regions or operating regions according to a manufacturing process or step of a semiconductor package.

Specifically, the method may include a vision inspection region 500 for inspecting whether a semiconductor package is defective through a vision inspection apparatus and an offload region 600 for classifying semiconductor packages according to the vision inspection results. The vision inspection region 500 and the offload region 600 may be provided to be spaced apart from each other. In addition, it is preferable to be provided so as to be independent of each other structurally as will be described later.

In addition, the vision inspection region 500 may include a transfer means 420 for transferring the semiconductor packages 20 that have been inspected to the offload region 600.

In the offload region 600, semiconductor packages are classified through the offload picker 620. That is, the offload picker 620 moves to the left and right and / or up and down to classify and load the semiconductor packages that pass the inspection and those that do not. Therefore, since the process in a semiconductor manufacturing system is complete | finished, this can be made into an off road.

In the vision inspection area 500, since the vision inspection is performed by the relative movement of the 3D vision camera 510 and the seating plate 410 in the state in which the semiconductor package is seated on the seating plate 410, the 3D vision camera 510. And the seating plate 410 moves at a low speed, and because the moving distance is very small, vibration is hardly issued.

However, in the offload region 600, since the number of semiconductor packages that can be processed at one time by the operation of the offload picker 620 is limited, the offload picker 620 may move to the left and right and / or up and down at a very high speed. The semiconductor packages that pass the test for a certain distance and pass and the semiconductor packages that do not pass must be classified and loaded. Thus, the off-road picker 620 moves at a very high speed, and because the moving distance is long, the vibration level generated by the off-road picker 620 is very high.

Such a high level of vibration may be transmitted to the vision inspection region 500, which makes 3D vision inspection not easy in the vision inspection region 500. Therefore, there is a need to structurally block the vibration transmission mechanism in order to minimize such vibration transmission.

In detail, each of the base frames constituting the vision inspection region 500 and the offload region 600 may be structurally disconnected from each other and independent of each other.

For example, the base frame 501 forming the vision inspection region 500 may be provided separately from the base frame 601 forming the offload region 600. And these base frames are preferably supported independently of each other with respect to the ground. Therefore, it is possible to minimize the vibration generated in the offload region 600 to be transmitted to the vision inspection region 500. As a result, the 3D vision inspection may be performed in the vision inspection region 500.

Here, in the vision inspection area 500, it is also possible to perform general 2D inspection as well as 3D vision inspection.

For example, 3D vision inspection may be performed first and 2D inspection may be performed, and these inspections may be distinguished from each other.

Specifically, 3D vision inspection may be performed on one surface of the semiconductor package, and then vision inspection may be performed on the other surface of the semiconductor package. The latter test can be a 2D test.

A plurality of solder balls may be formed on one surface of the semiconductor package, and it is preferable to perform 3D vision inspection due to the three-dimensional shape of the solder balls. However, on the other side of the semiconductor package, information such as a manufacturer or a product name is marked, and inspection of such marking is sufficient for 2D vision inspection.

Here, the 3D vision inspection is greatly affected by the vibration, but the 2D vision inspection is relatively unaffected by the vibration. Therefore, it is preferable that the classification step described below when the 3D vision inspection step and the 2D vision inspection step are performed is controlled relatively differently.

The semiconductor packages 20 in which the inspection is completed in the vision inspection region 500 are transferred to the offload region 600 through the transfer means 420 described above. The transfer means 420 may be referred to as a package picker 520 for convenience because it transfers a plurality of packages at one time. Like the off-load picker 620, the package picker 520 also vibrates because the semiconductor packages 20 that have been inspected are transferred to the off-load area 600 while reciprocating a predetermined distance to the left and right and / or up and down. Can be another factor. Therefore, the package picker 520 is preferably provided in the offload region 600.

On the other hand, the manufacturing apparatus is controlled to be interlocked with each other, one process must be continued in sequence to the next process. Accordingly, the vision inspection region 500 and the offload region 600 are preferably separated from each other in basic structure, but are preferably connected to each other through additional components.

Specifically, it is preferable that the vision inspection region 500 and the offload region 600 are connected to each other through communication, electricity, control or power transmission means. Here, the power transmission means includes a piping line for transmitting pneumatic or hydraulic pressure.

Therefore, it is preferable that the vision inspection area 500 and the off-road area 600 have structures for fixing and buffering each area with respect to the ground independently of each other. In other words, it is preferable that the structures in which both regions are spatially separated from each other and each support and buffer each of them are independent of each other.

Meanwhile, the semiconductor manufacturing apparatus according to the present exemplary embodiment includes a cutting area 200 for cutting the semiconductor material 10 into individual semiconductor packages 20, and a cleaning area for washing the semiconductor package 20 cut in the cutting areas. 300 and a drying area 400 for drying the semiconductor package 20 washed in the cleaning area.

Accordingly, according to the present embodiment, it is possible to provide a semiconductor manufacturing apparatus in which classification of semiconductor packages proceeds sequentially according to cutting, washing, drying, vision inspection, and vision inspection results of semiconductor materials.

In addition, the manufacturing apparatus according to the present embodiment may include an on-load region 100 for accommodating a plurality of semiconductor materials. The semiconductor materials 10 accommodated in the on-load region 100 are sequentially supplied to the cutting region 200 and processed.

In this case, the on-load region 100 may also include the base frame 101, and the above-described cutting region may likewise include a separate base frame. Here, the base frame forming the cut region may be formed separately from the base frame 501 forming the vision inspection region. However, as shown in FIG. 1, the cutting area 200, the washing area 300, the drying area 400, and the vision inspection area 500 may be provided in one base frame 501.

As described above, when the base frames are provided independently of each other, their supporting structures, and the cushioning or dustproof structures, may be provided independently of each other.

In addition to these structural vibration dampening features, a methodological approach to vibration dampening is also possible.

In the manufacturing apparatus according to the present embodiment, the operation in each of the above-described areas must be controlled, and the operations in the other areas must be linked with each other. This is because these operations must proceed sequentially. In order to control the operation in each of these areas, and the interlock with the operation in the other areas, the manufacturing apparatus preferably includes a control unit 1 (see Fig. 2).

The control unit controls an operation of generating a troubled vibration at a time when the vibration becomes a problem. In other words, control is performed to mitigate or suppress the level of vibration generated.

More specifically, the control unit preferably controls the operation speed or operation in the off-road region 600 according to whether or not the inspection operation in the vision inspection region 500. Specifically, it is preferable to control the operation speed or operation in the offload region 600 according to the inspection step performed in the vision inspection region.

Objects with mass generate large vibrations as their moving speed increases. Therefore, it is possible to suppress or reduce vibration by reducing the moving speed of the object or stopping it at all.

Based on this principle, when the inspection is performed in the vision inspection region 500, the controller may slow down the operation speed or stop the operation of the offload region 600. Specifically, it is preferable to slow down or stop the operation of the offload picker 620 in the offload region 600.

Hereinafter, a manufacturing process of a semiconductor package that can be applied to the present embodiment will be briefly described with reference to FIG. 1.

The plurality of semiconductor materials 10 loaded in the on-load area 100 are sequentially transferred to the chuck table 210 through the strip picker 140. The chuck table 210 may be provided to enable forward and backward movement and rotational movement in the cutting region 200. Therefore, the semiconductor material 10 placed on the chuck table 210 through this movement is produced by a separate semiconductor package through the horizontal cutting and vertical cutting. Of course, such cutting may be performed via a cutting device or sawing device 230.

Here, the chuck table 210 shown in FIG. 1 may be seated on the base 220. The chuck table 210 is moved and rotated by the back and forth movement and rotation of the base 220. Through the movement and rotation of the base 220, it can be said that the semiconductor material 10 seated on the chuck table 210 moves and rotates.

The positions of the chuck table 210 and the base 220 shown in FIG. 1 may be referred to as initial positions, and may be referred to as replacement positions at which the chuck table 210 may be replaced.

Meanwhile, the semiconductor packages 20 that have been cut are transferred to the cleaning area 300 through the package picker 240. Then, the cleaned semiconductor packages 20 are transferred to the drying area 400 again. In this case, the semiconductor packages 20 may be transferred from the cleaning area to the drying area through the package picker 240.

The semiconductor packages are dried in the drying area 400, and when the drying is completed, the semiconductor packages are transferred to the vision inspection area 500.

The semiconductor packages that have been inspected in the vision inspection region 500 are transferred to the offload region 600 through the package picker 520, and then classified according to the inspection results through the offload picker 620.

Therefore, individual semiconductor packages that have been inspected in the semiconductor material through the above-described manufacturing steps may be sequentially manufactured. In addition, since the 3D vision inspection can be performed, a separate inspection apparatus or an inspection step can be omitted, thereby significantly reducing the cost and time required to manufacture the semiconductor package as a whole.

In the above, a semiconductor manufacturing apparatus and a manufacturing process which can be applied to the present invention have been described in detail. Specifically, a semiconductor manufacturing apparatus and a manufacturing process have been described in which various processes can be implemented in one apparatus, from specific semiconductor materials to cutting, cleaning, drying, inspection, and sorting.

Here, in order to perform a process for processing another type of semiconductor material in the manufacturing apparatus, it may be necessary to replace a conversion kit. Here, the conversion kit may be referred to as a configuration that can be replaced according to the semiconductor material processed in the semiconductor manufacturing apparatus. In one example, the conversion kit may be a chuck table 210.

In the semiconductor manufacturing apparatus, the general information needs to be set again to perform various processes for a new kind or a new type of semiconductor material. That is, according to which semiconductor material is processed, various information including control variables or parameters to be changed in the semiconductor manufacturing apparatus is inevitably different.

Therefore, in the related art, it is necessary to replace the conversion kit as the semiconductor material changes, and to modify or change various general information according to the semiconductor material.

For example, as semiconductor materials vary, the following information needs to be changed.

Arrangement information of the semiconductor material, for example, matrix information of the semiconductor package, may be changed. Various dimensions of the semiconductor package may be changed, and information about the cutting line order for cutting in the cutting device may be changed.

Cutting order information may be changed according to the type of semiconductor material, and information such as blade speed and motor may be changed during cutting.

The position and coordinate information of the transfer device for transferring the semiconductor material or the semiconductor package may be changed. And the control pressure of the pneumatic supply device for adsorbing the semiconductor material or the semiconductor package can be changed.

In addition, the alignment information or the alignment method of the semiconductor material or the semiconductor package may be changed, the information on the criteria for determining defects in the vision inspection may be changed, and the burr may be present in the material after cutting. The vision image information may be changed to check.

In addition, the information about the operating scenario of the cleaning device or the drying device may be changed.

For this reason, in the conventional semiconductor manufacturing apparatus, a lot of time is required for setting work and input required every time a new material is replaced, and thus there is a problem in that the semiconductor manufacturing apparatus cannot be efficiently used.

Therefore, as the raw materials to be processed vary, a lot of information has to be changed or modified in order to operate or operate the manufacturing apparatus, and it is necessary to provide a new type of setting operation for easily inputting such a lot of information.

The information includes matrix information, dimensional information, cutting line sequence, cutting speed, blade information, alignment information, pneumatic information, motor conquest, cleaning scenario, cleaning information, post-cut burr check, bad existence, vision image information, etc. of semiconductor materials. It can include a variety of information. Of course, the information is not limited thereto, and may include information for driving at least one or more of a cutting device, a transfer device, an inspection device, a cleaning device, and a pneumatic supply device throughout the semiconductor manufacturing process.

1 illustrates a chuck table 210 as an example of a conversion kit, and a memory unit 212 is provided in the chuck table 210.

As described above, the conversion kit is provided so as to be replaced according to the semiconductor material to be processed. Such replacement is preferably performed at the replacement position shown in FIG. 1.

It is preferable that the memory unit 212 has various information that varies depending on the semiconductor material. The semiconductor manufacturing apparatus performs various processes for manufacturing a semiconductor package by cutting a semiconductor material. Accordingly, in order to perform such various processes, a memory unit 212 having various information depending on the semiconductor material to be cut may be provided.

In addition, it is preferable that the semiconductor manufacturing apparatus performs the above-described process based on such general information.

Of course, the memory unit 212 may have all the information for controlling the semiconductor manufacturing apparatus according to the change in the semiconductor material, and may selectively have specific information necessary for the operation among all the information. However, on the one hand, it can have only basic information. Based on this basic information, all the information for controlling the actual manufacturing apparatus may be set. In addition, the actual information for controlling the operation of the manufacturing apparatus may be set by being processed or modified based on the general information of the memory unit 212.

Here, the memory unit 212 may be provided in the conversion kit 210 so that the conversion kit and the memory unit may be replaced together. Therefore, if the semiconductor material is changed, the memory unit can be replaced together with the conversion kit. This means that the general information which is the basis for performing the general process can be replaced together. In addition, it means that the changed general information can be used as it is. As a result, the user does not need to change or input the changed general information.

Specifically, the semiconductor manufacturing apparatus may include an information processor 7. The information processing unit 7 may be provided to process general information stored in the memory unit 212. That is, the information processing unit 7 may be provided to read the general information stored in the memory unit 212. In addition, if necessary, the information processing unit 7 may be provided to read and write the general information.

To this end, the information processing unit 7 may be connected to the memory unit 212 by wire or wirelessly. For this purpose, the information processing unit 7 is preferably provided at an appropriate position.

As described above, the conversion kit may include a chuck table 210, and the chuck table 210 may be fixedly coupled to the base 210 or the turntable in the cutting region 200. The chuck table 210 may be replaced at an initial position or a replacement position as shown in FIG. 1. Therefore, the information processing unit 7 may be provided near the replacement position of the chuck table 210 in the cutting area 200. Of course, it will be possible to be provided in the base 210.

In the above, in the case where the semiconductor material is changed by replacing the conversion kit, the feature that can operate the semiconductor manufacturing apparatus very efficiently by omitting the steps necessary for initialization has been described. In addition, it was described that this effect can be obtained by providing a memory unit in the conversion kit.

However, not only such initialization but also the process for one semiconductor material is terminated and the process for the next semiconductor material is performed, the remarkable effect can be obtained through the above-described embodiments.

This is because in the conventional semiconductor manufacturing apparatus, in the same conversion kit, the intermediate setting operation identical or similar to the above-described initial setting operation has to be repeated before the process is started after the next semiconductor material is placed. That is, there is a problem in that various information such as cutting information, cleaning information, and vision information must be repeatedly input.

Therefore, not only the initial setting work but also a lot of time and effort were required for the intermediate setting work required whenever a new semiconductor material was supplied.

However, according to the embodiment of the present invention, the conversion kit is provided with a memory unit, so that the intermediate setting operation can be omitted by only one input of the general information. Of course, such an initial setting operation may also be performed quickly and accurately since it is a computerized operation through the memory unit 212 rather than a manual input by a user.

Therefore, not only the initial setting work required for the replacement of the conversion kit but also the setting work for processing subsequent semiconductor materials can be omitted so that the semiconductor manufacturing apparatus can be operated very efficiently as a whole.

Hereinafter, the memory section 212 and the information processing section 7 will be described in detail for the processing of the overall information.

First, the processing of various information by radio will be described.

Radio frequency identification (RFID) may be used for processing general information. That is, the memory unit 212 may include an IC chip. This may be referred to as an 'RFID tag' or 'electronic tag'. Therefore, it is possible to store all the information in the IC chip.

In addition, the information processing unit 7 may include an RF reader to read the information of the 'electronic tag'. Therefore, since new general information can be read through the information processing unit 7 together with the new conversion kit 210, the necessity of inputting new general information individually can be significantly reduced.

Meanwhile, the RFID may be used to store new information as well as reading general information through the information processing unit 7. For example, when performing a cutting operation based on the above information, if an error (problem) of unknown cause occurs repeatedly in a certain section, or there is a better cutting sequence (method, sequence, speed, etc.) This information may be reflected to perform a correction. In this case, the memory unit 212 may include an active type IC chip rather than a passive type.

Therefore, it is possible to easily process all the information wirelessly using RFID.

In addition, general information may be processed using near field communication (NFC). Similarly, the 'NFC tag' or 'wireless tag' of the memory unit 212 may be read and written by the information processing unit 7. To this end, the memory unit 212 and the information processing unit 7 preferably comprises a terminal capable of wireless communication using NFC, respectively.

By using the above-described RFID and NFC, the memory unit 212 can process various information effectively in a short distance without directly contacting the information processing unit 7.

For example, the information processing unit 7 may be positioned in the cutting area 200 where the chuck table 210 is provided to implement effective information processing between the two.

On the other hand, it may be possible to process such various information by wire. That is, the information processor 7 may be provided on the base 220 on which the chuck table 210 is seated. The information processor 7 may be provided with a port to which the memory unit 212 provided in the chuck table 210 may contact. That is, the chuck table 210 may be seated on the base 220 and the memory unit 212 may be connected to the information processing unit 7 by wire through the port.

Through such a connection, various information stored in the memory unit 212 can be used.

Hereinafter, a semiconductor manufacturing apparatus according to an exemplary embodiment of the present invention, which may easily implement a user interface, will be described in detail with reference to FIG. 2.

First, when the chuck table 210 is replaced, a screen 2 for inputting general information may be provided, for example, the screen may be a touch screen. Accordingly, a desired operation can be performed by touching or clicking an icon or menu on the screen.

However, according to the exemplary embodiment of the present invention, various information stored in the memory unit 212 included in the chuck table 210 may be obtained through the information processing unit 7. The general information obtained through the information processor 7 may be displayed on the screen 2.

Of course, the control unit 1 may control to display the overall information obtained through the information processing unit 7 on the screen 2.

The controller 1 may basically control the semiconductor manufacturing apparatus to perform various processes based on the obtained general information.

Specifically, the controller 1 may control the operation of the cutting device 3 for the semiconductor material cutting process. The controller 1 may control the operation of the washing apparatus 8 or the drying apparatus 9 for the washing process or the drying process. The controller 1 may control the operation of the inspection apparatus 5 for the vision inspection process. Of course, the controller 1 may control the operation of the transfer device 4 or the pneumatic supply device 6 for transferring the semiconductor material or the semiconductor package for performing each process.

The controller 1 may control to display the parameters for controlling the respective devices on the screen 2 while performing the processes. In addition, various parameters displayed on the screen 2 may be changed or modified. In this case, the controller 1 may store various parameters modified or modified. By changing or modifying these parameters, it will be possible to modify and store the current general information.

Hereinafter, a control method according to an exemplary embodiment of the present invention will be described in detail with reference to FIG. 3.

The conversion kit may be replaced to process the new semiconductor material (S1). Due to the replacement of the conversion kit, various information for processing a new semiconductor material may be obtained (S2). Various processes may be performed based on the obtained general information (S5). Here, the general processes may include cutting, washing, drying and inspection processes. The control unit 1 controls the operation of various devices to perform these processes.

Meanwhile, the general information provided through the memory unit 212 of the conversion kit may be basic information or primary information about the semiconductor material. Therefore, actual general information needs to be set in order to control the operation of the actual manufacturing apparatus. For example, secondary information that can be processed or modified through basic information or primary information can be set.

For example, the memory unit 212 may include the arrangement information of the semiconductor package and the cutting order for cutting lines, cutting interval information, cutting line order, cutting speed, blade information, alignment information, pneumatic information, motor information, Various information may be stored which may include various information such as cleaning scenarios, cleaning information, post-cut burr check, defect status, vision image information, and the like. Through this general information, the actual general information may set information regarding an operation scenario of the chuck table for performing such a cutting process. That is, a scenario may be set in which order the movements will be given, and the movement displacements to what extent.

Therefore, it is preferable to set the actual general information (S3) after obtaining the general information (S2) through the memory unit 212. In addition, it is preferable that the overall process is performed according to the actual general information (S5).

When the actual general information is set, the set general information is preferably displayed on the screen 2 (S4). Therefore, the user can easily grasp the specific scenario of the overall process through the information displayed through the screen (2). In addition, the set general information may be stored and then various processes are performed.

The user can grasp the current general information through the screen (2). In addition, it is possible to understand how the manufacturing apparatus is controlled and operated. Therefore, it can be seen that the overall processes to be actually performed and the overall processes for controlling them are not optimally matched. In this case, it may be desirable to change the general information. For example, it may be a desirable situation for the information about the cutting order to be changed.

As shown in FIG. 1, cutting may be simultaneously performed through two cutting devices. The two cutting devices have a limited distance that can be physically close to each other. However, the cutting order can be arranged so that lines that cannot be cut at the same time are cut simultaneously through two cutting devices. In this case, the user may change information related to the cutting order displayed on the screen and store the changed information (S6).

Therefore, the controller 1 can then control the operation of the manufacturing apparatus according to the changed actual general information. In addition, the controller may store the changed information in the memory unit 212 (S7).

After such changes and storage, the changed general information can be used as it is for the same semiconductor material. This is because the changed information can be provided to another manufacturing apparatus.

For example, ten manufacturing apparatuses can be processed simultaneously with the same semiconductor material. At this time, the information changed in the first manufacturing apparatus can be obtained and provided to another manufacturing apparatus. Thus, it is very convenient.

Here, the memory unit 212 may be detachably provided in the conversion kit. Accordingly, it may be very easy to separate any one memory unit 212 having changed general information and provide the information to another manufacturing apparatus.

Such change and storage of the general information may be easily performed by clicking an icon or a menu displayed on the screen 2.

Meanwhile, in order to process a new kind of semiconductor manufacturing apparatus, it may be necessary to replace the conversion kit. The user can generate a conversion kit replacement signal by clicking an icon or menu displayed on the screen 2 (S8). Based on this signal, the control unit 1 may move the conversion kit to the replacement position (S9). The replacement position may be a position where the memory unit and the information processing unit 7 for processing the general information are located. Therefore, the current general information at the replacement position may be stored in the memory unit (S10).

Therefore, various information that is optimally modified as the same semiconductor material is processed from the initial general information can be continuously managed. That is, it is very convenient because there is no need to input or change the overall information.

3 and 4 show examples of the chuck table according to an embodiment of the present invention.

As shown, the chuck tables 210 and 211 may be formed in various shapes such as rectangular, square and circular. The chuck tables 210 and 211 may include chuck table frames 210a and 211a. The chuck table frame may be made of a metal material and manufactured to have required rigidity.

The chuck tables 210 and 211 may be mounted on the turntable or chuck table frame shown in FIG. 1.

The suction pads 210b and 211b are provided inside the chuck table frame 210a 211a. A semiconductor material and a semiconductor package are adsorb | sucked on the said adsorption pad. At this time, the vacuum forming or vacuum releasing operation may be performed by using the pneumatic supply device 6, through which the semiconductor package may be adsorbed and desorbed.

According to an embodiment of the present invention, the memory unit 212 may be located in the chuck table frames 210a and 211a of the chuck tables 210 and 211. Specifically, it can provide in a corner part. This is because the chuck table can be rotated or moved back and forth in the horizontal state after being placed in the horizontal state. Therefore, when the memory unit 212 is located at the corners of the chuck table frames 210a and 211a, the access to the information processing unit 7 becomes very easy. Of course, even when the information processing unit 7 is fixed, the information processing unit 7 can be easily moved by moving the chuck table in a horizontal state.

The memory unit 212 may be integrally formed with the chuck table frames 210a and 211a in a molding process of forming the suction pad. Of course, grooves may be separately formed at edge portions of the chuck table frames 210a and 211a, and the memory unit 212 may be detachably mounted in the grooves.

According to the embodiments described above, even when the semiconductor material is changed or replaced, since it is possible to easily and quickly load all the data necessary for the operation from the memory unit and store it in the control unit, mounting the memory unit on the kit of the chuck table. No other work is required. As a result, the semiconductor manufacturing apparatus can be efficiently used, and accidents caused by incorrectly inputting material information can be prevented in advance, so that user convenience can be remarkably improved.

1 control unit 8 information processing unit
200: cutting area 210, 211: conversion kit (chuck table)
211a: chuck table base 211b: suction pad
212: memory

Claims (17)

In the semiconductor manufacturing apparatus for performing a general process for cutting a semiconductor material to manufacture a semiconductor package,
A memory unit having various information depending on the semiconductor material to be cut to perform the various processes;
A conversion kit provided to be replaced according to the semiconductor material; And
It includes a control unit to perform the various processes based on the various information,
And the memory unit is provided in the conversion kit. The method according to claim 1,
And an information processing unit for processing general information of the memory unit, wherein the memory unit and the information processing unit are wirelessly connected. 3. The method of claim 2,
The memory unit includes an RFID tag or an NFC tag, and the information processing unit comprises a terminal for reading or reading and writing information of the tag. The method according to claim 1,
And the general information includes information for driving at least one of a cutting device, a transfer device, an inspection device, a cleaning device, and a pneumatic supply device. 5. The method of claim 4,
The general information includes matrix information, dimension information, cutting line order, cutting speed, blade information, alignment information, pneumatic information, motor information, cleaning scenario, cleaning information, and vision image information for reading burrs and defects of semiconductor materials. Semiconductor manufacturing apparatus comprising at least one of them. 6. The method according to any one of claims 1 to 5,
And the conversion kit includes a chuck table on which the semiconductor material is seated and cut. The method according to claim 6,
And the memory unit is detachably provided at the chuck table. The method according to claim 1,
The conversion kit includes a chuck table fixed to the chuck table base, wherein the chuck table base is provided with a port for connecting to the memory unit. The method according to claim 1,
And the control unit sets actual general information based on the general information, and performs the general process according to the set general information. The method of claim 9,
And a screen displaying the set general information. 11. The method of claim 10,
According to the replacement input of the conversion kit through the screen, the control unit reads or reads and writes the general information so that the replaced general information is stored in the memory unit and the general information of the memory unit can be processed. Semiconductor manufacturing apparatus further comprises an information processing unit for. In the control method of a semiconductor manufacturing apparatus for performing a general process for cutting a semiconductor material to manufacture a semiconductor package,
Acquiring various information depending on the semiconductor material to be cut through a memory unit included in a conversion kit replaceably provided according to the semiconductor material; And
And performing the various processes based on the obtained general information. 13. The method of claim 12,
And setting actual general information for performing the general process based on the obtained general information, wherein the general process is performed according to the set actual general information. Way. 14. The method of claim 13,
And after the setting of the general information, writing current general information to the memory unit. 13. The method of claim 12,
And determining whether to replace the conversion kit, and when the replacement of the conversion kit is confirmed, the general information obtaining step is performed. 14. The method of claim 13,
Displaying the set general information;
Changing general information set through the display; And
And storing the changed general information. 17. The method of claim 16,
And recording the changed and stored general information into the memory unit.

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