KR102636291B1 - Apparatus and method for tray recognition using reference point - Google Patents

Abstract

A tray recognition device and method using a reference point are disclosed, and the tray recognition method using a reference point according to an embodiment of the present application includes obtaining an inspection image taken on a tray forming a plurality of receiving spaces in which a semiconductor package is seated. It may include a step of identifying a plurality of reference points preset for the tray in the inspection image, and deriving actual measurement specification information of the tray using displacement information between the identified plurality of reference points.

Description

Tray recognition device and method using reference point {APPARATUS AND METHOD FOR TRAY RECOGNITION USING REFERENCE POINT}

This application relates to a tray recognition device and method using a reference point.

The package manufacturing system includes a cutting process of cutting strips on which a plurality of packages are formed into individual packages, a washing process of washing the packages cut in the cutting process, a drying process of drying the packages washed in the washing process, and defects in the dried packages. Semiconductor packages can be manufactured by sequentially performing a package inspection process to check for defects and an offload process to classify packages that passed the defect inspection and those that did not, depending on the inspection results.

However, in the conventional package manufacturing system, individual modules that perform the above essential processes are located sporadically, resulting in inefficiencies in the worker's work flow, reduced work throughput, and problems such as constant occurrence of work errors. Therefore, there is a need to develop a new package manufacturing system and singulation system to secure improved work efficiency while minimizing the work error rate.

In particular, there is a need for the development of monitoring and optimization techniques that can determine the actual size of the tray on which the semiconductor package is placed so that the picker module that loads the package on the tray can be controlled more precisely.

The technology behind this application is disclosed in Korean Patent Publication No. 10-2185074.

The purpose of the present application is to solve the problems of the prior art described above, and to provide a tray recognition device and method using a reference point that can accurately determine the actual measurement specifications of the tray on which the semiconductor package is mounted.

However, the technical challenges sought to be achieved by the embodiments of the present application are not limited to the technical challenges described above, and other technical challenges may exist.

As a technical means for achieving the above-described technical problem, the tray recognition method using a reference point according to an embodiment of the present application is to obtain an inspection image taken on a tray forming a plurality of receiving spaces in which a semiconductor package is seated. It may include a step of identifying a plurality of reference points preset for the tray in the inspection image, and deriving actual measurement specification information of the tray using displacement information between the identified plurality of reference points.

Additionally, the inspection image may be captured with a predetermined structure inserted into a preset target accommodating space among the plurality of accommodating spaces.

Additionally, the step of identifying the plurality of reference points may identify the reference points within a target area, which is an area corresponding to the structure in the inspection image.

Additionally, the plurality of accommodating spaces may be formed in a lattice structure with a plurality of rows and a plurality of columns spaced apart from each other.

Additionally, the target accommodation space may be set to include three or more accommodation spaces corresponding to corner areas of the grid structure among the plurality of accommodation spaces.

Additionally, the tray recognition method using a reference point according to an embodiment of the present application may include obtaining tray shape information including the number of the plurality of rows and the number of the plurality of columns.

In addition, the step of deriving the actual measurement standard information includes first actual measurement pitch information corresponding to a longitudinal interval between the plurality of receiving spaces and the plurality of receiving spaces using the tray shape information and the displacement information. Second actual pitch information corresponding to the width direction spacing can be calculated.

In addition, the tray recognition method using a reference point according to an embodiment of the present application includes first manufacturing pitch information corresponding to the longitudinal spacing applied when manufacturing the tray and second manufacturing pitch information corresponding to the widthwise spacing. It may include obtaining production standard information and calculating a deviation between the first production pitch information and the first actual measured pitch information and a deviation between the second production pitch information and the second actual measured pitch information.

In addition, the tray recognition method using a reference point according to an embodiment of the present application includes the step of using the actual measurement standard information to generate control information associated with a picker module for seating the semiconductor package in each of the plurality of receiving spaces. It can be included.

In addition, the structure includes a plate-shaped first member having a small cross-sectional area compared to the cross-sectional area of each of the plurality of accommodation spaces, and a plate-shaped member disposed at the center of the upper surface of the first member and having a small cross-sectional area compared to the first member. It may include two members.

Additionally, the shapes of the outer surface of the first member and the outer surface of the second member may be distinguished from each other.

Meanwhile, a tray recognition device using a reference point according to an embodiment of the present application includes a collection unit that acquires an inspection image taken on a tray forming a plurality of receiving spaces on which a semiconductor package is seated, and a collection unit that acquires an inspection image taken from the inspection image to the tray. It may include a reference point recognition unit that identifies a plurality of preset reference points and a standard analysis unit that derives actual measurement standard information of the tray using displacement information between the identified plurality of reference points.

Additionally, the reference point recognition unit may identify the reference point within a target area, which is an area corresponding to the structure, in the inspection image.

Additionally, the collection unit may obtain tray shape information including the number of rows and the number of columns.

In addition, the standard analysis unit uses the tray shape information and the displacement information to determine first actual pitch information corresponding to the longitudinal spacing between the plurality of accommodating spaces and the widthwise spacing between the plurality of accommodating spaces. Second actual pitch information can be calculated.

The above-described means of solving the problem are merely illustrative and should not be construed as intended to limit the present application. In addition to the exemplary embodiments described above, additional embodiments may be present in the drawings and detailed description of the invention.

According to the means for solving the problem of the present application described above, it is possible to provide a tray recognition device and method using a reference point that can accurately determine the actual measurement specifications of the tray on which the semiconductor package is mounted.

However, the effects that can be obtained herein are not limited to the effects described above, and other effects may exist.

1 is a schematic conceptual plan view of a package cutting and sorting system according to an embodiment of the present application.
Figure 2 is a block diagram for explaining the schematic operation flow of a package cutting and sorting system according to an embodiment of the present application.
Figure 3 is a perspective view showing a tray transport module and a guide module of a package cutting and sorting system according to an embodiment of the present application.
Figure 4 is a conceptual diagram to explain the tray recognition process using a reference point.
Figure 5 is a schematic perspective view of a structure inserted into the receiving space of the tray.
Figure 6 is a schematic configuration diagram of a tray recognition device using a reference point according to an embodiment of the present application.
Figure 7 is an operation flowchart of a tray recognition method using a reference point according to an embodiment of the present application.

Below, with reference to the attached drawings, embodiments of the present application will be described in detail so that those skilled in the art can easily implement them. However, the present application may be implemented in various different forms and is not limited to the embodiments described herein. In order to clearly explain the present application in the drawings, parts that are not related to the description are omitted, and similar reference numerals are assigned to similar parts throughout the specification.

Throughout this specification, when a part is said to be “connected” to another part, this means not only “directly connected” but also “electrically connected” or “indirectly connected” with another element in between. "Includes cases where it is.

Throughout this specification, when a member is said to be located “on”, “above”, “at the top”, “below”, “at the bottom”, or “at the bottom” of another member, this means that a member is located on another member. This includes not only cases where they are in contact, but also cases where another member exists between two members.

Throughout the specification of the present application, when a part "includes" a certain component, this means that it may further include other components rather than excluding other components unless specifically stated to the contrary.

This application relates to a tray recognition device and method using a reference point.

FIG. 1 is a schematic conceptual plan view of a package cutting and sorting system including a tray recognition device according to an embodiment of the present application, and FIG. 2 illustrates a schematic operational flow of the package cutting and sorting system according to an embodiment of the present application. This is a block diagram to do this.

Referring to Figures 1 and 2, the package cutting and sorting system 1000 (hereinafter referred to as 'this system 1000') according to an embodiment of the present application includes an input module 10 and a cutting module 20. , it may include a washing module 30, a drying module 40, a first picker module 50, a table 60, a second picker module 70, an inspection module 80, and a classification module 900. . Additionally, the system 1000 may be equipped with a tray recognition device 100.

First, the input module 10 of the system 1000 may be equipped to supply a semiconductor strip. Specifically, the magazine loaded with the semiconductor strip may be loaded on the magazine seating module 111 of the input module 10, and the magazine loaded on the magazine seating module 111 may be held by the magazine gripping module 112 and placed in the ready position. The semiconductor strip moved to and unloaded from the magazine moved to the preparation position may be transferred to the strip inspection module 113. Additionally, the semiconductor strip transferred to the strip inspection module 113 may be transferred to the chuck table 13 by the smart alignment unit 12 equipped with a strip picker (not shown). For reference, among the semiconductor strips introduced into the system 1000 by the input module 10, the recovery strip corresponding to the semiconductor strip judged to be defective or in need of additional processing before being transferred to the cutting module 20, which will be described later. Semiconductor strips that can be returned to the magazine seating module 111 and are not determined to be collection strips can be transferred to the cutting module 20 through the smart alignment unit 12.

Additionally, the system 1000 may include a cutting module 20 that cuts the semiconductor strip into a package. The semiconductor strip transferred to the chuck table 13 by the smart alignment unit 12 may be transferred to the cutting module 20 and cut (separated) into individual packages in the cutting module 20.

Additionally, the system 1000 may include a cleaning module 30 that cleans the cut package. That is, the package formed by cutting the semiconductor strip in the cutting module 20 can be transferred to the cleaning module 30 and cleaned.

Additionally, the system 1000 may include a drying module 40 that dries the cleaned package. The package washed in the cleaning module 30 may be transferred to the drying module 40 and dried.

Additionally, the system 1000 may include a table 60 on which the dried package is placed and a first picker module 50 that transfers the dried package from the drying module 40 to the table 60. The package dried in the drying module 40 may be transferred to the table 60 by the first picker module 50. For example, the first picker module 50 may be a grid picker.

Additionally, the second picker module 70 may be provided to grasp and transfer at least some of the plurality of packages seated on the table 60. In this regard, the table 60 on which a plurality of packages are placed is positioned between the position where the dried package is supplied from the first picker module 50 and the position where the second picker module 70 can hold the mounted package. It may be provided to enable reciprocating movement (for example, moving back and forth from the 12 o'clock direction to the 6 o'clock direction based on FIG. 1).

Additionally, the system 1000 may include an inspection module 80 that inspects whether the package is defective. The package can be transferred to the inspection module 80 to determine whether it is defective.

Additionally, the system 1000 may include a classification module 900 having a receiving space in which each of a plurality of packages is accommodated according to the inspection result by the inspection module 80.

In addition, in relation to this, the second picker module 70 may operate to transfer each of a plurality of packages to one of a plurality of receiving spaces separately formed in the classification module 900 according to the inspection result of the inspection module 80. .

For example, the classification module 900 includes a tray 91 that forms a receiving space for receiving each package classified as a normal (good) package or an abnormal (defective) package by the inspection module 80, and a reject It may include at least one of the bins 92.

For example, good packages may be loaded on some of the plurality of trays (91a, 91b, 91c), and packages classified as defective packages may be loaded on the remaining trays of the plurality of trays (91a, 91b, 91c). , It is not limited to this, and according to the operation method of the system 1000, good quality packages are transferred to the tray 91 and loaded, and defective packages are transferred to the reject bin 92, which will be described later, and are placed in the reject bin 92. ) An offloading method in which defective packages are divided and loaded into each of the plurality of receiving spaces formed in the package according to the determined defect type can also be applied.

Meanwhile, the tray transport module 920 on which the tray 91 on which package loading is completed is moved so that it can be loaded on the tray receiving module 930, and a new tray structure can be seated on the tray transport module 920.

According to this system 1000, since the package can be manufactured by one automated system, individual modules that perform the conventional manufacturing process are located sporadically, causing inefficiency in the worker's work flow or reducing work throughput. Compared to the package manufacturing system, where work errors consistently occur, the work error rate can be minimized and improved work efficiency can be secured.

The classification module 900 disclosed herein may be provided with a receiving space where each of a plurality of packages is accommodated according to the results of the inspection by the inspection module 80. In this regard, the second picker module 80 may transfer each of the plurality of packages held based on the inspection results by the inspection module 80 to the receiving space formed in the classification module 900.

Specifically, the inspection module 80 provides information on the presence or absence of defects that classifies each of the plurality of packages held by the second picker module 80 as a normal package or a defective package, and classification type information on the defect type of the package classified as a defective package. It can be derived as a test result.

In other words, the inspection module 80 not only performs an inspection to classify each package as a normal package or a defective package, but also provides a function to determine the defect type of the package classified as a defective package.

By way of example, the defect type information may include contamination, dimension (size) defect, ball attachment defect, etc., but is not limited thereto, and may be set to various types according to implementation examples of the present application, and disclosed herein The accommodating space provided in the classification module 900 may include a plurality of accommodating spaces according to defect presence information and classification type information for the detected defect.

Figure 3 is a perspective view showing a tray transport module and a guide module of a package cutting and sorting system according to an embodiment of the present application.

Referring to FIG. 3 , the classification module 900 may include a guide module 910, a tray transport module 920, a tray receiving module 930, and a tray gripping module 940. In this regard, the guide module 910, the tray transport module 920, the tray receiving module 930, and the tray gripping module 940 are subordinate parts of the classification module 900 involved in the package loading method using the tray structure 91. It may be a configuration.

The tray transport module 920 may be provided to transport the tray structure 91 on which a plurality of semiconductor packages are loaded.

In addition, in the description of the embodiment of the present application, the tray transport module 920 takes into account the number of tray structures 91 required to classify and load each of the plurality of semiconductor packages according to the inspection results for each of the plurality of semiconductor packages. A plurality of them may be provided. For example, as shown in FIG. 3, the tray transport module 920 may include three tray transport modules 920a, 920b, and 930c, but is not limited thereto.

The guide module 910 is a tray transport module 920 between the first area where the process of loading the semiconductor package on the tray 91 is performed and the second area where the supply or recovery process for the tray 91 is performed. It may be formed to extend between the first area and the second area to move back and forth.

In addition, each of the plurality of tray transport modules 920 may independently move back and forth between the first area and the second area through the guide module 910. For example, each of the three tray transport modules 920a, 920b, and 930c shown in FIG. 3 can independently move back and forth between the first and second areas. In other words, the first tray transport module 920a is not linked to the movement of the second tray transport module 920b and the third tray transport module 920c between the first and second areas, but is separately operated by the first tray transport module 920a. It may be provided to move back and forth between the area and the second area, and this can be equally applied to the second tray transport module 920b and the third tray transport module 920c.

For reference, according to the implementation example of the present application, the tray structure 91 may be referred to as 'tray 91'. In other words, in the description of the embodiments of the present application, reference numeral '91' may be used interchangeably for the tray structure 91 and the tray 91.

Additionally, in the description of the embodiments of the present application, the 'first area' may be referred to as a 'package load area', and the 'second area' may be referred to as a 'tray exchange area'.

Hereinafter, specific functions and operations of the tray recognition device 100 will be described with reference to FIG. 4.

Figure 4 is a conceptual diagram to explain the tray recognition process using a reference point.

Referring to FIG. 4 , the tray recognition device 100 may acquire an inspection image captured on a tray 91 forming a plurality of receiving spaces on which semiconductor packages are seated.

For example, when an empty tray 91 is transferred to the first area (package load area) along the guide module 910 by the above-described tray transport module 920, the empty tray 91 is placed on the upper side of the transferred empty tray 91. The placed camera module (not shown) may capture the top image of the tray 91 disposed below as an inspection image, and the captured inspection image may be transmitted (transmitted) to the tray recognition device 100.

In addition, as an example, a camera module (not shown) for capturing inspection images may be provided on the second picker module 70, which is provided to grip and transport at least a portion of the plurality of packages, but is not limited to this. That is not the case.

In addition, according to an embodiment of the present application, a process of capturing an inspection image for the tray 91 and deriving actual measurement specification information of the tray 91 of the tray recognition device 100 using the inspection image described in detail below The process may be repeatedly performed each time a new tray 91 (in other words, an empty tray 91 without a package loaded on it, etc.) is supplied to the first area (package load area).

In addition, the second picker module 70, which places the semiconductor package on the tray 91 newly supplied to the first area (package load area), considers the actual standard information identified by the tray recognition device 100. As a result, the loading of the package on the corresponding tray 91 can be carried out precisely so that the package can be seated with high accuracy in the correct position within the receiving space formed in the tray 91.

Meanwhile, the tray recognition device 100 may acquire an inspection image taken while the predetermined structure 1 is inserted into a preset target receiving space among the plurality of receiving spaces formed in the tray 91.

In relation to this, referring to FIG. 4, the plurality of receiving spaces formed in the tray 91 may be formed in a grid structure in which a plurality of rows and a plurality of columns are spaced apart from each other. For example, FIG. 4 may show an inspection image taken of a tray 91 designed in a grid structure consisting of 10 rows and 28 columns.

Additionally, referring to FIG. 4 , the target receiving space into which the structure 1 is inserted may be set to include three or more receiving spaces corresponding to corner areas of the lattice structure among the plurality of receiving spaces formed in the tray 91.

For example, based on what is shown in Figure 4, the upper right corner area is the first target receiving space, the lower right corner area is the second target receiving space, and the lower left corner area is the third target receiving space. Each space is set, and the first structure (1a) is inserted into the first target accommodating space, the second structure (1b) is inserted into the second target accommodating space, and the third structure is inserted into the third target accommodating space. An inspection image of the tray 91 may be captured while (1c) is inserted, but it is not limited to this.

In this regard, according to an embodiment of the present application, the tray recognition device 100 depends on whether the tray 91 and/or the structure 1 is identified in the image captured and transmitted by a camera module (not shown). The image can be selected as an inspection image for deriving actual tray measurement information, which will be described later. For example, when the tray 91 is identified in an image transmitted from a camera module (not shown) or the identified number of structures 1 is less than a preset threshold number (e.g., 3, etc.) , the image may not be selected as an inspection image.

Figure 5 is a schematic perspective view of a structure inserted into the receiving space of the tray.

Referring to FIG. 5, the structure 1, which is provided in a standard that can be inserted into the receiving space formed in the tray 91 so that the semiconductor package is seated therein, is a plate-shaped structure having a small cross-sectional area compared to the cross-sectional area of each of the plurality of receiving spaces. It may be provided as a stacked structure including a first member 101 and a plate-shaped second member 102 disposed at the center of the upper surface of the first member 101 and having a smaller cross-sectional area than the first member 101.

In addition, referring to FIG. 5, the structure 1 may be manufactured so that the outer surface of the first member 101 and the outer surface of the second member 102 have different shapes (e.g., color, illuminance, etc.). , This means that in the process of identifying a reference point within the target area, which is the area corresponding to the structure 1 in the inspection image, the local area where the second member 102, which is placed relatively inside, is photographed is the first member 101. One boundary area is clearly distinguished on the inspection image so that any light radiating from the lower side of the tray 91 passes through part of the receiving space formed in the tray 91 and affects the inspection image (for example, Even in cases where unexpected artifacts are formed in the inspection image, etc.), the target area for specifying the reference point may be clearly distinguished from the surrounding boundary area within the local area where the second member 102 is photographed. .

In addition, according to an embodiment of the present application, the tray recognition device 100 obtains tray shape information including the number of rows and the number of columns for the plurality of accommodation spaces of the tray 91 formed in a grid structure. can do.

In addition, according to an embodiment of the present application, the tray recognition device 100 includes first manufacturing pitch information corresponding to the longitudinal spacing applied when manufacturing the tray 91 and second manufacturing pitch information corresponding to the widthwise spacing. You can obtain production specification information.

More specifically, the first production pitch information is the tray ( 91) refers to the value applied (set) during production, and the second production pitch information is mutually based on the width direction of the tray 91 (from 12 o'clock to 6 o'clock based on the information shown in FIG. 4). This may mean a value applied (set) when manufacturing the tray 91 regarding the gap between two adjacent accommodation spaces.

Additionally, the tray recognition device 100 may identify a plurality of reference points preset for the tray 91 in the acquired inspection image. Specifically, the tray recognition device 100 may identify a reference point within the target area, which is the area corresponding to the structure 1 in the inspection image.

Additionally, according to an embodiment of the present application, the tray recognition device 100 may identify the location (coordinates) of a reference point within a local area corresponding to the second member 102 of the above-described structure 1. For example, the location (coordinates) of the reference point may mean the location (coordinates) of the center point of the second member 102, but is not limited thereto.

Additionally, the tray recognition device 100 may derive actual measurement standard information of the tray 91 using displacement information between a plurality of identified reference points.

Specifically, the tray recognition device 100 uses tray shape information and displacement information to provide first actual pitch information corresponding to the longitudinal spacing between the plurality of receiving spaces of the tray 91 and second actual pitch information corresponding to the widthwise spacing. Actual pitch information can be calculated.

For example, referring to FIG. 4, the tray recognition device 100 determines in advance the longitudinal displacement information (A in FIG. 4) corresponding to the displacement information between the structures 1 arranged at mutual intervals along the longitudinal direction. The first actual pitch information is calculated by dividing the tray shape information for the tray 91 by the number of rows, and similarly, longitudinal displacement information corresponding to the displacement information between the structures 1 arranged at mutual intervals along the width direction. The second actual pitch information can be calculated by dividing (B in FIG. 4) by the number of rows according to the tray shape information for the previously identified tray 91.

To be more specific, as shown in FIG. 4, in the case of the tray 91 in the form of 10 (b) can be calculated as the value of 'B/10'.

In addition, according to an embodiment of the present application, the tray recognition device 100 calculates the deviation between the first production pitch information previously known for the tray 91 and the first actual measured pitch information derived for the tray 91. You can. Correspondingly, the tray recognition device 100 may calculate the deviation between the second production pitch information previously known for the tray 91 and the second actual measured pitch information derived for the tray 91.

Additionally, the tray recognition device 100 may use the derived actual measurement standard information to generate control information associated with a picker module that places the semiconductor package in each of the plurality of receiving spaces. For example, the tray recognition device 100 has the second picker module 70 successively seat each package in the receiving space formed in the tray 91 according to the deviation between the first production pitch information and the first actual measured pitch information. In order to achieve this, the already applied setting value is adjusted with respect to the longitudinal movement range that must be moved, and similarly, the second picker module 70 selects each package in the tray 91 according to the deviation between the second production pitch information and the second actual measured pitch information. ) It is possible to adjust the already applied setting value regarding the width direction movement range that must be moved in order to continuously seat in the receiving space formed in ).

Figure 6 is a schematic configuration diagram of a tray recognition device using a reference point according to an embodiment of the present application.

Referring to FIG. 6 , the tray recognition device 100 may include a collection unit 110, a reference point recognition unit 120, and a standard analysis unit 130.

The collection unit 110 may acquire an inspection image captured on the tray 91 forming a plurality of receiving spaces on which the semiconductor package is seated.

Specifically, the collection unit 110 may acquire an inspection image taken while the predetermined structure 1 is inserted into a preset target receiving space among the plurality of receiving spaces formed in the tray 91.

In addition, according to an embodiment of the present application, the collection unit 110 acquires tray shape information including the number of rows and the number of columns for the plurality of accommodation spaces of the tray 91 formed in a grid structure. You can.

In addition, according to an embodiment of the present application, the collection unit 110 includes first manufacturing pitch information corresponding to the longitudinal spacing applied when manufacturing the tray 91 and second manufacturing pitch information corresponding to the widthwise spacing. You can obtain production specification information.

The reference point recognition unit 120 may identify a plurality of reference points preset for the tray 91 in the acquired inspection image.

Specifically, the reference point recognition unit 120 may identify a reference point within the target area, which is the area corresponding to the structure 1 in the inspection image.

The standard analysis unit 130 may derive actual standard information of the tray 91 using displacement information between a plurality of identified reference points.

Specifically, the standard analysis unit 130 uses the tray shape information and displacement information to determine first actual pitch information corresponding to the longitudinal spacing between the plurality of receiving spaces of the tray 91 and second actual pitch information corresponding to the widthwise spacing. Actual pitch information can be calculated.

In addition, according to an embodiment of the present application, the standard analysis unit 130 calculates the deviation between the first production pitch information determined in advance for the tray 91 and the first actual measured pitch information derived for the tray 91. You can. Correspondingly, the standard analysis unit 130 may calculate the deviation between the second production pitch information previously known for the tray 91 and the second actual measured pitch information derived for the tray 91.

In addition, the standard analysis unit 130 uses the derived actual measurement standard information to provide control information associated with a picker module (such as the second picker module 70 in FIG. 1) that places the semiconductor package in each of the plurality of receiving spaces. can be created.

Below, we will briefly look at the operation flow of the present application based on the details described above.

Figure 7 is an operation flowchart of a tray recognition method using a reference point according to an embodiment of the present application.

The tray recognition method using the reference point shown in FIG. 7 can be performed by the tray recognition device 100 described above. Therefore, even if the content is omitted below, the content described with respect to the tray recognition device 100 can be equally applied to the description of the tray recognition method using a reference point.

Referring to FIG. 7 , in step S11, the collection unit 110 may acquire an inspection image taken of the tray 91 forming a plurality of receiving spaces on which the semiconductor package is seated.

Specifically, in step S11, the collection unit 110 may acquire an inspection image taken while the predetermined structure 1 is inserted into a preset target receiving space among the plurality of receiving spaces formed in the tray 91.

In addition, according to an embodiment of the present application, in step S11, the collection unit 110 provides tray shape information including the number of rows and the number of columns for the plurality of receiving spaces of the tray 91 formed in a grid structure. can be obtained.

In addition, according to an embodiment of the present application, in step S11, the collection unit 110 provides first production pitch information corresponding to the longitudinal spacing applied when manufacturing the tray 91 and second manufacturing pitch information corresponding to the widthwise spacing. Production specification information including can be obtained.

Next, in step S12, the reference point recognition unit 120 may identify a plurality of reference points preset for the tray 91 in the acquired inspection image.

Specifically, in step S12, the reference point recognition unit 120 may identify a reference point within the target area, which is the area corresponding to the structure 1 in the inspection image.

Next, in step S13, the standard analysis unit 130 may derive actual measurement standard information of the tray 91 using displacement information between a plurality of identified reference points.

Specifically, in step S13, the standard analysis unit 130 uses the tray shape information and displacement information to determine first actual pitch information corresponding to the longitudinal spacing between the plurality of receiving spaces of the tray 91 and the widthwise spacing. Second actual pitch information can be calculated.

In addition, according to an embodiment of the present application, in step S13, the standard analysis unit 130 determines the difference between the first production pitch information previously identified for the tray 91 and the first actual measurement pitch information derived for the tray 91. can be calculated. Likewise, in step S13, the standard analysis unit 130 may calculate the deviation between the second production pitch information previously known for the tray 91 and the second actual measured pitch information derived for the tray 91.

Next, in step S14, the standard analysis unit 130 uses the actual measurement standard information derived through step S13 to install a picker module (second picker module 70 in FIG. 1, etc.) that places the semiconductor package in each of the plurality of receiving spaces. ) can generate control information linked to .

In the above description, steps S11 to S14 may be further divided into additional steps or combined into fewer steps, depending on the implementation of the present disclosure. Additionally, some steps may be omitted or the order between steps may be changed as needed.

The tray recognition method using a reference point according to an embodiment of the present application may be implemented in the form of program instructions that can be executed through various computer means and recorded on a computer-readable medium. The computer-readable medium may include program instructions, data files, data structures, etc., singly or in combination. Program instructions recorded on the medium may be those specifically designed and configured for the present invention, or may be known and usable by those skilled in the art of computer software. Examples of computer-readable recording media include magnetic media such as hard disks, floppy disks, and magnetic tapes, optical media such as CD-ROMs and DVDs, and magnetic media such as floptical disks. -Includes optical media (magneto-optical media) and hardware devices specifically configured to store and execute program instructions, such as ROM, RAM, flash memory, etc. Examples of program instructions include machine language code, such as that produced by a compiler, as well as high-level language code that can be executed by a computer using an interpreter, etc. The hardware devices described above may be configured to operate as one or more software modules to perform the operations of the present invention, and vice versa.

Additionally, the tray recognition method using the above-described reference point may also be implemented in the form of a computer program or application executed by a computer stored in a recording medium.

The description of the present application described above is for illustrative purposes, and those skilled in the art will understand that the present application can be easily modified into other specific forms without changing its technical idea or essential features. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive. For example, each component described as unitary may be implemented in a distributed manner, and similarly, components described as distributed may also be implemented in a combined form.

The scope of the present application is indicated by the claims described below rather than the detailed description above, and all changes or modified forms derived from the meaning and scope of the claims and their equivalent concepts should be construed as being included in the scope of the present application.

1000: Package cutting and sorting system
100: Tray recognition device using reference points
110: Collection department
120: Reference point recognition unit
130: Specification analysis unit
10: input module
11: Strip recovery unit
12: Smart alignment unit
20: cutting module
30: cleaning module
40: drying module
41: loading part
42: flip part
43: Air knife section
50: first picker module
60: table
70: Second picker module
80: Inspection module
90: Classification module
91: tray
92: Reject bin

Claims (11)

In the tray recognition method using a reference point,
Obtaining an inspection image taken on a tray forming a plurality of receiving spaces on which a semiconductor package is seated;
Identifying a plurality of reference points preset for the tray in the inspection image; and
Deriving actual measurement specification information of the tray using displacement information between the identified plurality of reference points,
Including,
The inspection image is,
Photographed with a predetermined structure inserted into a preset target receiving space among the plurality of receiving spaces,
The step of acquiring the inspection image is,
Obtaining a top image of the tray transported to a preset package loading area; and
Selecting the upper image as the inspection image based on whether the tray is identified and the number of identified structures in the upper image,
Including,
The step of identifying the plurality of reference points is,
Identifying the reference point within a target area, which is an area corresponding to the structure in the inspection image,
The tray recognition method is,
A recognition method that is repeatedly performed each time the tray in an empty state without the semiconductor package is supplied to the package load area. delete According to paragraph 1,
The plurality of accommodating spaces are each composed of a grid structure consisting of a plurality of rows and a plurality of columns at mutual intervals,
The target receiving space is,
A recognition method set to include three or more accommodation spaces corresponding to corner areas of the grid structure among the plurality of accommodation spaces. According to paragraph 3,
Obtaining tray shape information including the number of the plurality of rows and the number of the plurality of columns,
It further includes,
The step of deriving the actual measurement standard information is,
Using the tray shape information and the displacement information, first actual pitch information corresponding to the longitudinal spacing between the plurality of accommodating spaces and second actual measured pitch information corresponding to the widthwise spacing between the plurality of accommodating spaces are generated. A recognition method that calculates. According to clause 4,
Obtaining manufacturing standard information including first manufacturing pitch information corresponding to the longitudinal spacing and second manufacturing pitch information corresponding to the widthwise spacing applied when manufacturing the tray; and
calculating a deviation between the first production pitch information and the first actual measured pitch information and a deviation between the second production pitch information and the second actual measured pitch information;
A recognition method further comprising: According to paragraph 1,
Using the actual measurement standard information, generating control information associated with a picker module for seating the semiconductor package in each of the plurality of receiving spaces,
A recognition method further comprising: According to paragraph 1,
The structure is,
It includes a plate-shaped first member having a small cross-sectional area compared to the cross-sectional area of each of the plurality of accommodation spaces, and a plate-shaped second member disposed at the center of the upper surface of the first member and having a small cross-sectional area compared to the first member,
A recognition method, characterized in that the shapes of the outer surface of the first member and the outer surface of the second member are distinct from each other. In the tray recognition device using a reference point,
a collection unit that acquires inspection images taken on a tray forming a plurality of receiving spaces on which a semiconductor package is seated;
a reference point recognition unit that identifies a plurality of reference points preset for the tray in the inspection image; and
a standard analysis unit that derives actual measurement standard information of the tray using displacement information between the identified plurality of reference points;
Including,
The inspection image is,
Photographed with a predetermined structure inserted into a preset target receiving space among the plurality of receiving spaces,
The collection department,
Obtaining a top image of the tray transported to a preset package loading area, and selecting the top image as the inspection image based on whether the tray is identified in the top image and the number of identified structures,
The reference point recognition unit,
Identifying the reference point within a target area, which is an area corresponding to the structure in the inspection image,
The tray recognition device,
A recognition device that repeatedly performs the process of deriving the actual measurement standard information each time the tray in an empty state without the semiconductor package is supplied to the package load area. delete According to clause 8,
The plurality of accommodating spaces are each composed of a grid structure consisting of a plurality of rows and a plurality of columns at mutual intervals,
The target receiving space is,
A recognition device set to include three or more accommodating spaces corresponding to corner areas of the grid structure among the plurality of accommodating spaces. According to clause 10,
The collection department,
Obtaining tray shape information including the number of the plurality of rows and the number of the plurality of columns,
The standard analysis unit,
Using the tray shape information and the displacement information, first actual pitch information corresponding to the longitudinal spacing between the plurality of accommodating spaces and second actual measured pitch information corresponding to the widthwise spacing between the plurality of accommodating spaces are generated. A recognition device that produces results.

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